JPS6347327B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a laminated ceramic component, and more particularly to a method for separating a laminated ceramic capacitor from a laminate.

[Background technology]

The applicant first formed a laminate by first stacking electrode layers and ceramic layers alternately so that ears were formed on the outer periphery of the electrode layers, and integrating them under pressure. After applying adhesive to only the edges of the base and fixing it, cut the laminate to the specified size using a cutting blade while moving it from side to side to cut the part excluding the ears to the base. We proposed a manufacturing method for multilayer ceramic capacitors that achieves better separation.

According to this method, when cutting a laminate, even if the cutting blade is moved from side to side, the main part of the laminate is surrounded by the ears, so there is no displacement of the cutting blade in the direction of movement. In addition, the excellent effect of making it possible to easily separate the laminated ceramic capacitor from the substrate after cutting can be expected.

However, since the cutting blade moves left and right when cutting the laminate, the surface of the base that fixes the laminate is damaged by the cutting blade, and its service life is short and it must be replaced frequently. There is a problem in that the impact on cost cannot be ignored due to this.

Furthermore, in recent years, there has been a trend to change the movement of the cutting blade from the left-right direction to the up-down direction for the purpose of improving work efficiency. If such a cutting method is applied to the above proposal, the thickness of the cutting blade may be as thick as, for example, 130 μm, and when the cutting blade is raised after cutting the laminate, the laminate may adhere to the cutting blade. Another problem is that it is easy to lift, making it difficult to apply it to mass production processes.

[Disclosure of the invention]

In view of these points, the present invention provides a method for manufacturing laminated ceramic parts that uses a simple structure to eliminate positional displacement and lifting during cutting of the laminated body. A step of forming a laminate by alternately laminating electrode layers and ceramic layers and integrating them under pressure, and pasting this laminate onto a sheet having an adhesive layer with an adhesive strength of 100 to 140 g/20 mm. The method is characterized by including a step of cutting the laminate into predetermined dimensions, and a step of peeling off the sheet before firing the cut laminate.

According to this invention, since the laminate is adhered to the sheet using its adhesive layer, there is no displacement or lifting during cutting by the cutting blade.

In particular, the movement of the cutting blade is set in the vertical direction, so multiple items can be cut at the same time with a single vertical movement.
Work efficiency can be greatly improved.

Moreover, since the cutting blade moves in the vertical direction, not only will the sheet not be cut when cutting the laminate, but the base will not be damaged, so the cost impact of frequent replacement of the base can be completely eliminated. .

[Best mode for carrying out the invention]

Next, an example of application of the present invention to a multilayer ceramic capacitor will be described with reference to FIGS. 1 to 5.

First, as shown in FIG. 1, on the top surface of the base 1,
For example, it has adhesive layers 2a and 2b on the upper and lower surfaces, and
Attach sheet 2 of 130 μm vinyl chloride.
The adhesive force of the adhesive layer 2a is set in the range of 100 to 140 g/20 mm. Next, as shown in FIG. 2, the laminate 3 is attached to the adhesive layer 2a of the sheet 2. Note that the laminate 3 can be attached to the sheet 2 prior to attaching it to the substrate 1, or
Alternatively, the adhesive layer 2b may be omitted and a vacuum suction mechanism may be used for fixation. This laminate 3 is formed, for example, as follows. That is, first, a ceramic sheet (layer) 4 having a predetermined thickness is formed from a mixed material containing ceramic powder, a binder, a plasticizer, a dispersant, and a solvent by a doctor blade method, and after drying, it is hammered into a predetermined size. Pull it out. On this punched sheet 4, an electrode layer 5 is formed by printing a mixed material containing palladium powder, a binder, and a solvent in a predetermined pattern, and then dried with hot air or the like. Thereafter, a plurality of sheets 4 having electrode layers formed thereon are laminated so that the electrode layers are alternated.
Then, protective layers 6 and 7 made of green sheets are laminated on the upper and lower surfaces of these layers, and the protective layers, ceramic layer, and electrode layer are integrated by hot pressing to form a laminate 3. Note that the laminate 3 can also be formed by laminating the protective layer 6, the ceramic sheet 4, and the protective layer 7 in this order. Next, as shown in FIG. 3, when the cutting blade 8, for example, having a thickness of about 130 μm, which is arranged above the base 1 so as to be able to move up and down, is lowered, the laminated body 3 is cut into a shape as shown in FIG. disconnected. Then, by cutting vertically and horizontally along predetermined breaking lines, the laminate 3 is cut as shown in FIG. 5. After that, sheet 2
At the same time, the chip is peeled off from the substrate 1 and the chip is peeled off from the sheet 2.
A multilayer ceramic capacitor is manufactured by peeling the ceramic capacitor and firing it.

According to this embodiment, the adhesive layer 2a on which the laminate 3 is attached to the sheet 2 has an adhesive strength of 100 to 140.
Since it is set in the range of g/20mm, the cutting blade 8
Positional shift and lifting when cutting the laminate 3 can be completely eliminated.

However, if the adhesive strength is less than 100g/20mm, it will not be effective in preventing misalignment or lifting during cutting.
Moreover, if it exceeds 140 g/20 mm, the adhesive force becomes too strong and it becomes difficult to peel off the chip after cutting, so it is not preferable to deviate from this range.

Further, since the cutting blade 8 moves in the vertical direction, the sheet 2 is not cut when the laminate 3 is cut. For this reason, the upper surface of the base body 1 is not damaged by the cutting blade 8, and there is no need to replace it.

In the present invention, the thickness of the protective layer and the ceramic layer, and the number of laminated ceramic layers can be changed as appropriate, and the material of the sheet is not limited to vinyl chloride.

[Brief explanation of the drawing]

The drawings are explanatory diagrams of the method of the present invention, in which Fig. 1 is a side sectional view showing a state in which the sheet is adhered to a substrate, and Fig. 2
The figure is a side sectional view showing the state in which the laminate is pasted on the sheet, FIG. 3 is a side sectional view showing the state immediately before cutting the laminate, FIG. The figure is a plan view showing the state after cutting.

Claims (1)

[Claims] 1 The process of forming a laminate by mainly laminating electrode layers and ceramic layers alternately and integrating them under pressure, and the process of forming a laminate with an adhesive strength of 100 to 140.
A laminate characterized by comprising the steps of adhering to a sheet having an adhesive layer of g/20 mm, cutting the laminate into predetermined dimensions, and peeling off the sheet before firing the cut laminate. Method of manufacturing ceramic parts.