JPS63149902A - Microwave circuit - Google Patents

Microwave circuit

Info

Publication number
JPS63149902A
JPS63149902A JP61295744A JP29574486A JPS63149902A JP S63149902 A JPS63149902 A JP S63149902A JP 61295744 A JP61295744 A JP 61295744A JP 29574486 A JP29574486 A JP 29574486A JP S63149902 A JPS63149902 A JP S63149902A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit board
printed circuit
microwave integrated
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61295744A
Other languages
Japanese (ja)
Inventor
Shigeyuki Tanaami
田名網　茂幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61295744A priority Critical patent/JPS63149902A/en
Publication of JPS63149902A publication Critical patent/JPS63149902A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Landscapes

  • Waveguides (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To ensure the stable electric characteristic regardless of distortion or deformation of a printed circuit board by removing an earth pattern of a part where a microwave integrated circuit is mounted in the earth patterns formed on the printed circuit board. CONSTITUTION:A conductor film of a zone along the circumference of the mounted microwave integrated circuit 4 is removed to eliminate the earth pattern 2 on the part. The rear face of the metallic case of the microwave integrated circuit 4 provided along the printed circuit board 1 acts like the earth pattern of the strip line 3 in the part where the earth pattern 2 is removed corresponding to the microwave integrated circuit 4. Thus, even if an external force or heat is given to the printed circuit board 1 to cause distortion or deformation and a gap is caused between the printed circuit board 1 and the microwave integrated circuit 4, it gives no effect on the relation between the printed circuit board 1 and the earth pattern of the microwave integrated circuit 4 and neither the reflection of the microwave signal nor level fluctuation is caused. Thus, the electric characteristic stable against shock and temperature change is obtained.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はマイクロ波集積回路を印刷回路基板に実装した
構成のマイクロ波回路に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a microwave circuit having a configuration in which a microwave integrated circuit is mounted on a printed circuit board.

〔従来の技術〕[Conventional technology]

従来、マイクロ波集積回路を印刷回路基板に実装してマ
イクロ波回路を構成する場合、第２図に示す構成がとら
れている。即ち、第２図（ａ）。Conventionally, when constructing a microwave circuit by mounting a microwave integrated circuit on a printed circuit board, the configuration shown in FIG. 2 has been adopted. That is, FIG. 2(a).

（ｂ）及び（ｃ）はその平面図、断面図及び底面図であ
り、印刷回路基板１１の表面に接地パターン１２を形成
し、裏面にストリップ線路１３を形成し、かつ表面側に
マイクロ波集積回路１４を搭載させている。そして、マ
イクロ波集積回路１４の接続ピン１４ａは透孔１５を通
してストリップ線路１３に接続させ、接地パターン１２
はこの領域を除去して接続ピン１４ａとは短絡しないよ
うに構成している。また、マイクロ波１４は接地パター
ン１２に接続した状態で印刷回路基板１１に固定してお
り、この場合マイクロ波集積回路１４を接地パターン１
２に半田付けしたり、或いは仮ばねや金属板で押さえ付
けるようにしてねし止めする固定構造がとられている。(b) and (c) are a plan view, a cross-sectional view, and a bottom view, in which a grounding pattern 12 is formed on the front surface of the printed circuit board 11, a strip line 13 is formed on the back surface, and a microwave integrated circuit is formed on the front surface side. It is equipped with circuit 14. The connecting pin 14a of the microwave integrated circuit 14 is connected to the strip line 13 through the through hole 15, and the ground pattern 12 is connected to the strip line 13 through the through hole 15.
This region is removed to prevent short-circuiting with the connection pin 14a. Further, the microwave 14 is fixed to the printed circuit board 11 while being connected to the ground pattern 12. In this case, the microwave integrated circuit 14 is connected to the ground pattern 12.
A fixing structure is used in which the fixing device is soldered to the device 2, or it is pressed down with a temporary spring or a metal plate.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の固定構造では、印刷回路基板１１に外力
や熱が加えられて歪や変形が生じた場合には、印刷回路
基板１１とマイクロ波集積回路１４０ケースとの間に隙
間が生じることになり、マイクロ波集積回路１４と接地
パターン１２との間隔が変化され更には両者の接続が不
完全なものになる。このため、マイクロ波集積回路１４
とストリップ線路１３間のマイクロ波信号の変換部で反
射波が発生したりマイクロ波信号のレベルが変動する等
してマイクロ波回路の特性が劣化するという問題がある
。In the conventional fixing structure described above, if external force or heat is applied to the printed circuit board 11 and the printed circuit board 11 is distorted or deformed, a gap will be created between the printed circuit board 11 and the microwave integrated circuit 140 case. As a result, the distance between the microwave integrated circuit 14 and the ground pattern 12 changes, and furthermore, the connection between the two becomes incomplete. For this reason, the microwave integrated circuit 14
There is a problem in that the characteristics of the microwave circuit deteriorate due to reflected waves being generated in the microwave signal conversion section between the strip line 13 and the strip line 13, and the level of the microwave signal fluctuating.

本発明は外力や熱による印刷回路基板の変形によりマイ
クロ波集積回路と印刷回路基板との間に隙間が生じた場
合にも、マイクロ波回路の特性の劣化を生じることのな
いマイクロ波回路を提供することを目的としている。The present invention provides a microwave circuit that does not cause deterioration of the characteristics of the microwave circuit even when a gap is created between the microwave integrated circuit and the printed circuit board due to deformation of the printed circuit board due to external force or heat. It is intended to.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のマイクロ波回路は、印刷回路基板に形成した接
地パターンのうち、マイクロ波集積回路が実装される領
域の接地パターンを除去することにより、印刷回路基板
の歪や変形に関わらず安定した電気的特性を確保し得る
構成としている。The microwave circuit of the present invention provides stable electricity regardless of distortion or deformation of the printed circuit board by removing the ground pattern formed on the printed circuit board in the area where the microwave integrated circuit is mounted. The structure is designed to ensure the following characteristics.

〔実施例〕〔Example〕

次に、本発明を図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例を示し、第１図（ａ）。FIG. 1 shows an embodiment of the present invention, and FIG. 1(a) shows an embodiment of the present invention.

（ｂ）及び（ｃ）は夫々その平面図、断面図及び底面図
を示している。(b) and (c) show a plan view, a sectional view, and a bottom view, respectively.

図示のように印刷回路基板１は絶縁性基板の表面に接地
パターン２を、また裏面に外部の回路を接続するための
ストリップ線路３を夫々導体膜で形成している。また、
印刷回路基板１には複数個の透孔５を開設し、後述する
マイクロ波集積回路４の接続ピン４ａを挿通可能として
いる。そして、この透孔５に臨んで前記ストリップ線路
３を形成する一方、前記接地パターン２はこれら透孔５
を包囲する領域、換言すれば固定されるマイクロ波集積
回路４の周辺に沿った領域の導体膜を除去し、この領域
に接地パターン２を存在させないように構成している。As shown in the figure, a printed circuit board 1 has a grounding pattern 2 formed on the front surface of an insulating substrate, and a strip line 3 for connecting an external circuit formed on the back surface thereof, each made of a conductive film. Also,
A plurality of through holes 5 are formed in the printed circuit board 1 so that connection pins 4a of a microwave integrated circuit 4, which will be described later, can be inserted therethrough. The strip line 3 is formed facing these through holes 5, while the ground pattern 2 is formed facing these through holes 5.
In other words, the conductive film in the area surrounding the microwave integrated circuit 4 to be fixed is removed, so that the ground pattern 2 is not present in this area.

そして、前記印刷回路基板１の表面には金属ケースを有
するマイクロ波集積回路４を固定しており、ここでは金
属ケースを接地パターン２に半田６を用いて接続するこ
とによりその固定を行っており、これと同時に金属ケー
スと接地パターン２との電気的接続を行っている。また
、マイクロ集積回路４の接続ピン４ａは前記透孔５を通
して基板１の裏面にまで挿通させ、ここで前記ストリッ
プ線路３に半田７で接続して電気的接続を行っている。A microwave integrated circuit 4 having a metal case is fixed on the surface of the printed circuit board 1, and here the metal case is fixed by connecting it to the ground pattern 2 using solder 6. At the same time, the metal case and the ground pattern 2 are electrically connected. Further, the connecting pins 4a of the micro integrated circuit 4 are inserted through the through holes 5 to the back surface of the substrate 1, and are connected to the strip lines 3 with solder 7 there for electrical connection.

したがって、この構成によればマイクロ波集積回路４に
対応して接地パターン２を除去した領域では、印刷回路
基板１に沿設されるマイクロ波集積回路４の金属ケース
の裏面がストリップ線路３の接地パターンとして機能す
ることになる。このため、印刷回路基板１に外力や熱が
加わって歪や変形が生じ、印刷回路基板ｌとマイクロ波
集積回路４の間に隙間が生じても、印刷回路基板１とマ
イクロ波集積回路４間の接地面の変換には殆ど影響せず
、マイクロ波信号の反射やレベル変動が生じることはな
い。これにより、衝撃や温度変化に対しても安定な電気
特性のマイクロ波回路を構成することができる。Therefore, according to this configuration, in the area where the ground pattern 2 is removed corresponding to the microwave integrated circuit 4, the back surface of the metal case of the microwave integrated circuit 4 installed along the printed circuit board 1 is connected to the ground of the strip line 3. It will function as a pattern. Therefore, even if an external force or heat is applied to the printed circuit board 1, causing distortion or deformation, and a gap is created between the printed circuit board 1 and the microwave integrated circuit 4, the gap between the printed circuit board 1 and the microwave integrated circuit 4 It has little effect on the conversion of the ground plane, and there is no reflection or level fluctuation of the microwave signal. Thereby, it is possible to construct a microwave circuit with stable electrical characteristics even against shocks and temperature changes.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、印刷回路基板に形成した
接地パターンのうち、マイクロ波集積回路が実装される
領域の接地パターンを除去しているので、印刷回路基板
の歪や変形に関わらずマイクロ波集積回路の金属ケース
をストリップ線路の接地面として構成でき、これにより
マイクロ波信号の反射やレベル変動を防止でき、衝撃や
温度変化に対しても安定した電気的特性を確保すること
ができる。As explained above, the present invention removes the ground pattern in the area where the microwave integrated circuit is mounted from among the ground patterns formed on the printed circuit board. The metal case of the wave integrated circuit can be configured as a ground plane for the strip line, thereby preventing reflections and level fluctuations of microwave signals, and ensuring stable electrical characteristics even against shocks and temperature changes.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例を示す図で、同図（ａ）、　
　（ｂ）及び（ｃ）は夫々平面図、断面図及び底面図、
第２図は従来構造を示す図で、同図（ａ）、　　（ｂ）
及び（ｃ）は夫々平面図、断面図及び底面図である。 １・・・印刷回路基板、２・・・接地パターン、３・・
・ストリップ線路、４・・・マイクロ波集積回路、４ａ
・・・接続ピン、５・・・透孔、６．７・・・半田、１
１・・・印刷回路基板、１２・・・接地パターン、１３
・・・ストリップ線路、１４・・・マイクロ波集積回路
、１４ａ・・・接続ピン、１５・・・透孔。 第１図 （ｂ）FIG. 1 is a diagram showing an embodiment of the present invention, and FIG.
(b) and (c) are respectively a plan view, a sectional view, and a bottom view;
Figure 2 shows the conventional structure, with (a) and (b)
and (c) are a plan view, a sectional view, and a bottom view, respectively. 1...Printed circuit board, 2...Grounding pattern, 3...
・Strip line, 4...Microwave integrated circuit, 4a
...Connecting pin, 5...Through hole, 6.7...Solder, 1
DESCRIPTION OF SYMBOLS 1... Printed circuit board, 12... Grounding pattern, 13
...Strip line, 14...Microwave integrated circuit, 14a...Connection pin, 15...Through hole. Figure 1(b)

Claims (2)

【特許請求の範囲】[Claims] （１）接地パターン及びストリップ線路を形成した印刷
回路基板に金属ケースのマイクロ波集積回路を実装して
なるマイクロ波回路において、前記印刷回路基板のマイ
クロ波集積回路が実装される領域には接地パターンを設
けていないことを特徴とするマイクロ波回路。(1) In a microwave circuit in which a microwave integrated circuit in a metal case is mounted on a printed circuit board on which a ground pattern and a strip line are formed, the area of the printed circuit board where the microwave integrated circuit is mounted has a ground pattern. A microwave circuit characterized in that it is not provided with. （２）絶縁性基板の一面に接地パターンを、他面にスト
リップ線路を形成し、前記接地パターンを設けていない
箇所の一面にマイクロ波集積回路を搭載しかつその金属
ケースを接地パターンに接続してなる特許請求の範囲第
１項記載のマイクロ波回路。(2) Form a ground pattern on one side of an insulating substrate and a strip line on the other side, mount a microwave integrated circuit on one side where the ground pattern is not provided, and connect its metal case to the ground pattern. A microwave circuit according to claim 1, comprising:
JP61295744A 1986-12-13 1986-12-13 Microwave circuit Pending JPS63149902A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61295744A JPS63149902A (en) 1986-12-13 1986-12-13 Microwave circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61295744A JPS63149902A (en) 1986-12-13 1986-12-13 Microwave circuit

Publications (1)

Publication Number Publication Date
JPS63149902A true JPS63149902A (en) 1988-06-22

Family

ID=17824601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61295744A Pending JPS63149902A (en) 1986-12-13 1986-12-13 Microwave circuit

Country Status (1)

Country Link
JP (1) JPS63149902A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016701A (en) * 1983-07-08 1985-01-28 Nec Corp Microwave printed board circuit
JPS60149153A (en) * 1984-01-13 1985-08-06 Nec Corp Microwave circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016701A (en) * 1983-07-08 1985-01-28 Nec Corp Microwave printed board circuit
JPS60149153A (en) * 1984-01-13 1985-08-06 Nec Corp Microwave circuit

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