JPS6322737U - - Google Patents

Info

Publication number
JPS6322737U
JPS6322737U JP1986117220U JP11722086U JPS6322737U JP S6322737 U JPS6322737 U JP S6322737U JP 1986117220 U JP1986117220 U JP 1986117220U JP 11722086 U JP11722086 U JP 11722086U JP S6322737 U JPS6322737 U JP S6322737U
Authority
JP
Japan
Prior art keywords
die pad
wire bonder
lead frame
view
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986117220U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986117220U priority Critical patent/JPS6322737U/ja
Publication of JPS6322737U publication Critical patent/JPS6322737U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は第２図の―断面図、第２図は本考
案に係るワイヤボンダへのリードフレームの保持
状態を示す平面図、第３図ａおよびｂは同じくワ
イヤボンダの要部を示す平面図と断面図、第４図
ａおよびｂは他の実施例を示す平面図と断面図、
第５図および第６図はリードフレームの保持状態
を示す平面図と断面図、第７図は従来のワイヤボ
ンダを示す断面図、第８図ａおよびｂは半導体ペ
レツトを実装したリードフレームを示す平面図と
断面図、第９図はリードフレームを示す平面図、
第１０図および第１１図はリードフレームの保持
状態を示す平面図と断面図である。 １……固定ブロツク、２……ヒートブロツク、
３……リードフレーム、４……フレーム押さえ、
５……半導体ペレツト、６……ダイパツド、７…
…ダイパツド支え、９……外部リード、２１……
凹陥部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 基盤上にフレーム押さえによつてリードフ
    レームを弾性保持し、ダイパツド上の半導体ペレ
    ツトと外部リードとをワイヤ接続するワイヤボン
    ダにおいて、前記基盤に前記リードフレームのダ
    イパツドおよびダイパツド支えの一部を収納可能
    な凹陥部を形成したことを特徴とするワイヤボン
    ダ。 (2) 凹陥部の底面一部はテーパ面である実用新
    案登録請求の範囲第１項記載のワイヤボンダ。
JP1986117220U 1986-07-29 1986-07-29 Pending JPS6322737U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986117220U JPS6322737U (ja) 1986-07-29 1986-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986117220U JPS6322737U (ja) 1986-07-29 1986-07-29

Publications (1)

Publication Number Publication Date
JPS6322737U true JPS6322737U (ja) 1988-02-15

Family

ID=31002532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986117220U Pending JPS6322737U (ja) 1986-07-29 1986-07-29

Country Status (1)

Country Link
JP (1) JPS6322737U (ja)

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