JPS63142855U - - Google Patents
Info
- Publication number
- JPS63142855U JPS63142855U JP1987036375U JP3637587U JPS63142855U JP S63142855 U JPS63142855 U JP S63142855U JP 1987036375 U JP1987036375 U JP 1987036375U JP 3637587 U JP3637587 U JP 3637587U JP S63142855 U JPS63142855 U JP S63142855U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- device chip
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987036375U JPH0526760Y2 (he) | 1987-03-11 | 1987-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987036375U JPH0526760Y2 (he) | 1987-03-11 | 1987-03-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63142855U true JPS63142855U (he) | 1988-09-20 |
| JPH0526760Y2 JPH0526760Y2 (he) | 1993-07-07 |
Family
ID=30846719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987036375U Expired - Lifetime JPH0526760Y2 (he) | 1987-03-11 | 1987-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526760Y2 (he) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09260567A (ja) * | 1996-03-19 | 1997-10-03 | Nec Corp | 樹脂封止型半導体装置 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS525584U (he) * | 1975-06-27 | 1977-01-14 | ||
| JPS533011U (he) * | 1976-06-25 | 1978-01-12 | ||
| JPS58440U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | プラスチツクパツケ−ジ |
| JPS5988854A (ja) * | 1982-11-12 | 1984-05-22 | Toshiba Corp | 半導体装置 |
| JPS59116122A (ja) * | 1982-12-01 | 1984-07-04 | ユニ−・ヴアン・クンストメストフアブリ−ケン・ベスロ−テム・ベンノツトシヤツプ | ホウ酸の製法 |
| JPS59134857A (ja) * | 1983-01-21 | 1984-08-02 | Toshiba Corp | 半導体装置 |
| JPS60195955A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | 半導体装置 |
| JPS6123348A (ja) * | 1984-07-12 | 1986-01-31 | Nec Corp | 樹脂封止型半導体装置 |
| JPS61185955A (ja) * | 1985-02-13 | 1986-08-19 | Toshiba Corp | 半導体装置 |
-
1987
- 1987-03-11 JP JP1987036375U patent/JPH0526760Y2/ja not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS525584U (he) * | 1975-06-27 | 1977-01-14 | ||
| JPS533011U (he) * | 1976-06-25 | 1978-01-12 | ||
| JPS58440U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | プラスチツクパツケ−ジ |
| JPS5988854A (ja) * | 1982-11-12 | 1984-05-22 | Toshiba Corp | 半導体装置 |
| JPS59116122A (ja) * | 1982-12-01 | 1984-07-04 | ユニ−・ヴアン・クンストメストフアブリ−ケン・ベスロ−テム・ベンノツトシヤツプ | ホウ酸の製法 |
| JPS59134857A (ja) * | 1983-01-21 | 1984-08-02 | Toshiba Corp | 半導体装置 |
| JPS60195955A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | 半導体装置 |
| JPS6123348A (ja) * | 1984-07-12 | 1986-01-31 | Nec Corp | 樹脂封止型半導体装置 |
| JPS61185955A (ja) * | 1985-02-13 | 1986-08-19 | Toshiba Corp | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09260567A (ja) * | 1996-03-19 | 1997-10-03 | Nec Corp | 樹脂封止型半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526760Y2 (he) | 1993-07-07 |