JPS63226053A - 混成集積チツプモジユ−ル - Google Patents
混成集積チツプモジユ−ルInfo
- Publication number
- JPS63226053A JPS63226053A JP62059358A JP5935887A JPS63226053A JP S63226053 A JPS63226053 A JP S63226053A JP 62059358 A JP62059358 A JP 62059358A JP 5935887 A JP5935887 A JP 5935887A JP S63226053 A JPS63226053 A JP S63226053A
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- electrodes
- internal
- hybrid integrated
- wiring circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62059358A JPS63226053A (ja) | 1987-03-13 | 1987-03-13 | 混成集積チツプモジユ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62059358A JPS63226053A (ja) | 1987-03-13 | 1987-03-13 | 混成集積チツプモジユ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63226053A true JPS63226053A (ja) | 1988-09-20 |
| JPH0558665B2 JPH0558665B2 (2) | 1993-08-27 |
Family
ID=13110962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62059358A Granted JPS63226053A (ja) | 1987-03-13 | 1987-03-13 | 混成集積チツプモジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63226053A (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6774500B1 (en) * | 1999-07-28 | 2004-08-10 | Seiko Epson Corporation | Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment |
-
1987
- 1987-03-13 JP JP62059358A patent/JPS63226053A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6774500B1 (en) * | 1999-07-28 | 2004-08-10 | Seiko Epson Corporation | Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0558665B2 (2) | 1993-08-27 |
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