JPS6313355A - Package for ic - Google Patents
Package for icInfo
- Publication number
- JPS6313355A JPS6313355A JP61157238A JP15723886A JPS6313355A JP S6313355 A JPS6313355 A JP S6313355A JP 61157238 A JP61157238 A JP 61157238A JP 15723886 A JP15723886 A JP 15723886A JP S6313355 A JPS6313355 A JP S6313355A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- metal wire
- integrated circuit
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野Ｊ
本発明は集積回路素子を外部環境から保護するために樹
脂封止体内に封止した形態の樹脂封止型のＩＣパッケー
ジに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application J] The present invention relates to a resin-sealed IC package in which an integrated circuit element is sealed in a resin-sealed body to protect it from the external environment.
従来の樹脂封止タイプのＩＣパッケージは、集積回路素
子（ＩＣペレット）を−回だけ樹脂封止するか、または
、ＩＣペレットをカバーする程度にボリミイド等を塗布
（ボッティング）後、樹脂封止していた。Conventional resin-sealed type IC packages are made by sealing the integrated circuit element (IC pellet) with resin only once, or by applying volimide or the like (botting) to an extent that covers the IC pellet, and then sealing it with resin. Was.
〔発明が解決しようとする問題点Ｊ
上述した従来のＩＣパッケージは、樹脂が一種類である
為、温度サイクルに強い樹脂を選んだ場合は耐湿性が弱
くなシ、耐湿性に強い樹脂を選んだ場合は温度サイクル
に弱くなるという欠点を有していた。また、ペレット上
にポリイミド等のボッティングを行った後、樹脂封止す
ると耐湿性は良くなるが、温度サイクル性が悪化する欠
点を有していた。[Problem to be solved by the invention J] The conventional IC package described above uses only one type of resin, so if a resin that is resistant to temperature cycles is chosen, its moisture resistance is weak; However, it had the disadvantage of being susceptible to temperature cycles. Furthermore, if the pellets are botted with polyimide or the like and then sealed with resin, the moisture resistance improves, but there is a drawback that temperature cycleability deteriorates.
〔問題点を解決するための手段３
本発明Ｆｉ、、リードフレームのアイランドに搭載した
集積回路素子を耐温度サイクル性に優れた樹脂を使用し
て直接封止し、さらに、耐湿性に優れた樹脂を使用して
前記直接封止の樹脂の外側を封止し、耐温度サイクル性
と耐湿性に優れたＩＣ，’、＜ヅケージを実現する。な
お、上記２種類の樹脂の間に緩衝となる別の樹脂を使用
することもある。[Means for solving the problem 3 In the present invention, the integrated circuit element mounted on the island of the lead frame is directly sealed using a resin with excellent temperature cycle resistance, and furthermore, the integrated circuit element mounted on the island of the lead frame is sealed using a resin with excellent moisture resistance. A resin is used to seal the outside of the resin in the direct sealing, thereby realizing an IC with excellent temperature cycle resistance and moisture resistance. Note that another resin may be used as a buffer between the above two types of resins.
つぎに本発明を実施例によシ説明する。 Next, the present invention will be explained using examples.
第１図は本発明の一実施例の断面図である。図１ｃオイ
て、リードフレームのアイランド（素子搭載ｗ５）１に
ＩＣペレット３が搭載され、ペレット３の電極パッドと
リードフレームのリード２の内端部との間を金属細線４
が接続後、耐温度サイクル性に優れた内層樹脂、例えば
、ガラス状になる温度（ガラス転移点ンが１５５℃以下
で二、やわらかく耐温度サイクル性に極めて優れた特性
を備えた樹脂５を用い、搭載ペレット３を含むアイラン
ド１、および、接続の金属細線４ならひに金属細線の接
続部を含むリード３の内端部が共に封止されている。さ
らに、樹脂５の外側は、例えばガラス転移点が１６５℃
以上であって、耐湿性に浸れた外層樹脂６を用いて封止
されている。FIG. 1 is a sectional view of an embodiment of the present invention. In Figure 1c, an IC pellet 3 is mounted on the island (element mounting w5) 1 of the lead frame, and a thin metal wire 4 is inserted between the electrode pad of the pellet 3 and the inner end of the lead 2 of the lead frame.
After connection, an inner layer resin with excellent temperature cycle resistance is used, for example, a resin 5 which is soft and has extremely excellent temperature cycle resistance at a temperature at which it becomes glassy (glass transition point is 155°C or less). , the island 1 containing the loaded pellet 3, and the inner end of the lead 3 containing the connecting portion of the thin metal wire 4 are sealed together.Furthermore, the outside of the resin 5 is sealed with, for example, glass. Transition point is 165℃
The above is sealed using the outer layer resin 6 soaked in moisture resistance.
なお上側において、耐温度サイクル性に優れた内側の樹
脂５と耐湿性に優れた外側の樹脂６との間に、緩衝とな
る別種の樹脂を数μｍないし数面μｍはさむことにより
、一層の品質向上を図ることができる。Furthermore, on the upper side, a different type of resin that acts as a buffer is sandwiched between several micrometers or several micrometers of surface between the inner resin 5, which has excellent temperature cycle resistance, and the outer resin 6, which has excellent moisture resistance. You can improve your performance.
以上説明したように本発明は、耐温度サイクル性に優れ
た低応力の内層樹脂でＩＣペレット・ト直接封止し、そ
の上に耐湿性に優れた樹脂を用いることによシ、耐温度
サイクル性と耐湿性に優れ九樹脂封止タイプのＩＣパッ
ケージを得ることができた。また、金属細線のリード側
およびペレット側の接続部を含めて低応力の内層樹脂が
包覆することで、温度サイクルで従来発生し勝ちな金Ｊ
ｆ４細線接続部の断巌事故は完全に防止され、高い信頼
性が確保された。As explained above, the present invention directly seals the IC pellet with a low-stress inner layer resin that has excellent temperature cycle resistance, and uses a resin that has excellent moisture resistance on top of it. We were able to obtain a resin-sealed type IC package with excellent properties and moisture resistance. In addition, the low-stress inner layer resin covers the lead side and pellet side connections of the thin metal wire, which prevents the metal wire from forming in the conventional way due to temperature cycles.
Breaking accidents at the f4 thin wire connection were completely prevented, ensuring high reliability.
第１図は本発明による樹脂封止タイプのＩＣ，＜ッケー
ジの断面図でめる。
１１９．リードフレームのアイランド、２・・・リード
フレームのリード、３・・・ＩＣペレット、４・・・金
属細線、５・・・耐温度サイクル性に優れた内層樹脂、
６・・・耐湿性に優れた外層樹脂。
翁 ／ 図FIG. 1 is a cross-sectional view of a resin-sealed IC package according to the present invention. 119. Island of lead frame, 2... Lead of lead frame, 3... IC pellet, 4... Fine metal wire, 5... Inner layer resin with excellent temperature cycle resistance,
6... Outer layer resin with excellent moisture resistance. old man / figure
Claims (1)
前記集積回路素子とリードフレームのリードとの間を金
属細線で接続後、樹脂で封止してなるＩＣパッケージに
おいて、前記封止樹脂は、ガラス転移点が１５５℃以下
で、前記搭載集積回路素子を含むアイランド、金属細線
、および前記リードの金属細線との接続部を共に直接包
覆する耐温度サイクル性に優れた内層樹脂と、この内層
樹脂の外側を直接または間接に包むガラス転移点が１６
５℃以上の耐湿性に優れた外層樹脂とを含むことを特徴
とするＩＣパッケージ。The integrated circuit element is mounted on the island of the lead frame,
In an IC package in which the integrated circuit element and the leads of a lead frame are connected with thin metal wires and then sealed with a resin, the sealing resin has a glass transition point of 155° C. or lower and is suitable for the mounted integrated circuit element. an inner layer resin with excellent temperature cycle resistance that directly covers the island containing the metal wire, the thin metal wire, and the connection portion with the thin metal wire of the lead, and a resin with a glass transition point of 16 that directly or indirectly covers the outside of this inner layer resin
An IC package characterized by comprising an outer layer resin having excellent moisture resistance at temperatures of 5° C. or higher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61157238A JPS6313355A (en) | 1986-07-03 | 1986-07-03 | Package for ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61157238A JPS6313355A (en) | 1986-07-03 | 1986-07-03 | Package for ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6313355A true JPS6313355A (en) | 1988-01-20 |
Family
ID=15645266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61157238A Pending JPS6313355A (en) | 1986-07-03 | 1986-07-03 | Package for ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6313355A (en) |
-
1986
- 1986-07-03 JP JP61157238A patent/JPS6313355A/en active Pending
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