JPS6342530Y2 - - Google Patents

Info

Publication number
JPS6342530Y2
JPS6342530Y2 JP1979020785U JP2078579U JPS6342530Y2 JP S6342530 Y2 JPS6342530 Y2 JP S6342530Y2 JP 1979020785 U JP1979020785 U JP 1979020785U JP 2078579 U JP2078579 U JP 2078579U JP S6342530 Y2 JPS6342530 Y2 JP S6342530Y2
Authority
JP
Japan
Prior art keywords
circuit board
stem
integrated circuit
hybrid integrated
metal stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979020785U
Other languages
English (en)
Japanese (ja)
Other versions
JPS55122349U (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979020785U priority Critical patent/JPS6342530Y2/ja
Publication of JPS55122349U publication Critical patent/JPS55122349U/ja
Application granted granted Critical
Publication of JPS6342530Y2 publication Critical patent/JPS6342530Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP1979020785U 1979-02-20 1979-02-20 Expired JPS6342530Y2 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979020785U JPS6342530Y2 (2) 1979-02-20 1979-02-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979020785U JPS6342530Y2 (2) 1979-02-20 1979-02-20

Publications (2)

Publication Number Publication Date
JPS55122349U JPS55122349U (2) 1980-08-30
JPS6342530Y2 true JPS6342530Y2 (2) 1988-11-08

Family

ID=28852416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979020785U Expired JPS6342530Y2 (2) 1979-02-20 1979-02-20

Country Status (1)

Country Link
JP (1) JPS6342530Y2 (2)

Also Published As

Publication number Publication date
JPS55122349U (2) 1980-08-30

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