JPS6340010U

JPS6340010U -

Info

Publication number: JPS6340010U
Application number: JP13255486U
Authority: JP
Priority date: 1986-08-29
Filing date: 1986-08-29
Publication date: 1988-03-15

Description

[Brief explanation of drawings]

第１図はこの考案の一実施例を示す一部削除し
た斜視図、第２図はこの考案の一実施例の拡大し
た断面図、第３図はこの考案に用いる同軸線路を
構成する内導体と外導体の拡大図、第４図はトリ
プレート線路の一部削除した斜視図、第５図は従
来の基板間接続素子の一部削除した斜視図、第６
図はスルーホールメツキの説明図、第７図は同軸
線路の説明図である。図中、１ａ，１ｂ，１ｃ，１ｄは誘電体基板Ａ
，Ｂ，Ｃ，Ｄ、２，２ａ，２ｂはストリツプ導体
、ストリツプ導体Ａ，Ｂ、３は地板、４はストリ
ツプパターンＡ、５はストリツプパターンＢ、６
はストリツプパターンＣ、７は同軸線路の内導体
、８は同軸線路の外導体、９はストリツプパター
ンＤである。なお、図中、同一符号は同一あるい
は相当部分を示すものである。 Fig. 1 is a partially removed perspective view showing an embodiment of this invention, Fig. 2 is an enlarged sectional view of an embodiment of this invention, and Fig. 3 is an inner conductor constituting a coaxial line used in this invention. and an enlarged view of the outer conductor, Fig. 4 is a partially removed perspective view of a triplate line, Fig. 5 is a partially removed perspective view of a conventional board-to-board connection element, and Fig. 6 is a partially removed perspective view of a conventional board-to-board connection element.
The figure is an explanatory diagram of through-hole plating, and FIG. 7 is an explanatory diagram of a coaxial line. In the figure, 1a, 1b, 1c, 1d are dielectric substrates A
, B, C, D, 2, 2a, 2b are strip conductors, strip conductors A, B, 3 are ground planes, 4 is strip pattern A, 5 is strip pattern B, 6
7 is the inner conductor of the coaxial line, 8 is the outer conductor of the coaxial line, and 9 is the strip pattern D. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims

[Scope of utility model registration request]

A dielectric substrate with a conductor on one side only, a dielectric substrate with a conductor on one side and a strip conductor on the other, and two dielectric substrates with the conductor on the outside. A dielectric substrate for a tri-plate strip line configured by stacking one another, this dielectric substrate is multilayered in the thickness direction of the substrate, and the tri-plate strip lines in different layers are connected perpendicularly to the thickness direction of the dielectric substrate. In a triplate line type board-to-board connection element that electrically connects by providing a plurality of through holes in the through hole and providing a plating layer on the inner wall of the through hole, instead of the through hole provided in the dielectric substrate, A triplate line type board-to-board connection element characterized by inserting a coaxial line composed of an inner conductor and an outer conductor and filled with a dielectric material.