JPS6330782B2 - - Google Patents
Info
- Publication number
- JPS6330782B2 JPS6330782B2 JP15935383A JP15935383A JPS6330782B2 JP S6330782 B2 JPS6330782 B2 JP S6330782B2 JP 15935383 A JP15935383 A JP 15935383A JP 15935383 A JP15935383 A JP 15935383A JP S6330782 B2 JPS6330782 B2 JP S6330782B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- wafer
- conductive
- adhesive sheet
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
Landscapes
- Adhesive Tapes (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58159353A JPS6052039A (ja) | 1983-08-31 | 1983-08-31 | 半導体ウェハのチップ化方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58159353A JPS6052039A (ja) | 1983-08-31 | 1983-08-31 | 半導体ウェハのチップ化方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6052039A JPS6052039A (ja) | 1985-03-23 |
| JPS6330782B2 true JPS6330782B2 (de) | 1988-06-21 |
Family
ID=15691986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58159353A Granted JPS6052039A (ja) | 1983-08-31 | 1983-08-31 | 半導体ウェハのチップ化方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6052039A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0734433B2 (ja) * | 1988-11-21 | 1995-04-12 | 日東電工株式会社 | 半導体ウエハのテープ貼付け方法およびテープ剥離方法 |
| JP5055097B2 (ja) * | 2007-11-08 | 2012-10-24 | 日東電工株式会社 | 検査用粘着シート |
| JP2011171591A (ja) * | 2010-02-19 | 2011-09-01 | Disco Corp | ウエーハの搬出入装置 |
-
1983
- 1983-08-31 JP JP58159353A patent/JPS6052039A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6052039A (ja) | 1985-03-23 |
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