JPS6344995Y2 - - Google Patents

Info

Publication number
JPS6344995Y2
JPS6344995Y2 JP1982047219U JP4721982U JPS6344995Y2 JP S6344995 Y2 JPS6344995 Y2 JP S6344995Y2 JP 1982047219 U JP1982047219 U JP 1982047219U JP 4721982 U JP4721982 U JP 4721982U JP S6344995 Y2 JPS6344995 Y2 JP S6344995Y2
Authority
JP
Japan
Prior art keywords
capillary
hole
wire
tip
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982047219U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58148932U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982047219U priority Critical patent/JPS58148932U/ja
Publication of JPS58148932U publication Critical patent/JPS58148932U/ja
Application granted granted Critical
Publication of JPS6344995Y2 publication Critical patent/JPS6344995Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1982047219U 1982-03-31 1982-03-31 キヤピラリ− Granted JPS58148932U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982047219U JPS58148932U (ja) 1982-03-31 1982-03-31 キヤピラリ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982047219U JPS58148932U (ja) 1982-03-31 1982-03-31 キヤピラリ−

Publications (2)

Publication Number Publication Date
JPS58148932U JPS58148932U (ja) 1983-10-06
JPS6344995Y2 true JPS6344995Y2 (2) 1988-11-22

Family

ID=30058187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982047219U Granted JPS58148932U (ja) 1982-03-31 1982-03-31 キヤピラリ−

Country Status (1)

Country Link
JP (1) JPS58148932U (2)

Also Published As

Publication number Publication date
JPS58148932U (ja) 1983-10-06

Similar Documents

Publication Publication Date Title
JP3765778B2 (ja) ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
US20080073406A1 (en) Multi-part capillary
US6073827A (en) Wire bonding capillary with a conical surface
US20080272176A1 (en) Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding
US4909427A (en) Bonding wire ball formation
US5148959A (en) Wedge bonding tool
JP2852134B2 (ja) バンプ形成方法
JPS6344995Y2 (2)
JPS5923419Y2 (ja) ワイヤボンデイング用キヤピラリ−
JP2914337B2 (ja) ワイヤボンディング装置
JPH02163951A (ja) キャピラリチップと半導体装置のワイヤボンド方法
JPS6045607U (ja) 段付ドリル
US4269900A (en) Solderless capillary chips
JP3202193B2 (ja) ワイヤボンディング方法
JP2703999B2 (ja) 半導体製造装置
JPH07263477A (ja) 被覆ボンディング細線接合用キャピラリー
JPS588141B2 (ja) 3−5族化合物半導体チップの切出し方法
JPH11260855A (ja) 半導体装置
JPS63300522A (ja) 半導体装置
JPH05326523A (ja) バンプ形成用キャピラリ
JPH04192533A (ja) ワイヤボンディング用キャピラリ
JPH0154857B2 (2)
JPS63196049A (ja) ペレツト配線間のボンデイング方法
JPH09148358A (ja) ワイヤボンディングダメージ防止用キャピラリー
JPH0383943U (2)