JPS6334316Y2 - - Google Patents

Info

Publication number
JPS6334316Y2
JPS6334316Y2 JP1982009294U JP929482U JPS6334316Y2 JP S6334316 Y2 JPS6334316 Y2 JP S6334316Y2 JP 1982009294 U JP1982009294 U JP 1982009294U JP 929482 U JP929482 U JP 929482U JP S6334316 Y2 JPS6334316 Y2 JP S6334316Y2
Authority
JP
Japan
Prior art keywords
chip
copper foil
electronic component
die bond
grounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982009294U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58111992U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982009294U priority Critical patent/JPS58111992U/ja
Publication of JPS58111992U publication Critical patent/JPS58111992U/ja
Application granted granted Critical
Publication of JPS6334316Y2 publication Critical patent/JPS6334316Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Die Bonding (AREA)
JP1982009294U 1982-01-25 1982-01-25 固体電子部品のシ−ルド構造 Granted JPS58111992U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982009294U JPS58111992U (ja) 1982-01-25 1982-01-25 固体電子部品のシ−ルド構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982009294U JPS58111992U (ja) 1982-01-25 1982-01-25 固体電子部品のシ−ルド構造

Publications (2)

Publication Number Publication Date
JPS58111992U JPS58111992U (ja) 1983-07-30
JPS6334316Y2 true JPS6334316Y2 (2) 1988-09-12

Family

ID=30021947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982009294U Granted JPS58111992U (ja) 1982-01-25 1982-01-25 固体電子部品のシ−ルド構造

Country Status (1)

Country Link
JP (1) JPS58111992U (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180852A (ja) * 1984-02-28 1985-09-14 Kyocera Corp 熱印刷装置

Also Published As

Publication number Publication date
JPS58111992U (ja) 1983-07-30

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