JPH0436106B2 - - Google Patents

Info

Publication number: JPH0436106B2
Authority: JP; Japan
Prior art keywords: glass; thin film; copper alloy; substrate; total amount
Prior art date: 1987-05-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP11299487A

Other languages

English (en)

Japanese (ja)

Other versions

JPS63277536A (ja

Inventor

Shinichi Tai

Masatoshi Murakoso

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

AGC Techno Glass Co Ltd

Original Assignee

Toshiba Glass Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-05-08

Filing date

1987-05-08

Publication date

1992-06-15

1987-05-08 Application filed by Toshiba Glass Co Ltd filed Critical Toshiba Glass Co Ltd

1987-05-08 Priority to JP11299487A priority Critical patent/JPS63277536A/ja

1988-11-15 Publication of JPS63277536A publication Critical patent/JPS63277536A/ja

1992-06-15 Publication of JPH0436106B2 publication Critical patent/JPH0436106B2/ja

Status Granted legal-status Critical Current

Links

239000000758 substrate Substances 0.000 claims description 17
239000011521 glass Substances 0.000 claims description 13
239000010409 thin film Substances 0.000 claims description 10
229910000881 Cu alloy Inorganic materials 0.000 claims description 8
229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
229910004298 SiO 2 Inorganic materials 0.000 claims description 2
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
229920005989 resin Polymers 0.000 description 5
239000011347 resin Substances 0.000 description 5
239000010949 copper Substances 0.000 description 4
239000005368 silicate glass Substances 0.000 description 4
229920001342 Bakelite® Polymers 0.000 description 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
239000004637 bakelite Substances 0.000 description 2
230000007423 decrease Effects 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000002844 melting Methods 0.000 description 2
230000008018 melting Effects 0.000 description 2
239000002184 metal Substances 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
238000000034 method Methods 0.000 description 2
239000000126 substance Substances 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
239000005751 Copper oxide Substances 0.000 description 1
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
229910052681 coesite Inorganic materials 0.000 description 1
230000000052 comparative effect Effects 0.000 description 1
238000001816 cooling Methods 0.000 description 1
229910000431 copper oxide Inorganic materials 0.000 description 1
229910052593 corundum Inorganic materials 0.000 description 1
229910052906 cristobalite Inorganic materials 0.000 description 1
238000005553 drilling Methods 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
239000010408 film Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
239000010410 layer Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
239000011368 organic material Substances 0.000 description 1
238000005191 phase separation Methods 0.000 description 1
238000007747 plating Methods 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
239000000843 powder Substances 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
229910052682 stishovite Inorganic materials 0.000 description 1
239000002344 surface layer Substances 0.000 description 1
229910052905 tridymite Inorganic materials 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
229910001845 yogo sapphire Inorganic materials 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Surface Treatment Of Glass (AREA)
Glass Compositions (AREA)
Other Surface Treatments For Metallic Materials (AREA)
Manufacturing Of Printed Wiring (AREA)
Inorganic Insulating Materials (AREA)

JP11299487A 1987-05-08 1987-05-08 電気回路用基板 Granted JPS63277536A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP11299487A JPS63277536A (ja)	1987-05-08	1987-05-08	電気回路用基板

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP11299487A JPS63277536A (ja)	1987-05-08	1987-05-08	電気回路用基板

Publications (2)

Publication Number	Publication Date
JPS63277536A JPS63277536A (ja)	1988-11-15
JPH0436106B2 true JPH0436106B2 (da)	1992-06-15

Family

ID=14600761

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP11299487A Granted JPS63277536A (ja)	1987-05-08	1987-05-08	電気回路用基板

Country Status (1)

Country	Link
JP (1)	JPS63277536A (da)

1987
- 1987-05-08 JP JP11299487A patent/JPS63277536A/ja active Granted

Also Published As

Publication number	Publication date
JPS63277536A (ja)	1988-11-15

Publication	Publication Date	Title
US4632846A (en)	1986-12-30	Process for preparation of glazed ceramic substrate and glazing composition used therefor
JPS6236977B2 (da)	1987-08-10
US4664946A (en)	1987-05-12	Silicon carbide substrates and a method of producing the same
US4767672A (en)	1988-08-30	Process for preparation of glazed ceramic substrate and glazing composition used therefor
JPH03187947A (ja)	1991-08-15	少量の配化鉛および酸化鉄を含有する失透性ガラスの誘電体組成物
JPS62278145A (ja)	1987-12-03	ガラスセラミツク焼結体
US5763339A (en)	1998-06-09	Insulating glass composition
JPH0436106B2 (da)	1992-06-15
JPS6379739A (ja)	1988-04-09	ガラスセラミツク焼結体
JPS6410100B2 (da)	1989-02-21
JPH046045B2 (da)	1992-02-04
JPH057343B2 (da)	1993-01-28
JPH0360443A (ja)	1991-03-15	低温焼成ガラスセラミック体
JPH0349108A (ja)	1991-03-01	銅導体組成物
JPS5946702A (ja)	1984-03-16	絶縁性セラミツクペ−スト用無機組成物
JP3631572B2 (ja)	2005-03-23	配線基板およびその製造方法
JPH0260236B2 (da)	1990-12-14
JP3086267B2 (ja)	2000-09-11	絶縁体ガラス組成物
JPH046047B2 (da)	1992-02-04
JPH0458420B2 (da)	1992-09-17
JPS5831509A (ja)	1983-02-24	厚膜導体組成物
JPH0558201B2 (da)	1993-08-26
WO2025142516A1 (ja)	2025-07-03	導電性ペースト、導電膜、セラミックス回路基板及び電子部品
JPH04144985A (ja)	1992-05-19	厚膜導体組成物
JPH0363162B2 (da)	1991-09-30