JPS63216353A - フイルムキヤリア - Google Patents

フイルムキヤリア

Info

Publication number
JPS63216353A
JPS63216353A JP62050693A JP5069387A JPS63216353A JP S63216353 A JPS63216353 A JP S63216353A JP 62050693 A JP62050693 A JP 62050693A JP 5069387 A JP5069387 A JP 5069387A JP S63216353 A JPS63216353 A JP S63216353A
Authority
JP
Japan
Prior art keywords
conductive line
plating
wiring lead
plating use
film substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62050693A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0466385B2 (2
Inventor
Yoshio Suzuki
鈴木　美雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindo Denshi Kogyo KK
Original Assignee
Shindo Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindo Denshi Kogyo KK filed Critical Shindo Denshi Kogyo KK
Priority to JP62050693A priority Critical patent/JPS63216353A/ja
Publication of JPS63216353A publication Critical patent/JPS63216353A/ja
Publication of JPH0466385B2 publication Critical patent/JPH0466385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
JP62050693A 1987-03-05 1987-03-05 フイルムキヤリア Granted JPS63216353A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62050693A JPS63216353A (ja) 1987-03-05 1987-03-05 フイルムキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62050693A JPS63216353A (ja) 1987-03-05 1987-03-05 フイルムキヤリア

Publications (2)

Publication Number Publication Date
JPS63216353A true JPS63216353A (ja) 1988-09-08
JPH0466385B2 JPH0466385B2 (2) 1992-10-23

Family

ID=12866003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62050693A Granted JPS63216353A (ja) 1987-03-05 1987-03-05 フイルムキヤリア

Country Status (1)

Country Link
JP (1) JPS63216353A (2)

Also Published As

Publication number Publication date
JPH0466385B2 (2) 1992-10-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees