JPS63199A - Heat radiation structure of electronic parts in electronic equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] The present invention provides a heat dissipation structure for electronic components on a printed circuit board mounted in a casing of an electronic device, which includes a plurality of printed circuit boards each having a circuit pattern surface and a component mounting surface. of,
The heat transfer element is placed inside the casing so that the component mounting surfaces face each other, and the heat transfer element is connected to the surface of an electronic circuit component that requires heat dissipation, such as a high-density integrated circuit element on the component mounting surface of a printed circuit board. By connecting the heat dissipation side of the thermal element to the heat dissipation fin provided outside the casing and to the shield cover that covers the circuit pattern surface of the printed circuit board, the thermal influence on other electronic circuit components inside the casing is suppressed. At the same time, sufficient heat dissipation can be performed without narrowing the mounting area of the printed circuit board.

[Industrial application field]

The present invention relates to a heat dissipation structure for electronic circuit components in an electronic device, and more particularly to a heat dissipation structure for electronic components on a printed circuit board mounted in a casing.

Generally, in electronic devices such as control units,
A plurality of printed circuit boards are mounted in parallel at intervals within the casing, and various electronic circuit components are mounted on the component mounting surface of the printed circuit board.

By the way, among electronic circuit components, large-scale integrated circuit elements (
High-density integrated circuit devices such as LSI devices (LSI devices) are trending towards higher integration and higher power consumption. Therefore, when such high-density integrated circuit elements are mounted on a printed circuit board,
There is a risk that reliability will be lowered due to an increase in the temperature inside the casing and the heat of the element itself. Therefore, there is a need for a heat dissipation structure that can dissipate heat from high-density integrated circuit elements while suppressing thermal effects on other electronic circuit components within the casing, and which does not narrow the mounting area within the casing. Ru.

[Conventional technology]

The fifth heat dissipation structure of electronic circuit components in conventional electronic devices
As shown in the figure, with reference to the figure, a casing 2 of an electronic device
Inside, a plurality of printed circuit boards 3 are mounted in parallel at intervals. The printed circuit board 3 has a circuit pattern surface 3 a and a component mounting surface 3 b on the back side thereof, and the circuit pattern surface 3 a is covered with a shield cover 4 attached to the printed circuit board 3 .

L mounted on the component mounting surface 3b of the printed circuit board 3
A block 6 made of a material with good thermal conductivity is attached to the surface of an electronic circuit component 5 that requires heat radiation, such as an SI element. Heat pipe 7 connected to block 6
The heat dissipation part at the tip of extends to the outside of the casing 2,
A heat dissipation fin 8 located between two adjacent printed boards 3 and a heat dissipation fin 9 located outside the casing 2 are fixed to the heat dissipation portion of the heat pipe 7 .

[Problem that the invention seeks to solve]

In the conventional heat dissipation structure described above, since the heat dissipation fins 8 are provided between adjacent printed circuit boards 3, there is a drawback that the mounting area on the component mounting surface 3b of the printed circuit board 3 becomes narrow.

If the heat dissipation fins 8 between the printed circuit boards 3 are removed and only the heat dissipation fins 9 outside the casing 1 are used, the heat dissipation area decreases and heat dissipation becomes insufficient.

Therefore, it is conceivable to connect the shield cover 4 to the heat dissipation part of the heat pipe 7 and use the shield cover 4 as a heat dissipation plate, but in this case, in the conventional heat dissipation structure, the circuits of two adjacent printed circuit boards 3 Pattern surface 3a
Since the component mounting surface 3b and the shield cover 4 face each other, heat radiation from the shield cover 4 causes a temperature increase of the electronic circuit components on the adjacent printed circuit board 3, which is a drawback.

[Means for solving problems]

In view of the above-mentioned problems, the present invention is capable of securing a sufficient heat dissipation area for heat dissipation from high-density integrated circuit elements, etc. without reducing the component mounting area of a printed circuit board in an electronic device. The purpose is to provide a heat dissipation structure that is less likely to have a thermal effect on the electronic circuit components above.

In order to achieve the above object, the present invention arranges a plurality of printed circuit boards each having a circuit pattern surface and a component mounting surface in a casing with an open front surface so that the component mounting surfaces face each other, A heat dissipation method in which a heat transfer element is connected to the surface of the electronic circuit component that requires heat dissipation among the electronic circuit components mounted on the component mounting surface of the printed circuit board, and the heat dissipation side of the heat transfer element is provided outside the front side of the casing. Provided is a heat dissipation structure for an electronic circuit component in an electronic device, which is connected to a fin and is also connected to a shield cover that covers a circuit pattern surface of a printed circuit board.

[For production]

According to the above means according to the present invention, heat generated in electronic circuit components that require heat dissipation, such as high-density integrated circuit elements, is transmitted to the heat dissipation fins and the shield cover outside the casing via the heat transfer element, Heat is radiated by these radiation fins and the shield cover. In this way, since the shield cover is used as a heat sink in addition to the heat dissipation fins, a sufficient heat dissipation area can be secured without the need to provide another heat dissipation fin between the printed circuit boards. Therefore, the mounting density of electronic circuit components on the printed circuit board can be increased by effectively using the component mounting surface of the printed circuit board. In addition, since the printed circuit board is mounted inside the casing so that the component mounting surfaces face each other, the shield covers that cover the circuit pattern surface of the printed circuit board face each other, and the electronic circuits on the printed circuit board due to heat dissipation from the shield cover. This means that the thermal influence on the components can be minimized.

(Example〕 Hereinafter, the present invention will be described in detail with reference to the drawings.

1 to 4 show one embodiment of the present invention. First, referring to FIGS. 1 and 2, the casing 11 of the electronic device is open at the front, and the upper and lower edges of the opening are provided with a plurality of vertically opposing slings H1a.

11b are respectively formed, and a plurality of printed circuit boards 12 are formed in the upper and lower slits 11a.

It can be inserted into the casing 11 through 11b.

The printed circuit board 12 has a circuit pattern surface 12a and a component mounting surface 12b on the back side thereof, and various electronic circuit components are mounted on the component mounting surface 12b. As can be seen from FIG. 2, the printed circuit board 12 is mounted in the casing 11 so that the component mounting surfaces 12b face each other.

Among the electronic circuit components mounted on the printed circuit board 12,
For example, high-density integrated circuit devices such as large-scale integrated circuit devices (LSI devices) consume a lot of power and generate a lot of heat, so heat must be dissipated sufficiently to avoid thermal effects on other electronic circuit components. There is a need. These electronic circuit components that require heat dissipation are indicated by reference numeral 13.

As shown in FIGS. 1 and 3(a) and (b), - A heat transfer block 14 made of a material with good thermal conductivity, such as aluminum or brass, is attached to the surface of the electronic circuit component 13. A thin tubular heat pipe 15 in which a working fluid is injected is connected to the heat transfer block 14. One heat pipe 1 is connected to each heat transfer block 14.
5 may be connected, but as shown in Figure 3(a), 1
A plurality of heat pipes 15 may be connected to a plurality of heat transfer blocks 14.

The heat dissipation section of the heat pipe 15 is located near the front end of the printed circuit board 12, and the heat dissipation section of the heat pipe 15 is connected to a heat dissipation fin 16 located outside the front side of the casing 11.

To explain in more detail, here, a support block 17 is fixed on the component mounting surface 12b at the front end of the printed circuit board 12, and the groove 17 formed in the support block 17
The heat dissipation end of the heat pipe 15 is engaged with a.

As can be seen from FIGS. 1 and 4, the heat dissipation fin 16 has an inner bracket 18 and an outer flange 19 on both left and right sides of the rear part thereof, and the inner bracket 18 has a heat dissipation end of the heat pipe 15. A retainable groove 18a is formed.

Between the inner bracket 18 and the outer bracket 19,
The front end of the printed circuit board 12 and the support block 17 are inserted, and the heat dissipation part of the heat pipe 15 is fitted into the hole formed by the groove 17a of the support block 17 and the groove 18a of the inner bracket 18.

On the other hand 1. A front end portion of a shield cover 20 that covers the circuit pattern surface 12a of the printed circuit board 12 is interposed between the outer bracket 19 and the circuit pattern surface 12a of the printed circuit board 12.

The bolts 21 are tightened through the through holes formed in the outer bracket 19, the slits 20a formed in the shield cover 20, the printed circuit board 12, and the support block 17, respectively.
12c, 17b (Fig. 3(a).

1) and a through hole formed in the inner bracket 18, and is screwed into the nut 22. By tightening the bolts 21 and nuts 22, both brackets 18 and 19 are tightened, and the radiation fins 16 are firmly connected to the front end of the printed circuit board 12. and is thermally connected to the shield cover 20.

In this way, the shield cover 20 also functions as a heat sink, so it is preferable that the shield cover 20 is made of a material with good thermal conductivity.

Further, the support block 17 and the bolts 21 are the heat pipes 1
Since these parts play the role of thermally connecting the heat dissipation part of No. 5 and the shield cover 20, it is preferable that these parts are also made of a material with good thermal conductivity.

In the heat dissipation structure for electronic circuit components in an electronic device having the above configuration, heat generated in the electronic circuit component 13 that requires heat dissipation passes through the heat transfer block 14 as a heat transfer element and the heat pipe 15 to the outside of the casing 11. The heat is transported to the heat dissipation fins 16 and the shield cover 20, and the heat is radiated by the heat dissipation fins 16 and the shield cover 20.

In this way, in addition to the radiation fins 16, the shield cover 20
Since it is used as a heat dissipation plate, there is no need to provide another heat dissipation fin between the printed circuit boards 12, and a sufficient heat dissipation area can be secured. When heat dissipation fins are provided between the printed circuit boards 12, the area where components can be mounted on the printed circuit board is narrowed by the heat dissipation fins. can be effectively used to increase the mounting density of electronic circuit components on the printed circuit board 12.

On the other hand, the printed circuit board 12 is mounted in the casing 11 so that the component mounting surfaces 12b face each other, and the shield covers 20 that cover the circuit pattern surfaces 12a of the printed circuit board 12 face each other. Therefore, the thermal influence on the electronic circuit components on the printed circuit board 12 due to heat radiation from the shield cover 20 can be minimized.

Although the illustrated embodiments have been described above, the present invention is not limited to the embodiments described above, and various changes can be made to the constituent elements within the scope of the invention described in the claims. can. For example, one of the inner bracket 18 or the outer bracket 19 may be separated from the radiation fins 16 to obtain a greater tightening force.

Further, the front end of the shield cover 20 is connected to the printed circuit board 12.
It may be extended to the component mounting surface 12b side.

Further, in the above embodiment, the heat radiation fins are attached to the front ends of the two printed circuit boards 12, but the heat radiation fins may be attached to each printed circuit board. Furthermore, the radiation fins may be attached to the outer wall of the casing, etc. Although the heat pipe 15 is best for effectively transmitting the heat from the heat transfer block 13 to the radiation fins 16 and the shield cover 20, it is possible to use a heat pipe instead of the heat pipe. A rod with good thermal conductivity may be used.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, heat generated in electronic circuit components that require heat dissipation, such as high-density integrated circuit elements, passes through the heat transfer element and reaches the heat dissipation fins outside the casing. The heat is transmitted to the shield cover, and is radiated by these radiation fins and the shield cover. in this way,
Since the shield cover is used as a heat sink in addition to the heat dissipation fins, a sufficient heat dissipation area can be secured without the need to provide another heat dissipation fin between the printed circuit boards. Therefore, the mounting density of electronic circuit components on the printed circuit board can be increased by effectively using the component mounting surface of the printed circuit board. In addition, since the printed circuit board is mounted inside the casing so that the component mounting surfaces face each other, the shield covers that cover the circuit pattern surface of the printed circuit board face each other, and heat dissipates from the shield cover. This means that thermal effects on electronic circuit components can be minimized. Therefore, it is possible to provide a heat dissipation structure for electronic circuit components that can sufficiently dissipate heat while suppressing the thermal influence on other electronic circuit components within the casing and without narrowing the mounting area of the printed circuit board. Become.

[Brief explanation of drawings]

FIG. 1 shows an example of the release of electronic circuit components in an electronic device showing an embodiment of the present invention. ! Figure 2 is a cross-sectional view of the heat dissipation structure shown in Figure 1, viewed from the front of the casing, and Figure 3 (al and 3 (bl) are the heat dissipation structures shown in Figure 1, respectively. FIG. 4 is a perspective view of the heat dissipation fin shown in FIG. 1, and FIG. 5 is a plan view of the inside of the casing showing the heat dissipation structure of electronic circuit components in a conventional electronic device. , 11 is a casing, 12 is a printed circuit board,
12a is a circuit pattern surface, 12b is a component mounting surface, 13 is an electronic circuit component, 14 is a heat transfer block, 15 is a heat pipe, 16 is a radiation fin, and 20 is a shield cover.

Claims (1)

[Claims] 1. A plurality of printed circuit boards (12) having a circuit pattern surface (12a) and a component mounting surface (12b) are placed in a casing (11) of an electronic device. A heat transfer element (
14, 15) and connect the heat dissipation side of the heat transfer element (14, 15) to the casing (11).
), and connected to a shield cover (20) that covers a circuit pattern surface (12a) of a printed circuit board (12). Heat dissipation structure. 2. The heat dissipation structure for electronic circuit components in an electronic device according to claim 1, wherein the heat dissipation fins (16) are attached to the ends of the printed circuit board (12). 3. Heat dissipation fins (16) are installed at the ends of two adjacent printed circuit boards (12) whose component mounting surfaces (12b) face each other.
A heat dissipation structure for an electronic circuit component in an electronic device according to claim 1 or 2, wherein both ends of the electronic circuit component are attached. 4. The heat transfer element includes a heat pipe (15) and a heat transfer block (14) for thermally connecting the heat pipe (15) to the surface of an electronic circuit component (13) that requires heat radiation. A heat dissipation structure for an electronic circuit component in an electronic device according to claim 1.