JPS63201047U - - Google Patents
Info
- Publication number
- JPS63201047U JPS63201047U JP9183287U JP9183287U JPS63201047U JP S63201047 U JPS63201047 U JP S63201047U JP 9183287 U JP9183287 U JP 9183287U JP 9183287 U JP9183287 U JP 9183287U JP S63201047 U JPS63201047 U JP S63201047U
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- semiconductor wafer
- workhead
- rotation shaft
- speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000013078 crystal Substances 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
第１図ａは本考案の一実施例を示す断面図、第
１図ｂは同フロチヤート、第２図は本考案のウエ
ハ周辺部の研削の拡大図、第３図は従来の例を示
す断面図、第４図は従来のウエハ周辺部研削の拡
大図、第５図は従来のウエハ裏面研削の拡大図で
ある。
１……Ｐｏｌｙｓｉ、２……ｓｉ単結晶ウエハ
、３……ワークヘツド、４……吸着口、５……砥
石回転軸、６……フレキシブル砥石、７……砥石
台、８……ガイドレール、９……モータ、１０…
…周辺部にまわり込み成長したＰｏｌｙｓｉ、１
１……裏面にまわり込み成長したＰｏｌｙｓｉ、
１２……速度制御部、１３……送り部。
Fig. 1a is a cross-sectional view showing an embodiment of the present invention, Fig. 1b is a flowchart of the same, Fig. 2 is an enlarged view of grinding the wafer periphery of the present invention, and Fig. 3 is a cross-section showing a conventional example. 4 is an enlarged view of conventional wafer periphery grinding, and FIG. 5 is an enlarged view of conventional wafer back surface grinding. 1... Polysi, 2... Si single crystal wafer, 3... Work head, 4... Suction port, 5... Grinding wheel rotating shaft, 6... Flexible grinding wheel, 7... Grinding wheel stand, 8... Guide rail, 9 ...Motor, 10...
...Polysi grew around the periphery, 1
1... Polysi that has grown around the back side,
12... Speed control section, 13... Feeding section.
Claims (1)
転するワークヘツドと、該ワークヘツドに保持さ
れた半導体ウエハの直径方向に変位させる砥石台
と、前記ワークヘツドの軸心に対し傾きをもつて
該砥石台に保持された砥石回転軸と、該砥石回転
軸に軸支され、半導体ウエハの裏面に一定の切り
込み量をもつて接触するフレキシブル砥石と、前
記砥石回転軸の速度制御を行う速度制御部と、前
記砥石台を半導体ウエハの周辺部に対応する特定
位置で往復動させた後に半導体ウエハの中心方向
に沿つて直線変位させる送り部とを有することを
特徴とする裏面クラウン除去装置。 A workhead that attracts the surface of a semiconductor wafer and rotates the wafer at a constant speed, a grindstone that displaces the semiconductor wafer held by the workhead in the diametrical direction, and a grindstone that is tilted relative to the axis of the workhead. a held grindstone rotation shaft; a flexible grindstone supported by the grindstone rotation shaft and in contact with the back surface of the semiconductor wafer with a constant cutting amount; a speed control section that controls the speed of the grindstone rotation shaft; 1. A back crown removal device comprising: a feed section that reciprocates a grindstone head at a specific position corresponding to the periphery of the semiconductor wafer and then linearly displaces it along the center direction of the semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9183287U JPH052278Y2 (en) | 1987-06-15 | 1987-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9183287U JPH052278Y2 (en) | 1987-06-15 | 1987-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63201047U true JPS63201047U (en) | 1988-12-26 |
| JPH052278Y2 JPH052278Y2 (en) | 1993-01-20 |
Family
ID=30952974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9183287U Expired - Lifetime JPH052278Y2 (en) | 1987-06-15 | 1987-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH052278Y2 (en) |
-
1987
- 1987-06-15 JP JP9183287U patent/JPH052278Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH052278Y2 (en) | 1993-01-20 |