JPS63195568U - - Google Patents
Info
- Publication number
- JPS63195568U JPS63195568U JP8322787U JP8322787U JPS63195568U JP S63195568 U JPS63195568 U JP S63195568U JP 8322787 U JP8322787 U JP 8322787U JP 8322787 U JP8322787 U JP 8322787U JP S63195568 U JPS63195568 U JP S63195568U
- Authority
- JP
- Japan
- Prior art keywords
- target
- temperature
- sputtering
- cooling system
- reactive sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
Description
第1図は本考案の一実施例の反応性スパツタ装
置の構成図、第2図は異なるターゲツト温度での
スパツタ中の電力―電圧の関係を示した線図であ
る。 1……真空槽、2……スパツタターゲツト、3
……基板、4……熱電対温度計、5……ターゲツ
ト冷却系、6……ガス供給系、7……排気系、8
……冷媒だめ、9……冷媒用温度制御装置、10
……冷媒循環用ポンプ。
置の構成図、第2図は異なるターゲツト温度での
スパツタ中の電力―電圧の関係を示した線図であ
る。 1……真空槽、2……スパツタターゲツト、3
……基板、4……熱電対温度計、5……ターゲツ
ト冷却系、6……ガス供給系、7……排気系、8
……冷媒だめ、9……冷媒用温度制御装置、10
……冷媒循環用ポンプ。
Claims (1)
- 真空槽、排気装置、ガス供給系、高電圧電源、
スパツタゲートおよびターゲツト冷却系より成る
反応性スパツタ装置において、スパツタターゲツ
トに温度検出器をとりつけ、ターゲツト冷却系の
冷媒の温度を制御することにより、ターゲツト温
度を任意に設定できるようにしたことを特徴とす
る反応性スパツタ装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8322787U JPS63195568U (ja) | 1987-06-01 | 1987-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8322787U JPS63195568U (ja) | 1987-06-01 | 1987-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195568U true JPS63195568U (ja) | 1988-12-15 |
Family
ID=30936621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8322787U Pending JPS63195568U (ja) | 1987-06-01 | 1987-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195568U (ja) |
-
1987
- 1987-06-01 JP JP8322787U patent/JPS63195568U/ja active Pending
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