JPS6052039A - 半導体ウェハのチップ化方法 - Google Patents

半導体ウェハのチップ化方法

Info

Publication number
JPS6052039A
JPS6052039A JP58159353A JP15935383A JPS6052039A JP S6052039 A JPS6052039 A JP S6052039A JP 58159353 A JP58159353 A JP 58159353A JP 15935383 A JP15935383 A JP 15935383A JP S6052039 A JPS6052039 A JP S6052039A
Authority
JP
Japan
Prior art keywords
wafer
conductive
chip
grounded
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58159353A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6330782B2 (de
Inventor
Isao Tsukagoshi
功 塚越
Tadamitsu Nakayama
中山　忠光
Yutaka Yamaguchi
豊 山口
Kiyoshi Nakao
中尾　紀代史
Kazuchika Mogami
最上　和親
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP58159353A priority Critical patent/JPS6052039A/ja
Publication of JPS6052039A publication Critical patent/JPS6052039A/ja
Publication of JPS6330782B2 publication Critical patent/JPS6330782B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP58159353A 1983-08-31 1983-08-31 半導体ウェハのチップ化方法 Granted JPS6052039A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58159353A JPS6052039A (ja) 1983-08-31 1983-08-31 半導体ウェハのチップ化方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58159353A JPS6052039A (ja) 1983-08-31 1983-08-31 半導体ウェハのチップ化方法

Publications (2)

Publication Number Publication Date
JPS6052039A true JPS6052039A (ja) 1985-03-23
JPS6330782B2 JPS6330782B2 (de) 1988-06-21

Family

ID=15691986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58159353A Granted JPS6052039A (ja) 1983-08-31 1983-08-31 半導体ウェハのチップ化方法

Country Status (1)

Country Link
JP (1) JPS6052039A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02139927A (ja) * 1988-11-21 1990-05-29 Nitto Denko Corp 半導体ウエハのテープ貼付け方法およびテープ剥離方法
JP2009114394A (ja) * 2007-11-08 2009-05-28 Nitto Denko Corp 検査用粘着シート
JP2011171591A (ja) * 2010-02-19 2011-09-01 Disco Corp ウエーハの搬出入装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02139927A (ja) * 1988-11-21 1990-05-29 Nitto Denko Corp 半導体ウエハのテープ貼付け方法およびテープ剥離方法
JP2009114394A (ja) * 2007-11-08 2009-05-28 Nitto Denko Corp 検査用粘着シート
JP2011171591A (ja) * 2010-02-19 2011-09-01 Disco Corp ウエーハの搬出入装置

Also Published As

Publication number Publication date
JPS6330782B2 (de) 1988-06-21

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