JPS6345015Y2 - - Google Patents
Info
- Publication number
- JPS6345015Y2 JPS6345015Y2 JP1981117282U JP11728281U JPS6345015Y2 JP S6345015 Y2 JPS6345015 Y2 JP S6345015Y2 JP 1981117282 U JP1981117282 U JP 1981117282U JP 11728281 U JP11728281 U JP 11728281U JP S6345015 Y2 JPS6345015 Y2 JP S6345015Y2
- Authority
- JP
- Japan
- Prior art keywords
- sides
- metal tube
- board
- circuits
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】
本考案はプリント回路基板に於ける基板の両面
の回路の接続構造に係るものである。[Detailed Description of the Invention] The present invention relates to a structure for connecting circuits on both sides of a printed circuit board.
従来、プリント基板の両面の回路の接続法は、
第1図に示すように接続しようとする各面の導
体、2及び3に対して基板1を貫通する孔を形成
した後、メツキ法により導電膜4を形成し、その
後に、導体2及び3を、化学エツチング等により
所定の回路パターンを形成するいわゆるスルーホ
ール法が一般に使用されていた。この基板に実装
される部品5のリード線6は貫通穴に挿入後、半
田付され、貫通孔は半田で埋められる。しかる
に、このような基板の両面の回路の接続法は導電
膜4の形成に際し、基材1が有する吸湿性及び機
械的特性等に依存する基材1の表面状態により、
導電膜4にピンホールあるいはクラツク等が発生
したり、又、導電膜4と基材1の密着性が悪く導
電膜4が貫通穴より抜け落ちる等、回路接続の信
頼性を著しく低下させる惧れがあつた。 Conventionally, the method of connecting circuits on both sides of a printed circuit board was as follows:
As shown in FIG. 1, after forming holes through the substrate 1 for the conductors 2 and 3 on each side to be connected, a conductive film 4 is formed by plating method, and then the conductors 2 and 3 are connected. The so-called through-hole method, in which a predetermined circuit pattern is formed by chemical etching or the like, has generally been used. The lead wires 6 of the components 5 to be mounted on this board are inserted into the through holes and then soldered, and the through holes are filled with solder. However, when forming the conductive film 4, this method of connecting circuits on both sides of the substrate depends on the surface condition of the base material 1, which depends on the hygroscopicity and mechanical properties of the base material 1.
There is a risk that pinholes or cracks may occur in the conductive film 4, or the adhesion between the conductive film 4 and the base material 1 may be poor, causing the conductive film 4 to fall out through the through holes, which may significantly reduce the reliability of the circuit connection. It was hot.
本考案の目的はかかる欠点を除去する為に、基
板両面の回路接続を金属管により行なうものであ
り、機械的強度が高く、かつ低価格のプリント回
路基板の接続構造を提供するにある。 The purpose of the present invention is to eliminate such drawbacks by connecting circuits on both sides of the board using metal tubes, and to provide a connection structure for printed circuit boards that has high mechanical strength and is inexpensive.
本考案は、基板の両面の回路を接続する為の貫
通孔を設け、該貫通孔に、Ni−Ti系合金、Cu−
Ni−Al系合金等の形状記憶合金からなる金属管
を装着するように構成したもので、該金属管に部
品のリード線を挿入し半田付した場合、半田付温
度で特定形状を記憶していた金属管が両面の回路
パターンを機械的に挾持するように形状を変化さ
せて両面の回路パターンを強固に接続させること
を特徴とする。 This invention provides through holes for connecting circuits on both sides of the board, and the through holes are filled with Ni-Ti alloy, Cu-
It is configured to attach a metal tube made of shape memory alloy such as Ni-Al alloy, and when the lead wire of the component is inserted into the metal tube and soldered, the specific shape is memorized at the soldering temperature. The metal tube is characterized by changing its shape so as to mechanically sandwich the circuit patterns on both sides, thereby firmly connecting the circuit patterns on both sides.
次に本考案を図面について説明する。 Next, the present invention will be explained with reference to the drawings.
基板1の表裏両面2,3の回路を接続するため
の貫通孔に転移点以下では一端にのみ鍔8を有す
るが、転移点より高い半田付温度では他端にも鍔
8′を突出せしめてハトメ状となり、その後半田
付温度以下となつてもハトメの状態を保持する形
状記憶特性を有する合金よりなる金属管を前記貫
通孔に挿入し、前記金属管に電子部品を接続する
リード線を挿入して半田付し前記基板の両面の回
路を機械的に挟持接続するようにしたプリント回
路基板である。 The through hole for connecting the circuits on both the front and back surfaces 2 and 3 of the substrate 1 has a flange 8 at only one end below the transition point, but at a soldering temperature higher than the transition point, the flange 8' is made to protrude from the other end as well. A metal tube made of an alloy that has a shape memory property that forms an eyelet shape and then retains the eyelet shape even if the temperature drops below the soldering temperature is inserted into the through hole, and a lead wire for connecting an electronic component is inserted into the metal tube. This is a printed circuit board in which the circuits on both sides of the board are mechanically sandwiched and connected by soldering.
第2図は本考案の1構成図を示すもので、プリ
ント回路基板1の両面に導電パターン2及び3が
形成されていて、貫通孔部に形状記憶合金からな
る金属管4′が装着され、部品5のリード線6が
半田7により固着している状態を示している。 FIG. 2 shows one configuration diagram of the present invention, in which conductive patterns 2 and 3 are formed on both sides of a printed circuit board 1, and a metal tube 4' made of a shape memory alloy is attached to the through hole. A state in which the lead wire 6 of the component 5 is fixed by the solder 7 is shown.
本考案に用いる形状記憶合金とは、ある温度
TTR(Transition Temperature Range:転態
点)以上で成型後TTR以下に冷却し、その合金
に折り曲げ等の歪を加えて再度TTR以上の温度
に加熱すると、TTR以上で成型した時の形状に
復帰するという性質を有する合金で一般的には、
Ni−Ti系合金、Cu−Ni−Al系合金等が知られて
いる。第3図は本考案に用いる金属管4′の断面
図を示す。第3図aはTTRよりかなり高い温度
で所定の組成を有する形状記憶合金で成型された
もので、いわゆるハトメの形状をなしている。こ
の金属管をTTR以下に冷却し、片側(図では下
方)の屈曲部を直線に加工したものを第3図bに
示す。 The shape memory alloy used in this invention is
After molding at a temperature above TTR (Transition Temperature Range), cooling to below TTR, applying strain such as bending to the alloy, and heating it again to a temperature above TTR, it will return to the shape it had when molded above TTR. In general, alloys with the properties of
Ni-Ti alloys, Cu-Ni-Al alloys, etc. are known. FIG. 3 shows a sectional view of a metal tube 4' used in the present invention. Figure 3a shows a shape memory alloy molded at a temperature considerably higher than TTR, having a predetermined composition, and has a so-called eyelet shape. This metal tube was cooled to below TTR and the bent portion on one side (lower side in the figure) was processed into a straight line, as shown in Figure 3b.
第3図bの如く加工された金属管を第4図に示
すように基板1の貫通孔に挿入する。この時導電
パターン2及び3はすでに化学エツチング等によ
りパターン形成されたものである。この金属管
4′に部品5のリード線6を挿入し、半田付ある
いは半田デイツプ等により加熱させTTR以上の
温度になると金属管4′は第3図aに示す形状に
復帰する為、表裏パターンの接続状態は第2図に
示す如く導電パターン2及び3を、金属管4′が
機械的に強固に挾持する為、両面の回路の接続が
出来る。尚、金属管4′は半田適性を考慮して半
田メツキあるいは金メツキ等の表面処理をしてお
くことが望ましい。 The metal tube processed as shown in FIG. 3b is inserted into the through hole of the substrate 1 as shown in FIG. At this time, the conductive patterns 2 and 3 have already been patterned by chemical etching or the like. Insert the lead wire 6 of the component 5 into this metal tube 4', heat it by soldering or soldering dip, etc., and when the temperature reaches TTR or higher, the metal tube 4' will return to the shape shown in FIG. As shown in FIG. 2, the metal tube 4' mechanically firmly holds the conductive patterns 2 and 3, so that circuits on both sides can be connected. Note that it is desirable that the metal tube 4' be subjected to a surface treatment such as solder plating or gold plating in consideration of solderability.
以上に述べた如く本考案によれば、半田付作業
とカシメ作業を同時に行なうことが出来る為工数
を省き、かつ金属管で表裏両面パターンの回路接
続を行なつている為機械的強度が高く、従つて低
価格かつ高信頼度のプリント回路基板を得ること
ができる。 As described above, according to the present invention, the soldering work and the crimping work can be performed at the same time, thereby saving man-hours, and since the circuit connection is made with a pattern on both the front and back sides using metal tubes, the mechanical strength is high. Therefore, a low-cost and highly reliable printed circuit board can be obtained.
第1図は従来のプリント回路基板に於ける両面
の回路パターンの接続構造を示す断面図、第2図
は本考案の一実施例を示す構造断面図、第3図は
本考案に用いる接続部品の構造断面図、第4図は
考案の接続過程を示す説明図である。
図において、1:基板、2,3:導体、4,
4′:金属管、5:電気部品、6:電気部品のリ
ード線、7:半田。
Figure 1 is a cross-sectional view showing the connection structure of circuit patterns on both sides of a conventional printed circuit board, Figure 2 is a cross-sectional view of the structure of an embodiment of the present invention, and Figure 3 is the connecting parts used in the present invention. FIG. 4 is an explanatory diagram showing the connection process of the invention. In the figure, 1: substrate, 2, 3: conductor, 4,
4': Metal tube, 5: Electrical parts, 6: Electrical parts lead wire, 7: Solder.
Claims (1)
に転移点以下では一端にのみ鍔を有するが、転移
点より高い半田付温度では他端にも鍔を突出せし
めてハトメ状となり、その後半田付温度以下とな
つてもハトメの状態を保持する形状記憶特性を有
する合金よりなる金属管を前記貫通孔に挿入し、
前記金属管に電子部品を接続するリード線を挿入
して半田付し前記基板の両面の回路を機械的に挟
持接続するようにしたプリント回路基板。 A through-hole for connecting circuits on both the front and back sides of the board has a flange at only one end below the transition point, but at a soldering temperature higher than the transition point, the flange protrudes from the other end as well, forming an eyelet-like shape, which then becomes difficult to solder. Inserting into the through hole a metal tube made of an alloy having shape memory properties that maintains the eyelet state even when the temperature drops below the temperature,
A printed circuit board in which lead wires for connecting electronic components are inserted into the metal tubes and soldered to connect the circuits on both sides of the board by mechanically sandwiching them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981117282U JPS5825056U (en) | 1981-08-08 | 1981-08-08 | printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981117282U JPS5825056U (en) | 1981-08-08 | 1981-08-08 | printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5825056U JPS5825056U (en) | 1983-02-17 |
| JPS6345015Y2 true JPS6345015Y2 (en) | 1988-11-22 |
Family
ID=29911466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981117282U Granted JPS5825056U (en) | 1981-08-08 | 1981-08-08 | printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5825056U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6009901B2 (en) * | 2012-10-19 | 2016-10-19 | 帝国通信工業株式会社 | Mounting structure of light emitting element with lead wire to circuit board |
| JP6173816B2 (en) * | 2013-07-23 | 2017-08-02 | Hoya株式会社 | Scanning confocal endoscope system |
| JP6982755B2 (en) * | 2017-02-10 | 2021-12-17 | ダイヤゼブラ電機株式会社 | Printed circuit board and printed circuit equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3861030A (en) * | 1974-04-04 | 1975-01-21 | Raychem Corp | Article and method for locating contacts |
| JPS5562796A (en) * | 1978-11-02 | 1980-05-12 | Matsushita Electric Industrial Co Ltd | Method of mounting electronic part on printed board |
-
1981
- 1981-08-08 JP JP1981117282U patent/JPS5825056U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5825056U (en) | 1983-02-17 |
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