JPS6320458U - - Google Patents
Info
- Publication number
- JPS6320458U JPS6320458U JP1986113400U JP11340086U JPS6320458U JP S6320458 U JPS6320458 U JP S6320458U JP 1986113400 U JP1986113400 U JP 1986113400U JP 11340086 U JP11340086 U JP 11340086U JP S6320458 U JPS6320458 U JP S6320458U
- Authority
- JP
- Japan
- Prior art keywords
- light
- cavity
- emitting element
- light emitting
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Description
第１図は本考案の一実施例に係る光半導体装置
の断面図、第２図及び第３図は第１図の変形例を
示す光半導体装置の断面図である。 図中、１，１１，２１は本体の例示であるチツ
プキヤリア、デユアルインラインパツケージ、角
形パツケージ、２はキヤビテイ、３は発光素子又
は受光素子、４は受光素子又は発光素子、６は光
透過蓋としての光透過用ガラス窓蓋である。
の断面図、第２図及び第３図は第１図の変形例を
示す光半導体装置の断面図である。 図中、１，１１，２１は本体の例示であるチツ
プキヤリア、デユアルインラインパツケージ、角
形パツケージ、２はキヤビテイ、３は発光素子又
は受光素子、４は受光素子又は発光素子、６は光
透過蓋としての光透過用ガラス窓蓋である。
Claims (1)
- 本体の表裏に光素子の入るキヤビテイをそれぞ
れ形成し、一方のキヤビテイに発光素子又は受光
素子を、他方のキヤビテイに受光素子又は発光素
子を背中合せに且つ光軸を一致させて組み込み、
光透過蓋でキヤビテイを封止したことを特徴とす
る光半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986113400U JPS6320458U (ja) | 1986-07-25 | 1986-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986113400U JPS6320458U (ja) | 1986-07-25 | 1986-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320458U true JPS6320458U (ja) | 1988-02-10 |
Family
ID=30995167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986113400U Pending JPS6320458U (ja) | 1986-07-25 | 1986-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320458U (ja) |
-
1986
- 1986-07-25 JP JP1986113400U patent/JPS6320458U/ja active Pending