JPS6336038U - - Google Patents

Info

Publication number
JPS6336038U
JPS6336038U JP1986129216U JP12921686U JPS6336038U JP S6336038 U JPS6336038 U JP S6336038U JP 1986129216 U JP1986129216 U JP 1986129216U JP 12921686 U JP12921686 U JP 12921686U JP S6336038 U JPS6336038 U JP S6336038U
Authority
JP
Japan
Prior art keywords
bonded
base electrode
plate
solder
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986129216U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986129216U priority Critical patent/JPS6336038U/ja
Publication of JPS6336038U publication Critical patent/JPS6336038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体装置の一実施例を
示す図、第２図は従来例を示す図である。 １……半導体素子、２……ベース電極、３……
支持板、３ａ……モリブデン板或いはタングステ
ン板、３ｂ……金属板、３ｃ……硬鑞、４，４′
……軟鑞。 FIG. 1 is a diagram showing an embodiment of a semiconductor device according to the present invention, and FIG. 2 is a diagram showing a conventional example. 1... Semiconductor element, 2... Base electrode, 3...
Support plate, 3a...Molybdenum plate or tungsten plate, 3b...Metal plate, 3c...Hard brazing, 4, 4'
...Soft solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ベース電極と半導体素子間に支持板を介在させ
、該支持板上に前記半導体素子を鑞材により接着
してなる半導体装置において、前記支持板が軟鑞
により前記半導体素子に接着されるモリブデン板
、或いはタングステン板と、軟鑞により前記ベー
ス電極に接着される前記ベース電極と等しいが近
い熱膨張係数をもつ材質の金属板と、これらの間
を接着する硬鑞又は溶接部とからなることを特徴
とする半導体装置。 A semiconductor device in which a support plate is interposed between a base electrode and a semiconductor element, and the semiconductor element is bonded onto the support plate with a solder, a molybdenum plate in which the support plate is bonded to the semiconductor element with a soft solder; Alternatively, it is characterized by comprising a tungsten plate, a metal plate made of a material having a coefficient of thermal expansion equal to but close to that of the base electrode, which is bonded to the base electrode with soft solder, and hard solder or a welded portion bonded between them. semiconductor device.
JP1986129216U 1986-08-25 1986-08-25 Pending JPS6336038U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986129216U JPS6336038U (en) 1986-08-25 1986-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986129216U JPS6336038U (en) 1986-08-25 1986-08-25

Publications (1)

Publication Number Publication Date
JPS6336038U true JPS6336038U (en) 1988-03-08

Family

ID=31025596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986129216U Pending JPS6336038U (en) 1986-08-25 1986-08-25

Country Status (1)

Country Link
JP (1) JPS6336038U (en)

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