JPS6367259U - - Google Patents

Info

Publication number
JPS6367259U
JPS6367259U JP1986160173U JP16017386U JPS6367259U JP S6367259 U JPS6367259 U JP S6367259U JP 1986160173 U JP1986160173 U JP 1986160173U JP 16017386 U JP16017386 U JP 16017386U JP S6367259 U JPS6367259 U JP S6367259U
Authority
JP
Japan
Prior art keywords
recesses
semiconductor chip
lead frame
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Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986160173U
Other languages
English (en)
Other versions
JPH06833Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986160173U priority Critical patent/JPH06833Y2/ja
Publication of JPS6367259U publication Critical patent/JPS6367259U/ja
Application granted granted Critical
Publication of JPH06833Y2 publication Critical patent/JPH06833Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案のリードフレームの一実施例を
示す平面図である。第２図ａは該実施例に用いる
半導体チツプの平面図、ｂは側面図である。第３
図及び第４図は実施例を説明するための図である
。第５図は第１図におけるＣ―Ｃ断面図、第６図
は同じくＡ―Ａ断面図、第７図は同じくＢ―Ｂ断
面図である。第８図は従来例を示す図である。 １……リードフレーム、１１……ダイパツド部
、２……半導体チツプ、１２……凹部、１３……
幅狭部。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプを載置するパツド部を支持する部
    材に複数の凹部が形成され、 該部材の凹部が形成される部分の少なくとも一
    部が幅狭に形成されたことを特徴とするリードフ
    レーム。
JP1986160173U 1986-10-21 1986-10-21 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム Expired - Lifetime JPH06833Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986160173U JPH06833Y2 (ja) 1986-10-21 1986-10-21 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986160173U JPH06833Y2 (ja) 1986-10-21 1986-10-21 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS6367259U true JPS6367259U (ja) 1988-05-06
JPH06833Y2 JPH06833Y2 (ja) 1994-01-05

Family

ID=31085307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986160173U Expired - Lifetime JPH06833Y2 (ja) 1986-10-21 1986-10-21 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPH06833Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918591U (ja) * 1972-05-19 1974-02-16
JPS558924U (ja) * 1978-06-30 1980-01-21

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918591U (ja) * 1972-05-19 1974-02-16
JPS558924U (ja) * 1978-06-30 1980-01-21

Also Published As

Publication number Publication date
JPH06833Y2 (ja) 1994-01-05

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