JPS63140642U - - Google Patents
Info
- Publication number
- JPS63140642U JPS63140642U JP3207187U JP3207187U JPS63140642U JP S63140642 U JPS63140642 U JP S63140642U JP 3207187 U JP3207187 U JP 3207187U JP 3207187 U JP3207187 U JP 3207187U JP S63140642 U JPS63140642 U JP S63140642U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- bonding pad
- shape
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の部分平面図、第２
図は本考案の他の実施例の部分平面図、第３図は
従来の集積回路装置の部分平面図である。
１……半導体チツプ、２……チツプの内部回路
、３……導出配線、４，５，６……ボンデイング
パツド、７……パツケージの肩部、８……内部リ
ード部、９……金属細線、１０……パツケージ。
Fig. 1 is a partial plan view of one embodiment of the present invention;
This figure is a partial plan view of another embodiment of the present invention, and FIG. 3 is a partial plan view of a conventional integrated circuit device. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2... Internal circuit of chip, 3... Leading wiring, 4, 5, 6... Bonding pad, 7... Shoulder of package, 8... Internal lead part, 9... Metal Thin line, 10...package.
Claims (1)
ージまたはリードフレームの内部リードとの間が
金属細線により接続されている集積回路装置にお
いて、前記ボンデイングパツトの形状が隣接する
２辺の長さが異なる長方形または平行四辺形であ
つて、かつ、前記長辺方向が対応する前記パツケ
ージまたはリードフレームの内部リード部の方向
に傾けられていることを特徴とする集積回路装置
。 In an integrated circuit device in which a bonding pad on a semiconductor chip and an internal lead of a package or lead frame are connected by a thin metal wire, the shape of the bonding pad is a rectangle or a parallelogram with two adjacent sides having different lengths. What is claimed is: 1. An integrated circuit device characterized in that the integrated circuit device has a shape, and the long side direction is inclined toward the inner lead portion of the corresponding package or lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3207187U JPS63140642U (en) | 1987-03-04 | 1987-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3207187U JPS63140642U (en) | 1987-03-04 | 1987-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63140642U true JPS63140642U (en) | 1988-09-16 |
Family
ID=30838393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3207187U Pending JPS63140642U (en) | 1987-03-04 | 1987-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63140642U (en) |
-
1987
- 1987-03-04 JP JP3207187U patent/JPS63140642U/ja active Pending