JPS6322678Y2 - - Google Patents

Info

Publication number
JPS6322678Y2
JPS6322678Y2 JP1983008664U JP866483U JPS6322678Y2 JP S6322678 Y2 JPS6322678 Y2 JP S6322678Y2 JP 1983008664 U JP1983008664 U JP 1983008664U JP 866483 U JP866483 U JP 866483U JP S6322678 Y2 JPS6322678 Y2 JP S6322678Y2
Authority
JP
Japan
Prior art keywords
external
lead
insulator
external leads
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983008664U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59115653U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983008664U priority Critical patent/JPS59115653U/ja
Publication of JPS59115653U publication Critical patent/JPS59115653U/ja
Application granted granted Critical
Publication of JPS6322678Y2 publication Critical patent/JPS6322678Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1983008664U 1983-01-25 1983-01-25 絶縁物封止半導体装置 Granted JPS59115653U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983008664U JPS59115653U (ja) 1983-01-25 1983-01-25 絶縁物封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983008664U JPS59115653U (ja) 1983-01-25 1983-01-25 絶縁物封止半導体装置

Publications (2)

Publication Number Publication Date
JPS59115653U JPS59115653U (ja) 1984-08-04
JPS6322678Y2 true JPS6322678Y2 (mo) 1988-06-22

Family

ID=30140147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983008664U Granted JPS59115653U (ja) 1983-01-25 1983-01-25 絶縁物封止半導体装置

Country Status (1)

Country Link
JP (1) JPS59115653U (mo)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419799Y2 (mo) * 1986-05-22 1992-05-06
JPH0451489Y2 (mo) * 1987-03-31 1992-12-03
KR102192997B1 (ko) * 2014-01-27 2020-12-18 삼성전자주식회사 반도체 소자
JP6373332B2 (ja) * 2016-11-24 2018-08-15 三菱電機株式会社 パワーモジュールの製造方法
JPWO2024203066A1 (mo) * 2023-03-28 2024-10-03

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58209147A (ja) * 1982-05-31 1983-12-06 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS59115653U (ja) 1984-08-04

Similar Documents

Publication Publication Date Title
US9391006B2 (en) Semiconductor device and method of manufacturing semiconductor device
KR100958422B1 (ko) 고전압 응용에 적합한 구조를 갖는 반도체 패키지
US4937656A (en) Semiconductor device
US10720373B2 (en) Semiconductor power device with corresponding package and related manufacturing process
KR100337064B1 (ko) 플라스틱패키지내에패키지된반도체장치및그의제조용금형
US7705444B2 (en) Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section
US11742251B2 (en) Power semiconductor device including press-fit connection terminal
JP5776707B2 (ja) 半導体装置
EP0418891B1 (en) Moulded plastic power semiconductor device
KR100287243B1 (ko) Loc구조를갖는반도체장치및그제조방법
JP2006210500A (ja) 電力用半導体装置
JP3769228B2 (ja) 電力半導体装置
JPS6322678Y2 (mo)
JPH0328511Y2 (mo)
JPH0349400Y2 (mo)
JPH0414939Y2 (mo)
JP4329960B2 (ja) 複合半導体装置
JPS6322677Y2 (mo)
JPH0548356U (ja) 絶縁物封止半導体装置
JPH0349399Y2 (mo)
JPS6320121Y2 (mo)
JPH05326796A (ja) 半導体装置用パッケージ
JPS6130426B2 (mo)
US20250279339A1 (en) Semiconductor device and external connection main terminal
JPS638138Y2 (mo)