JPS63277536A - 電気回路用基板 - Google Patents

電気回路用基板

Info

Publication number
JPS63277536A
JPS63277536A JP11299487A JP11299487A JPS63277536A JP S63277536 A JPS63277536 A JP S63277536A JP 11299487 A JP11299487 A JP 11299487A JP 11299487 A JP11299487 A JP 11299487A JP S63277536 A JPS63277536 A JP S63277536A
Authority
JP
Japan
Prior art keywords
glass
substrate
thin film
copper alloy
mgo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11299487A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0436106B2 (da
Inventor
Shinichi Tai
田井　真一
Masatoshi Murakoso
村社　正敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Techno Glass Co Ltd
Original Assignee
Toshiba Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Glass Co Ltd filed Critical Toshiba Glass Co Ltd
Priority to JP11299487A priority Critical patent/JPS63277536A/ja
Publication of JPS63277536A publication Critical patent/JPS63277536A/ja
Publication of JPH0436106B2 publication Critical patent/JPH0436106B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Treatment Of Glass (AREA)
  • Glass Compositions (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inorganic Insulating Materials (AREA)
JP11299487A 1987-05-08 1987-05-08 電気回路用基板 Granted JPS63277536A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11299487A JPS63277536A (ja) 1987-05-08 1987-05-08 電気回路用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11299487A JPS63277536A (ja) 1987-05-08 1987-05-08 電気回路用基板

Publications (2)

Publication Number Publication Date
JPS63277536A true JPS63277536A (ja) 1988-11-15
JPH0436106B2 JPH0436106B2 (da) 1992-06-15

Family

ID=14600761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11299487A Granted JPS63277536A (ja) 1987-05-08 1987-05-08 電気回路用基板

Country Status (1)

Country Link
JP (1) JPS63277536A (da)

Also Published As

Publication number Publication date
JPH0436106B2 (da) 1992-06-15

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