JPS63190A - Manufacture of printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] This release E! i4f'i, relates to a method of manufacturing a printed wiring board necessary for mounting an electronic device that satisfies the functions of fixed support for electronic components, functional connections between one component and insulation between the connections, etc.

[Conventional technology]

FIG. 4a is a process diagram showing a conventional and commonly used method for manufacturing a printed wiring board. FIG. 4b is a partial sectional view showing the state of the printed wiring board in each step of a. In the figure, (11 is an insulating substrate such as glass epoxy, (
2) is a first conductor layer made of copper, for example.

(3) is a through hole, (41d is a photosensitive resin layer that becomes soluble by light, (4a) is a resist that remains after the photosensitive resin layer (4) is developed), and i51 is a mask film for forming a wiring pattern. - (6) is the part where the light (7), such as a mercury lamp, is fitted.

Next, the manufacturing method will be explained. First, CAD (Com
Based on the data (11b), a through hole (31) is drilled in the insulating substrate (11) as shown in Figure 4. Plating the first
A conductor layer ζ22 is formed. At this time, use the through hole (3
) is also formed with a conductor layer (2). The thickness of the first conductor layer (2) is, for example, 2 to 3 μm. Next, as shown in C, a light-soluble resin layer (4) is applied to both sides of the fully insulated substrate (1). A dry film type resin layer made of, for example, a polymer of methyl methacrylate/acrylonitrile/acrylated glycidyl acrylate is used as the resin layer (4), and the through holes (3) are tented. Next, as shown in d, the mask film (5) created based on the artwork data (11a) is superimposed on the fully insulated substrate (1) and aligned.
As shown in e, all light (6) from a mercury lamp or the like is irradiated from the exposure machine (not shown) K. At this time, as shown by f, only the portion of the writing resin layer (4) that is exposed to the light becomes soluble, and after development, the portion that is not exposed to the light remains, forming the plating resist (4a).
becomes. Next, as shown in g, electrolytic plating is performed to form a second conductive layer () of copper, etc., with a thickness of 20 to 30 μm.
form. Furthermore, as shown by h, the plating resist) (
After peeling off 4a), by lightly etching the entire surface (quick etching), the exposed first conductor layer (2) is removed and the second conductor layer (7) is removed as shown in i. The formed portion becomes a wiring pattern.

Next, creation of a mask film based on artwork data (11a) will be briefly explained. trout.

A digitizer (not shown) is used to create an enlarged original. After inspecting this, make one edit. Then, the original drawing is photographed in a reduced size and printed on multiple sides to create a mask film.

[Problem that the invention seeks to solve]

In the conventional printed wiring board manufacturing method as described above.

An artwork process is required to create the mask film (5), and this process takes a lot of time, which becomes a bottleneck when producing a wide variety of products in small lots. Further, it takes time and effort to fully align the polishing mask film (5) and the insulating substrate (1) and perform exposure. There are problems such as damage to the mask film (5) and other defects, and the need to store the mask film (51).

As a solution to these problems, there is a method of using a laser device such as the one shown in FIG. 5 for patterning exposure without a mask. This is an example.

High-precision laser direct drawing device (N1kon) published by Nippon Kogaku Kogyo Co., Ltd. Precision Machinery Division Precision Machinery Sales Department in June 1985.
LP 3000D) As shown in the specifications, (51”) i argon ion laser oscillator, (52) is the ON10 F F of the laser beam.
(53) is a mirror that reflects the laser beam; (54) is a lens that focuses the laser beam.

(55) is a polygon mirror for scanning the laser beam, (56) is an fθ lens that corrects the focal point of the laser beam, (57) is a bending mirror for directing the laser beam to metal work, and (58) is for holding the insulating substrate. This is a table that can be moved.

This device 11t adopts a raster method in which a pattern is drawn by scanning a beam with a polygon mirror (55) on one axis and moving a table (58) on a vertical axis. therefore.

It is necessary to convert the manufacturing data to create data for the Lascou method, and this data conversion takes a lot of time. Additionally, this device has many mechanically driven parts.

There are problems in that drawing time is long and reliability is low.

This invention was made in order to solve the above-mentioned problems, and allows patterning exposure without a mask without converting a large amount of drawing data, and can support high-mix, small-lot production, as well as a single mechanical drive. An object of the present invention is to obtain a method for manufacturing a printed wiring board with a small number of parts.

As for the conventional technology belonging to this technical field.

In addition, there is Japanese Patent Application Laid-open No. 54-483 (N. ``Optical scanning device and scanning method for exposing a photosensitive surface with a laser beam'').

[Means for solving problems]

The method for manufacturing a printed wiring board according to the present invention includes the steps of providing an electrosensitive resin layer that is soluble in an electron beam on an insulating substrate, and aligning the insulating substrate provided with the electrosensitive resin layer with the electron beam. Then, a clear resist is formed by carrying out a step of direct patterning exposure using the electron beam using a vector method.

[Effect]

In this invention, patterning exposure is performed directly with a sub-beam without using a mask film, so the complicated artwork process can be omitted, productivity can be improved, and production can be made more flexible.

Defects and storage problems caused by scratches on the mask film are also eliminated. In addition, since the electron beam can be controlled electrically, stable drawing can be performed using the vector method, and there is no need for extensive data conversion. , [Example] Hereinafter, an example of the present invention will be described based on the drawings.

FIG. 1a is a process diagram showing a method for manufacturing a printed wiring board according to an embodiment of the present invention, and is a partial sectional view showing the state of the printed wiring board in each step of steps 11 to 1. In the figure, (EB)t'j is irradiated with an electron beam.

The resin layer (41 in this case is an electron-sensitive resin layer that becomes soluble by electron beam (EB), since many organic polymers become soluble by electron beam (EB).

For example, a dry type material such as a polymer of methyl methacrylate/acrylonitrile/acrylated glycidyl acrylate ester can also be used.

Next, the operation will be explained mainly focusing on the differences from the conventional example. That is, as shown in FIG. 1C, a through hole +31 is provided to form a first conductor layer (21), and a resin layer (4) is applied to an insulating substrate [11] shown in FIG.
Patterning exposure is performed by directly drawing along the wiring pattern with an electron beam, as shown in FIG. 1d+e, without using the mask film (5) as in the conventional example shown in FIG. At this time, if wiring patterns are to be formed on both the front and back surfaces of the insulating substrate fi+, it is necessary to perform nine double-sided t-exposures, but as shown in FIG. Since positioning is performed by scanning the electron beam (group) and monitoring one reflected electron (RB) by the reflected electron sensor Qυ and the signal processing unit 113, it can be performed easily and reliably.

Figure 3a is an explanatory diagram explaining the electron beam scanning method, b
FIG. 2 is an explanatory diagram showing an enlarged view of the electron beam irradiation section shown in FIG. In the figure, (4b) shows the exposed and melted part of the resin layer, and (4c) shows the part currently irradiated with the electron beam. As shown in this figure, the electron beam scanning method is a vector method that scans along the wiring pattern. Now, the electron beam ItooμmX100μ
When forming the beam into a rectangular shape of m and using a resistor Q with a sensitivity of 1×1Q c, /cR, if the beam current is 10 μA, the irradiation time required for exposure, that is, the stop time of the rectangular beam, is 10 μsec. . That is, the linear velocity of the beam at arrow A must be 10 m/see or less.

The movement of arrow B is 10 m/sec without stopping the beam.
Move it fast enough so it doesn't get exposed.

In order to form an electron beam into a rectangle of 100 μm x 100 μm, it is possible to vibrate a beam with a spot diameter of about 10 μm at a high frequency, for example.

Note that in the above example, the beam current was 10 μA, but
If the response of the beam deflection amplifier (not shown) is good, the beam current can be further increased. In this case, the linear velocity of the electron beam becomes even faster, improving productivity.

When the beam current is decreased, the irradiation time must be increased accordingly, and the total exposure time becomes longer. In order to shorten the exposure time compared to the conventional method using a mercury lamp, a beam current of 1 μA or more is normally desired, although it depends on the size of the printed wiring board.

Furthermore, in order to reduce the frequency of positioning by moving the processing room table (not shown), the area to be drawn by beam deflection is set to be N) mm x 10 m or more.

That is, if this area is small, the frequency of mechanically moving the processing chamber table increases when writing on the entire surface of the insulating substrate, making the exposure process longer. In order to complete the exposure process in a shorter time than the conventional method, it is desirable that the drawing area be H1m x H1gg or more.

Furthermore, in the above embodiment, the beam is 100μm×100μm.
It goes without saying that wiring patterns of various line widths can be accommodated by forming a rectangular shape of m and changing the size.

〔Effect of the invention〕

As described above, according to the present invention, an electron-sensitive resin layer that is soluble by an electron beam is provided on an insulating substrate, a cooling process is performed, and an electron beam is aligned with the insulating substrate provided with the electron-sensitive resin layer. 1. Since the plating resist is formed by performing the process of direct patterning exposure using the vector method using the electron beam described above, patterning exposure can be performed without a mask without the need to convert a large amount of drawing data, allowing for high-mix, small-lot production. This has the effect of providing a printed wiring board manufacturing method that is compatible with the present invention and requires fewer mechanical drive units.

[Brief explanation of the drawing]

Figure 1a is a process diagram showing a method for manufacturing a printed wiring board according to an embodiment of the present invention *b'=f is a partial cross-sectional view showing the state of the printed wiring board in each step of step 3. Figure 2 is an insulating substrate FIG. 3a is an explanatory diagram illustrating the scanning method of the electron beam, FIG. 3b is an explanatory diagram showing an enlarged view of the electron beam irradiation section shown in a, and FIG. a
is a process diagram showing a conventional printed wiring board manufacturing method + b-
FIG. 3 is a partial cross-sectional view showing the state of the printed wiring board in each step of I Fia. In the figure, (1) is an insulating substrate, (1a) is a reference position mark, (2) is a first conductor layer, (31 is a through hole, (41 is a resin layer, (4a) is a fitted resist),
(4b) is the part where the resin layer was exposed and melted;
(4c) is the part currently irradiated with the electron beam, +
51fl mask film. (6) is the light, (7) is the fa2 conductor layer, and (Foundation) is the backscattered electron sensor. (Kan is a signal processing unit), (IB) is an electron beam. (RB) is a reflected electron. Note that the reference numerals in the middle of each figure indicate the same or corresponding parts.

Claims (4)

[Claims] (1) A first conductor layer is formed by providing through holes in an insulating substrate, and a part that becomes a circuit, a part that becomes a pad, and a plating resist is formed leaving the through hole part, and a part that becomes the circuit. , a method for manufacturing a printed wiring board in which a second conductor layer is formed by plating the portions that will become pads and through holes to obtain a wiring pattern, in which an electrosensitive resin that is soluble in the insulating substrate by an electron beam The plating resist is formed by performing a step of providing a layer, and a step of aligning an insulating substrate provided with the electrosensitive resin layer with an electron beam, and performing direct patterning exposure with the electron beam in a vector method. Features: A method for manufacturing printed wiring boards. (2) The method for manufacturing a printed wiring board according to claim 1, wherein reflected electrons are used to align the insulating substrate and the electron beam. (3) Drawing area due to electron beam deflection is 10 mm x 1
The method for manufacturing a printed wiring board according to claim 1 or 2, wherein the thickness is 0 mm or more. (4) The method for manufacturing a printed wiring board according to any one of claims 1 to 3, wherein the beam current is 1 μA or more.