JPS63276596A - Ic card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card in which an IC module is embedded in a recessed portion of a card body.

[Conventional technology]

In order to make the IC card strong against bending and twisting, the applicant of the present invention has proposed an IC module in which the entire surrounding wall is covered with an elastic material (see Japanese Patent Laid-Open No. 58-210646).

[Problem that the invention seeks to solve]

When manufacturing the IC module, the following methods are used: ■ Inject an elastic material around the first molding material using a molding frame, or ■ Make a concave case of elastic material in advance and adhere it to the outside of the first molding material. to do, or ■
When embedding the completed first mold into the recess of the card body, embed the elastic material in the recess of the card body as a filler and adhesive, or Glue, then the first
The molded product is adhered to a concave case, resulting in an IC module having an elastic material on the outer periphery.

Therefore, in the case of ■, it is necessary to mold using a molding frame, in the case of ■■, the concave case must be manufactured with accurate dimensions, and in the case of ■, there is an excess or deficiency in the amount of elastic material, and if there is an excess, the IC card Each of items (1) to (2) required time and effort to manufacture, such as overflowing to the surface and having to be disposed of.

The present invention attempts to solve the above-mentioned conventional problems, and aims to provide an IC card in which an elastic material is provided between an IC module and a card body in a form that can be manufactured extremely easily. That is.

[Means for solving problems]

The present invention provides an IC card in which an IC module is embedded in a recess of a card body, which includes an elastic material between a circumferential part of the outer periphery of the IC module and a side wall of the recess facing the core. This is an IC card featuring:

[For production]

The present invention provides an IC card in which an IC module is embedded in a recess of a card body, which includes an elastic material between a part of the outer periphery of the IC module in the circumferential direction and a side wall of the recess facing the core. , when manufacturing the elastic material I
Since it is only necessary to arrange it between a part of the outer periphery of the C module in the circumferential direction and the side wall of the recess facing the core,
IC cards can be manufactured extremely easily.

[Example] Embodiments of the present invention will be described using the drawings.

1 has the IC module 3 in the recess of the card body 2, with its contacts 4 exposed on the surface of the IC card 1,
The IC card is embedded and formed, and 5 is a magnetic tape.

The IC module 3 consists of a module board 6, an IC chip 7 attached to the back side of the module board 6, a molding material 8 for molding the IC chip 7 and the back side of the module board 6, and the contacts 4 are provided on the front side of the module board 6. . The mold material 8 has a width of 11, for example, on the back side of the edge of the module board 6 that is parallel to the long side of the card and located in the center of the IC card 1 when embedded in the card body 2.
1, and an elastic material 9 with a diameter of 11 Im is provided in this area. That is, the elastic member 9 is disposed on the side where the largest bending moment occurs when the IC card 1 is bent so that the long sides are close to each other.

The card body 2 consists of a front overlay film 10, a center core 11, and a back overlay film 12, each made of vinyl chloride resin, and the IC module 3 and elastic material 9 are housed in the front overlay film 10 and the center core 11. A hole is provided through the card body 2 to form a recess, and the IC module 3 and the elastic material 9 are embedded in the recess to form the IC card 1 (so-called inset type). 13 is an adhesive layer.

As the elastic material 9, a rubber-based or silicon-based material is used.The method for deploying the elastic material 9 is to form the elastic material 9 into a desired shape in advance, and insert the IC module 3 into the recess of the card body 2.
At the same time or in advance, if necessary, it can be buried using an adhesive, or the elastic material 9 previously formed into a desired shape can be bonded to the IC module 3, and the integrated product can be buried in the recess. Depending on the material of the elastic material 9, an appropriate amount of jelly-like elastic material may be placed in the concave portion of the card body 2 where the elastic material 9 is placed, so that when the IC module 3 is embedded in the card body 2, An elastic member 9 may be formed between the IC module 3 and the side wall of the recess of the card body 2.

In addition, when using a material with poor adhesion such as silicone as the elastic material 9, in order to improve the adhesion of the elastic material 9 to the IC module 3 and card body 2, use a material that improves adhesion such as mesh. If the layers are stacked between each other, I
Even if the C card 1 is bent or twisted, the elastic material 9 can be prevented from peeling off from the IC module 3 or the card body 2.

In the above-mentioned embodiment, the elastic material is not provided all around the outer periphery of the IC module 3 as in the conventional case, but is provided only in a part of the outer periphery, so that the following manufacturing effects can be obtained. For example, compared to the conventional method of inserting a case by molding it into a case, it can be molded into a rod shape, which reduces the number of parts that require dimensional accuracy and greatly simplifies manufacturing.

In addition, for example, compared to the conventional manufacturing process in which a large amount of jelly-like elastic material was placed in the bottom of the recess in advance and the IC module was inserted to fill the gap, it is possible to deposit a small amount of jelly-like elastic material on a part of the side wall of the recess. Therefore, when the IC module 3 is pushed into the recess of the card body 2, there is little or very little elastic material spilling out from the gap, making the process extremely simple.

FIG. 3 shows another embodiment. The back side of the module board 6 is provided with a circuit board 14 and a frame board 15, each having an outer periphery that matches the outer periphery of the module board 6, and a molding material 8 is filled inside them to form a recess or a hole in the outer periphery. The IC module 3 is formed without a protrusion. Further, the front overlay film 10 is stacked (so-called laminate type) so that the edge and center portions of the IC module 3 are sandwiched between the front overlay film 10 and the back overlay film 12.

As in the above-described embodiment, the elastic material 9 is interposed between the outer circumference of the IC module 3 located parallel to the long side of the card and at the center of the IC card 1 and the side wall of the recess of the card body 2, The deployment method is also the same except that the above-mentioned embodiment is a built-in type, whereas this is a laminated type.

FIG. 4 shows a garment in which the laminate type example in FIG. 3 is replaced with an inset type.

These examples also have the effect of being extremely simple to manufacture, similar to the above.

Although the position of the elastic member 9 is not limited to the above-mentioned example, it is preferable that the elastic member 9 is provided on the side of the outer periphery of the IC module 3 where a large bending moment is likely to occur during normal use. For example, in FIG. 1, it is also preferable to provide it between the central outer peripheral part 16 parallel to the short side of the IC card 1 and the opposing side wall of the recess.

In the following example, the IC module 3 is rectangular, but if it is circular,
It can also be applied to other shapes. For example, in the case of a rectangular IC module, it is not limited to the space between one of the four peripheral edges and the side wall of the recess, but also on the peripheral edges that are parallel to each other, continuous to the closed peripheral edges, or interrupted at appropriate locations. do,
An elastic material 9 can also be provided.

〔Effect of the invention〕

The present invention provides an IC card in which an IC module is embedded in a recess of a card body, which includes an elastic material between a circumferential part of the outer periphery of the IC module and a side wall of the recess facing the core. Since the IC card is characterized by the following, the elastic material can be manufactured and deployed extremely easily, and therefore, an IC card in which the elastic material is provided between the IC module and the card body can be manufactured extremely easily. .

[Brief explanation of the drawing]

Fig. 1 is a plan view of an embodiment of the present invention, and Fig. 2 is its I-1.
The line sectional side view, FIGS. 3 and 4 are sectional views corresponding to the line 1-I line sectional side view of FIG. 1 of different embodiments, respectively. 1...IC card, 2...card body, 3...I
C module, 4... Contact, 5... Magnetic tape, 6... Module board, 7... IC chip, 8
... Mold material, 9... Elastic material, 10... Front overlay film, 11... Center core, 12...
・Back overlay film, 13...adhesive layer, 14
...Circuit board, 15...Frame board, 16...Outer peripheral part. Patent applicant Kyodo Printing Co., Ltd. Representative Patent Attorney Minoru Yakushi Representative Patent Attorney 1) Takatsugu Department Representative Patent Attorney
Masayuki Takagi Figure 4 Figure 1 Figure 2 Figure 3': j147815

Claims (1)

[Claims] (1) In an IC card in which an IC module is embedded in a recess of a card body, an elastic material is provided between a circumferential part of the outer periphery of the IC module and a side wall of the recess opposite to the part in the circumferential direction. Features of IC cards.