JPS63215547A - Electric resistor and manufacture - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thick film type electrical resistor provided on a fixed chip resistor or a circuit wiring board, etc., and particularly to a thick film type electrical resistor that can be obtained by firing in a non-oxidizing atmosphere. This invention relates to a possible electrical resistor and its manufacturing method.

Conventional technology The electrical circuits of electronic devices are often constructed by mounting various electrical elements such as resistors, capacitors, diodes, and transistors on circuit boards, but as electronic devices become smaller, these Circuit boards that can further improve the mounting density of electrical elements have come into widespread use.

The resistors installed on these circuit boards are either thick film resistors formed by printing and baking resistor material paste directly onto the circuit, or a pair of electrodes formed at both ends of a square plate-shaped ceramic chip. There are also fixed chip resistors in which the thick film resistor is formed so as to span both electrodes.

Conventionally, in order to provide such a thick film resistor on a circuit board,
For example, a conductive material paste such as Ag or Ag-Pd is applied to the surface of an alumina substrate obtained by firing at around 1500°C, and after baking, a paste containing, for example, Runt as a resistor material is applied by screen printing, etc. However, it is common practice to bake the film at 750 to 850°C, and then adjust the resistance value by trimming or the like if necessary.

However, in recent years, electronic devices have become lighter, thinner, and smaller.
The demand for lower costs has become even stronger, and efforts are being made to further reduce the size and cost of circuit boards.

As concrete measures to reduce the size of the former, firstly, the circuit board is multilayered, and secondly, the resistor is built inside. Examples of multilayer circuit boards include Ag or A.
Examples include multilayer wiring boards obtained by laminating and crimping ceramic green sheets (green sheets) printed with conductor material paste such as g-Pd, and then simultaneously firing them in the atmosphere at 800 to 1100°C; As an example of internalization, a RuO□ resistance material antibody material paste is further applied on a ceramic green sheet printed with the conductor material paste, laminated and crimped in the same manner as above, and then co-fired to create a resistor body. Multilayer wiring boards and the like are known.

In addition, as a specific measure to reduce the cost of the latter, in place of expensive noble metal conductor materials such as Ag or Ag-Pd materials, inexpensive base metal conductor materials such as Ni or Cu can be used. These are co-fired with green ceramics at 800-1100℃ in a neutral or reducing non-oxidizing atmosphere such as nitrogen gas or nitrogen gas containing hydrogen, which can avoid high resistance due to oxidation. Multilayer wiring boards obtained by this method have been put into practical use. Furthermore, as described in Japanese Patent Application Laid-Open No. 153702/1982, a resistor material made of Mo5iz-TaSiz and glass is coated on an alumina substrate having a copper (Cu) conductor, and the thickness obtained by heat treatment is Film resistors and the like are also known.

Problems to be Solved by the Invention However, in order to reduce the size and cost of circuit boards at the same time, it is necessary to simultaneously reduce the size and cost of the circuit board. A reduction reaction occurs, and the resistance value decreases, so that it no longer exhibits characteristics as a resistor.

Furthermore, when a resistor material made of Mo5iz-TaSiz and glass is co-fired with a green ceramic sheet in a non-oxidizing atmosphere, the fired body may warp due to differences in the expansion and contraction rates of the two, and the MO5iz-TaSize
There is a problem that gas is generated due to the decomposition reaction of Siz, which tends to cause blistering in the fired product. In order to improve this, it is known that a resistor material made of Mo5iz-metal fluoride (e.g. calcium fluoride) and glass is used, as described in JP-A-60-198703. , No warping or blistering during firing as mentioned above was observed.

However, when the thick film resistor obtained by coating this Mo5iz-metal fluoride and glass resistor material on a green ceramic sheet and co-firing it, the resistance of 5 to 10 % increase in resistance value is observed, and the prescribed function as a resistor cannot be performed.

In addition, the above-mentioned conventional electrical resistor has a temperature change coefficient of resistance value not smaller than 11000 pp/'e,
There was a problem as a resistor element for a circuit that requires precise operation.

Therefore, in another application filed on the same day as this application, we proposed that not only can it be used as a fixed chip resistor, but it can also be mounted on a circuit board using a base metal conductor, laminated, fired, and incorporated into a multilayer board to maintain a stable resistance value. It was shown that it is possible to obtain an electrical resistor.

However, it has been desired to further reduce the temperature change coefficient of the resistance value of this electrical resistor.

An object of the present invention is to provide an electrical resistor that can not only be used in fixed chip resistors or general circuit boards, but also can be laminated with base metal conductor materials and incorporated into multi-layer boards, and which has a high resistance. An object of the present invention is to provide an electrical resistor that can reduce the coefficient of temperature change.

Another object of the present invention is to provide a manufacturing method that can improve the characteristics of the electrical resistor.

Means for Solving the Problems In order to solve the above problems, the present invention provides an electrical resistor characterized by having a fired body containing a zinc molybdate and an alkaline earth metal fluoride. It provides:

Further, the present invention heat-treats a resistor material containing at least one of zinc molybdate and its precursor as a main component and an alkaline earth metal fluoride, and obtains a resultant product by this heat treatment. Provided is a method for producing an electrical resistor, which method comprises firing a resistor material prepared using the above method to obtain an electrical resistor comprising a fired resistor material containing a zinc molybdate and an alkaline earth metal fluoride. It is something.

Next, the present invention will be explained in detail.

Zinc molybdate in the present invention includes, for example, Zn
Examples include a single substance such as MoO4, ZnMozOt, Zn5M0zOq, or a mixture thereof.

Such zinc molybdate can be synthesized by heat treatment of zinc oxide and molybdenum oxide (MOOJ), but it can also be synthesized by heat treatment using its precursor.

In the present invention, it is preferable to use a binder,
This includes glass, and generally known glasses can be used as this glass, and it is not limited to glasses with a specific composition, but examples include Pb5Oa, BizO
Oxides such as i, SnO2, and CdO may be reduced and metalized when resistor materials containing them are fired in a non-oxidizing atmosphere, and this metal changes the resistance value. If such occurrence is undesirable, it is preferable not to contain these oxides.

Glass components include Sing, 1hoz, ZnO,
CaO1SrO1zrO2 etc. are preferable, and the composition ratio of these oxides is as follows: 5i0212-33 wt% BzO*20-35 wt9 ZnO or Sr0 13-33 MM%Ca010-
25% by weight Zr0z 15-45% by weight is preferred.

In order to manufacture glass from a composition of these oxides, the respective oxides are weighed and mixed to achieve the above composition ratio. This mixture is placed in a crucible and melted at a temperature of 1200 to 1500°C, and then the melt is poured into water, for example, and rapidly cooled to obtain coarse glass powder.

Glass powder is obtained by pulverizing this coarse powder to a desired particle size (for example, 10 μm or less) using a pulverizing means such as a ball mill or a vibration mill.

In the above, a mixture of pure oxides was used, but the glass is not limited to this, as long as the result is a mixture of each oxide. For example, CaO (calcium oxide), CaC05 (calcium carbonate), BJz (
Since boron oxide) is obtained by heat treatment of boric acid (HJ(h), CaC01, HzBO instead of part or all of CaO, l1hOx, respectively.

can be used. The same applies to oxides of other components.

In addition, the alkaline earth metal fluoride used in the present invention is represented by the general formula MeF 2 when Me is a metal, and Me is an alkaline earth metal, that is, Mg,
It is preferable to use Ca, SrbBa, and use one or more of these metal salts in combination.

However, not only these alkaline earth metal fluorides but also other metal fluorides can be used.

The zinc molybdate, glass powder, and alkaline earth metal fluorides obtained as described above may be mixed and used as resistor materials as they are, but they may be heat-treated and pulverized to form resistor materials. It is preferable to use it as a material in view of the resistance temperature characteristics of a resistor obtained by firing it. The heat treatment temperature is preferably 800°C to 1200°C,
If it deviates from this range, the resistance value of the finished resistor will be easily affected by subtle fluctuations in the composition ratio due to the working conditions of each process of processing the resistor material into an electrical resistor, and the desired resistance value will be stabilized. It's hard to get. This heat treatment is preferably performed in a non-oxidizing atmosphere, and it is preferable to use not only nitrogen gas and other active gases, but also a mixed gas containing hydrogen gas.

The composition ratio of each component of the resistor material is 60 to 95% by weight of zinc molybdate and 4.5 to 39.5% by weight of glass powder.
, 0.5 to 25% by weight of alkaline earth metal fluoride is preferred. Zinc molybdate is too low from this range,
If there is too much glass, the resistance value of the electrical resistor produced by firing may become too high, which is undesirable.On the other hand, if there is too much zinc molybdate and too little glass, the sintering during firing may be too high. It may become difficult to hold it stably on the circuit board. However, when the resistor is embedded in a laminated circuit board, the amount of zinc molybdate and alkaline earth metal fluoride is higher than the above range, and 100%
% is also fine. In addition, alkaline earth metal fluoride is 0.5
Even if it is less than 25% by weight or more than 25% by weight, the temperature change coefficient of the finished electrical resistor will be ±500 pp.
m/'C, which may be undesirable. However, materials outside this range can also be used as long as the temperature change coefficient of resistance is improved.

To create a resistor for a fixed chip resistor or a thick film resistor from the resistor material powder obtained in this way, for example, the resistor material powder is applied to a ceramic green sheet and fired. In order to carry out this coating, a vehicle is mixed with these resistor material powders to prepare a coating liquid so that, for example, silk screen printing can be performed. This vehicle is preferably one that can be burned out in the pre-firing stage, and for this purpose, the resin is dissolved or dispersed in an organic vehicle, that is, an organic solvent, and if necessary, a plasticizer,
It is preferable to add various additives such as a dispersant. Examples of the organic solvent include butyl carbitol acetate, butyl carbitol, and turpentine oil, and examples of the resin include cellulose derivatives such as ethyl cellulose and nitrocellulose, and other resins.

The usage ratio of this organic vehicle and the resistor material powder varies depending on the organic solvent, resin, etc. used, but the usage ratio of the organic solvent and resin is 20 to 50% by weight for the former and 80% for the latter.
~50% is appropriate. These components are made into a paste using a mixing means such as a three-roll mill or a sieve.

The resistor material paste obtained in this way is applied to a substrate, which is further processed as described below to create a resistor. In addition to a method in which a ceramic green sheet is fired in advance, a resistor material and a conductor material are further applied thereto, and then fired. These can also be applied when forming a laminate.

The ceramic green sheets include, for example, 35 to 45% by weight of aluminum oxide (A1zoz), 25 to 35% by weight of silicon oxide (St(h), and boron oxide (BzOi).
) 10~15%, calcium oxide (Cab) 7~
For example, a slurry prepared by mixing an oxide mixture of ceramic constituents such as 13% by weight and 7 to 10% by weight of magnesium oxide (MgO) with an organic vehicle using a ball mill or the like may be formed into a sheet using a doctor blade or the like. At this time, if glass is not used in combination with zinc molybdate,
The ceramic green sheet may contain a large amount of glass to produce the same effect as when glass is used in combination. The organic vehicle is comprised of an acrylic resin such as an acrylic ester, a resin such as polyvinyl butyral, a plasticizer such as glycerin or diethyl phthalate, a dispersant such as a carboxylic acid salt, and a solvent such as water or an organic solvent.

The resistor material paste is applied to a ceramic green sheet by means such as silk screen printing,
After drying, it is preferable that the resin component is decomposed and burned by heat treatment at 400 to 500°C.

At this time, a paste of a base metal conductor material such as Ni or Cu or a noble metal conductor material such as Ag or Ag-Pd is also applied to the ceramic green sheet in the same way as the resistor material paste coating film, and the paste is also applied to the ceramic green sheet in the same way as the resistor material paste coating. will be processed.

This base metal conductor material such as Ni or Cu or Ag
Alternatively, a paste composition of Ag-Pd blue gold* conductor material is exemplified by adding 2 to 15 weight % of glass flift to 98 to 85 weight % of each metal powder.

In this way, the resistor material and/or conductor material is incorporated into the ceramic green sheet, but in the case of a fixed chip resistor, only the surface of this unfired substrate is incorporated, and in the case of a thick film resistor of a multilayer substrate, the resistor material and/or the conductor material are incorporated into the ceramic green sheet. The body material and conductor material assembled in an unfired state are further laminated to form a predetermined circuit, and then fired. By this firing, the conductor material and/or the thick film resistor material can be made into a fired body at the same time as the substrate.

In this case, when a base metal conductor material such as Ni or Co is used as the conductor material, it is preferable to sinter it in a non-oxidizing atmosphere in order to prevent a high resistance value due to oxidation, and the sintering temperature is , e.g. 800℃~1100℃
℃, 0.5 hours to 2 hours is exemplified. As the non-oxidizing atmosphere, nitrogen gas, other active gases, and mixed gases containing these gases and hydrogen gas may also be used. Furthermore, when using a noble metal conductor material such as Ag or Ag-Pd, it can also be fired in an oxidizing atmosphere such as air.

A circuit wiring board incorporating a conductor and/or a resistor is completed as described above, but cracks, distortions, and distortions may occur not only between the fired board and the conductor but also between the fired board and the resistor due to firing. In addition to not causing blistering, the resistance value of the resistor is suppressed to change within ±2% even if it is left in a high humidity atmosphere for more than 1000 hours, ensuring high reliability. The temperature change coefficient of the resistance value can also be set to below ±500ppra/''C, for example. This is because the resistor matches well with the conductor and the fired substrate, and because the resistor is well matched with the conductor and the fired substrate, and because of the resistance to zinc molybdate and alkali earth metal fluoride. This is thought to be due to the unique moisture resistance of the resistor made of fired glass, but the details are not clear. X-ray diffraction analysis revealed that zinc molybdate and alkaline earth metal fluoride were found in the resistor. can be recognized.

In the present invention, a zinc molybdate may be used as described above, but instead of this zinc molybdate, a part or all of a precursor that becomes a zinc molybdate by heat treatment can also be used. In any of these cases, it is preferable to mix it with glass and heat treat it, then crush it and use it as a resistor material. However, a paste made by mixing it with the above-mentioned organic vehicle, etc. without performing this heat treatment can be used, for example, as a green ceramic sheet. It is also possible to directly create a resistor by coating the material on the surface of the material, heating it to remove organic matter, and then firing it.

In addition, the glass may be placed in a state where the mixed material of the oxides constituting it is fired together with the molybdate of zinc and the fluoride of the alkaline earth metal, and the precursors of these oxides are Part or all of this oxide, together with zinc molybdate and/or its precursor and alkaline earth metal fluoride, is made into a paste state as described above, and this is applied to the substrate to burn out the organic matter and then In any of the firing processes, a glass consisting of the above glass components is formed, and by firing this with zinc molybdate and/or its precursor, and an alkaline earth metal fluoride, a resistor can be made. It's good to have. For example, CaO (calcium oxide), which is a component of glass material, is CaC0z (
Heating of calcium carbonate), B20: Since l (boron oxide) is obtained from heating of boric acid (HzBO*), CaO,
CaC0J instead of part or all of BzOz, respectively
s LBO3 can be used.

The resistor material in the present invention may be any material as long as its main components are zinc molybdate, glass, and alkaline earth metal fluoride as a result of the treatment process.

Example Next, the present invention will be explained in detail.

Example 1 Each component was weighed and mixed to have the composition shown in Table 1 in terms of oxide.

Table 1 In the table, the unit is multilayer %.

Each of the mixtures of Glass A and Glass B was separately melted in an alumina crucible at 1400°C, and the melt was poured into water and rapidly cooled. Take out this quenched material, put it in a bot mill with ethanol, and use an alumina ball for 24 hours.
The glass powder was pulverized for a period of time to obtain a glass powder with a particle size of 10 μm or less.

Zinc molybdate was also obtained from molybdenum oxide and zinc oxide.

Next, the glass powders of Glass ^ and Glass B obtained above, the zinc molybdate and alkaline earth metal fluoride obtained above were weighed and mixed in the proportions shown in Table 2. .

Table 2: When using lead molybdate and fluoride together>
211) Table 2 (Continued) 112 (Continued) Each of the above samples was heated at 1000°C in a gas atmosphere of nitrogen (Nz) 9B, 5 vol 1% and hydrogen (H2) 1.5 vol 1%.
The resultant was heat-treated for 1 hour, then ground with ethanol in a bot mill, and dried to obtain resistor material powder of heat-treated powder of glass, molybdate, and fluoride having a size of 10 μm or less steel.

Next, 25 parts by weight of an organic vehicle (90 parts by weight of butyl carbitol, 10 parts by weight of ethyl cellulose) were added to 100 parts by weight of the resistor material powder of each sample and mixed in a roll mill to obtain a resistor material paste.

On the other hand, Ajl! 20z 40.0% by weight, SiO□35
．． 0% by weight, Bz (h13.0% by weight, 7.0% by weight of CaO, 85.0% by weight of Mg), 8 parts by weight of polyvinyl butyral, 8 parts by weight of diethyl phthalate, 0.0 parts by weight of oleic acid. 5 parts by weight, 710 parts by weight of acetate, 20 parts by weight of isopropyl alcohol, and 20 parts by weight of methyl ethyl ketone were mixed in a ball mill to prepare a slurry, and after defoaming treatment, a long ceramic green with a thickness of 200 μm was prepared using a doctor blade method. A sheet was produced. From this ceramic green sheet, a green sheet piece with 6 vertically sized and 9 cranes horizontally and a green sheet piece with 6 vertically sized and 9 cranes horizontally were cut out.

Next, as shown in FIG.
parts by weight and 5 parts by weight of ethyl cellulose were mixed using a three-roll mill, and a conductive material paste was silk screen printed and dried at 125° C. for 10 minutes to form a thick conductive material coating film 2. Next, the resistor material paste obtained above was silk screen printed on the green sheet piece 1 in the same manner as described above, and dried at 125° C. for 10 minutes to form a resistor material coating film 3.

Next, on top of the green sheet piece 1, stack the green sheet piece 4 of 6 lengths and 9 widths obtained above as shown by the chain lines in the figure.
The green sheet piece 1.4, the conductive material coating 2, and the resistor material coating are bonded by thermocompression at 0°C and 150g/ctA at 400 to 500°C in an oxidizing atmosphere such as air. Each residual organic substance in the membrane 3 is decomposed and burned.

After removing organic matter in this way, Hz 9B, 5v
o1%, Hz 1.5 vo1% mixed gas, 95
After firing at 0° C. for 1 hour, as shown in FIG. Thick film conductor 2a, thick film resistor 3a of fired body of resistor material coating 3
We have completed a multilayer ceramic substrate with In this multilayer substrate, no warpage or bulges as shown in FIGS. 3 and 4, which will be described later, were observed.

The multilayer ceramic substrate of the fired body (sample No. 1) thus obtained was polished in the layer direction to expose the resistor layer,
This exposed resistor layer was analyzed by X-ray diffraction (CuKα rays), and the obtained results are shown in Figure 5. From this, it was possible to confirm the type of molybdate and the type of fluoride in the specimen. did it.

Next, the resistance value (R□) of this multilayer ceramic substrate 3a at 25°C and the resistance value (R1) when heated to 125°C
□) was measured using a digital multimeter, and the temperature coefficient of resistance (TCR) was determined using the following formula.

Shown in 2.

In addition, the multilayer ceramic substrate obtained above was heated at 60°C for 9
25℃ after 1000 hours under 5% relative humidity
Table 2 shows the results of measuring the resistance value and calculating the rate of change.

In addition, each electrical resistor made using a sample from each sample fish with alkaline earth metal fluoride removed was measured in the same manner as above, and the obtained results were compared to the sample size in Table 2. Each is shown in Table 3.

Example 2 In Example 1, nitrogen (Nz) for the mixture of molybdate, alkaline earth metal fluoride and glass powder
A multilayer ceramic substrate was prepared from the resistor materials shown in Table 13 in the same manner as above, except that no heat treatment was performed at 1000°C for 1 hour in a gas atmosphere of 98.5vo1%, hydrogen (Hz) 1.5vo1%. As in Example 1, R2,,T
CP and resistance value change rate were determined and shown in Table 4.

Although not shown, the type of molybdate and the type of fluoride can be confirmed by X-ray diffraction analysis of the fired body of this example as well.

(Margins below this page) Back 3 (When not using molybdate and calcium chloride together)i
L 3 (Continued) Comparative Example 1 (MoSiz-TaSiz glass-based resistor material antibody material A mixture of 16 parts by weight of iz and 9 parts by weight of Ta5iz was heated in the air at 1400°C, and the product was heated with ethanol in an alumina ball in a Bot mill for 24 hours. A fine powder of 10 μm or less was obtained by grinding for a time and drying.BaO, BzO
: +, 5 parts by weight of a glass frifuhyf consisting of MgO, CaO, and Sing, b1, and 25 parts by weight of an organic vehicle (20 parts by weight of butyl calpitol, 5 parts by weight of ethyl cellulose) were added and mixed in a roll mill to obtain a resistor material paste. Ta.

A multilayer ceramic substrate was obtained in the same manner as in Example 1 except that this resistor material paste was used.

As a result, the ceramic green sheet was coated with a resistor material coating, heat-treated to remove organic matter, and then fired simultaneously. As shown in Figure 3, warpage is observed,
Furthermore, as a result of the decomposition reaction of Mo5iz and TaSi, SiO□ gas was generated, causing blistering as shown in FIG. 4, making it impossible to put it to practical use. Note that lla is the ceramic layer N1a, 14a is the ceramic layer 4a, and 13a is the ceramic layer and thick film resistor corresponding to the thick film resistor 3a, respectively.

Comparative example 2 (MoSi, -BaF, glass-based resistor material)
MoSiz 70 parts by weight, Bad, 20 parts by weight, and S
ing, Zn.

10 parts by weight of a glass lift consisting of ZrO2, Ca0z, and Al203 were mixed in a ball mill, and the resulting powder was heat-treated at 1200°C in an argon (Ar) gas atmosphere, and then mixed with ethanol in an alumina pole in a Bottle mill. It was ground for 24 hours and dried to obtain a fine powder of 10 μm or less.

A multilayer ceramic substrate was obtained in the same manner as in Example 1 except that this resistor material paste was used.

Table 5 shows the Rzs, TCP, and rate of change in resistance value obtained for the thick film resistor of this multilayer ceramic substrate in the same manner as in Example 1.

From the above results, all of the multilayer ceramic substrates of the examples have no warping or blistering, and the rate of change in resistance value is within ±2%, and the TCP is ±500 ppm/°C, especially when the resistor material is heat-treated. On the other hand, it can be seen that the multilayer ceramic substrate of Comparative Example 1 has warpage, and the multilayer ceramic substrate of Comparative Example 2 has a rate of change in the resistance value of the resistor that is four times larger.

Effects of the Invention According to the present invention, it is possible to supply an electrical resistor containing zinc molybdate and alkaline earth metal fluoride. If a resistor material is used to form a resistor by firing a ceramic green sheet together with a base metal conductor material in a non-oxidizing atmosphere, for example, the fired body may warp or bulge due to firing. In addition, not only can the temperature change of the resistor be reduced, but also the temperature change coefficient of the resistance value of the resistor can be, for example, ±500 ppm/'C or less.

As a result, it is possible to meet the demands for both miniaturization and cost reduction of circuit boards incorporating resistors, and it is also possible to provide excellent electronic components for electronic devices that require precise operation.

In addition, heat treatment of zinc molybdate and alkaline earth metal fluoride can reduce the absolute value of the temperature change coefficient of the resistor compared to those that are not treated, making it suitable for electrical circuits that require precise operation. We can supply resistors with excellent characteristics.

[Brief explanation of the drawing]

Fig. 1 is a diagram showing an example of a state in which a resistor material coating film and an electrode material coating film before firing are formed on a substrate to form a multilayer structure when manufacturing the electrical resistor of the present invention, and Fig. 2 is a cross-sectional view of the fired body, FIG. 3 is a cross-sectional view of the fired body formed into a multilayer structure using conventional resistor material, and FIG. 4 is an explanatory diagram when gas is generated in the fired body. FIG. 5 is an X-ray diffraction diagram when detecting magnesium molybdate and calcium fluoride from an electrical resistor according to an embodiment of the present invention. In the figure, 1.4 is a green sheet piece, 2 is a conductive material coating,
3 is a resistor material coating, 1a and 4a are ceramic layers, 2a is a thick film conductor, and 3a is a thick film resistor. February 28, 1988 Figure 1 Figure 3 Figure 4

Claims (5)

[Claims] (1) An electrical resistor characterized by having a fired body containing a zinc molybdate and an alkaline earth metal fluoride. (2) The fired body is fired from a resistor material containing at least one of zinc molybdate and its precursor and an alkaline earth metal fluoride as a main component. The electrical resistor according to range 1. (3) The main components of the resistor material are 60 to 95% by weight of at least one of zinc molybdate and its precursors, and 0% alkaline earth metal fluoride. .5-25% by weight and glass 4.5-39
．． The electrical resistor according to claim 2, characterized in that the content is 5% by weight. (4) Resistance obtained by heat-treating a resistor material containing at least one of zinc molybdate and its precursor as a main component and an alkaline earth metal fluoride as a main component; 1. A method for producing an electrical resistor, the method comprising: obtaining an electrical resistor comprising a fired body containing a zinc molybdate and an alkaline earth metal fluoride. (5) The main components of the resistor material before heat treatment are 60 to 95% by weight of at least one of zinc molybdate and its precursor, and alkaline earth metal. Fluoride 0.5-25% by weight and glass 4
．． 5. The method of manufacturing an electrical resistor according to claim 4, wherein the content is 5 to 39.5% by weight.