JPS63197356U - - Google Patents
Info
- Publication number
- JPS63197356U JPS63197356U JP8986187U JP8986187U JPS63197356U JP S63197356 U JPS63197356 U JP S63197356U JP 8986187 U JP8986187 U JP 8986187U JP 8986187 U JP8986187 U JP 8986187U JP S63197356 U JPS63197356 U JP S63197356U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- chip
- substrate
- bonding
- metallized wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000012212 insulator Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8986187U JPS63197356U (2) | 1987-06-10 | 1987-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8986187U JPS63197356U (2) | 1987-06-10 | 1987-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197356U true JPS63197356U (2) | 1988-12-19 |
Family
ID=30949226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8986187U Pending JPS63197356U (2) | 1987-06-10 | 1987-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197356U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993017457A1 (fr) * | 1989-07-01 | 1993-09-02 | Ryo Enomoto | Substrat pour montage d'un semiconducteur et procede de realisation |
-
1987
- 1987-06-10 JP JP8986187U patent/JPS63197356U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993017457A1 (fr) * | 1989-07-01 | 1993-09-02 | Ryo Enomoto | Substrat pour montage d'un semiconducteur et procede de realisation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63197356U (2) | ||
| JPS63197353U (2) | ||
| JPS61123544U (2) | ||
| JPS6416636U (2) | ||
| JPH01125541U (2) | ||
| JPS62158840U (2) | ||
| JPH0356172U (2) | ||
| JPS646038U (2) | ||
| JPH03104757U (2) | ||
| JPS5842940U (ja) | 混成集積回路装置 | |
| JPS62158835U (2) | ||
| JPH0265337U (2) | ||
| JPS63145343U (2) | ||
| JPS6081664U (ja) | 集積回路パツケ−ジ | |
| JPH01110380U (2) | ||
| JPS6115753U (ja) | 半導体装置 | |
| JPH0270456U (2) | ||
| JPS63164245U (2) | ||
| JPS58184840U (ja) | 半導体装置 | |
| JPH01112044U (2) | ||
| JPS6338350U (2) | ||
| JPH02131357U (2) | ||
| JPS6094836U (ja) | 半導体装置 | |
| JPS63102253U (2) | ||
| JPS5965553U (ja) | 集積回路装置 |