JPS63197365U - - Google Patents
Info
- Publication number
- JPS63197365U JPS63197365U JP1987088782U JP8878287U JPS63197365U JP S63197365 U JPS63197365 U JP S63197365U JP 1987088782 U JP1987088782 U JP 1987088782U JP 8878287 U JP8878287 U JP 8878287U JP S63197365 U JPS63197365 U JP S63197365U
- Authority
- JP
- Japan
- Prior art keywords
- infrared
- photointerrupter
- phototransistor
- led chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の概略図、第２図は
従来の樹脂一体成形のホトインタラプタの一例の
概略図、第３図は本考案の実施例２の概略図であ
る。 １……赤外ＬＥＤチツプ、２……発光側赤外光
透過性黒色樹脂、３……レンズ、４……受光側赤
外光透過性黒色樹脂、５……レンズ、６……ホト
トランジスタチツプ、７……ダミーピン、８……
アノード、９……カソード、１０……エミツタ、
１１……コレクタ、１２……赤外ＬＥＤチツプ、
１３……赤外光透過性黒色樹脂、１４……発光側
レンズ、１５……受光側レンズ、１６……ホトト
ランジスタチツプ、１７……アノード、１８……
カソード、１９……エミツタ、２０……コレクタ
、２１……ダミーピン、２２……タイバー、２３
……発光側赤外光透過性黒色樹脂、２４……受光
側赤外光透過性黒色樹脂、２５……赤外ＬＥＤチ
ツプ、２６……ホトトランジスタ・チツプ、２７
……アノード、２８……カソード、２９……エミ
ツタ、３０……コレクタ。
従来の樹脂一体成形のホトインタラプタの一例の
概略図、第３図は本考案の実施例２の概略図であ
る。 １……赤外ＬＥＤチツプ、２……発光側赤外光
透過性黒色樹脂、３……レンズ、４……受光側赤
外光透過性黒色樹脂、５……レンズ、６……ホト
トランジスタチツプ、７……ダミーピン、８……
アノード、９……カソード、１０……エミツタ、
１１……コレクタ、１２……赤外ＬＥＤチツプ、
１３……赤外光透過性黒色樹脂、１４……発光側
レンズ、１５……受光側レンズ、１６……ホトト
ランジスタチツプ、１７……アノード、１８……
カソード、１９……エミツタ、２０……コレクタ
、２１……ダミーピン、２２……タイバー、２３
……発光側赤外光透過性黒色樹脂、２４……受光
側赤外光透過性黒色樹脂、２５……赤外ＬＥＤチ
ツプ、２６……ホトトランジスタ・チツプ、２７
……アノード、２８……カソード、２９……エミ
ツタ、３０……コレクタ。
Claims (1)
- 赤外ＬＥＤチツプとホトイランジスタ・チツプ
を用い、赤外光透過性の樹脂により成形するホト
インタラプタにおいて、赤外ＬＥＤチツプ側と、
ホトトランジスタ・チツプ側を分離成型し、かつ
金属片により接続したことを特徴とするホトイン
タラプタ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088782U JPS63197365U (ja) | 1987-06-08 | 1987-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088782U JPS63197365U (ja) | 1987-06-08 | 1987-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197365U true JPS63197365U (ja) | 1988-12-19 |
Family
ID=30947186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987088782U Pending JPS63197365U (ja) | 1987-06-08 | 1987-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197365U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009130022A (ja) * | 2007-11-21 | 2009-06-11 | Toshiba Corp | インタラプタ |
-
1987
- 1987-06-08 JP JP1987088782U patent/JPS63197365U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009130022A (ja) * | 2007-11-21 | 2009-06-11 | Toshiba Corp | インタラプタ |