JPS6361146U - - Google Patents

Info

Publication number
JPS6361146U
JPS6361146U JP1986155508U JP15550886U JPS6361146U JP S6361146 U JPS6361146 U JP S6361146U JP 1986155508 U JP1986155508 U JP 1986155508U JP 15550886 U JP15550886 U JP 15550886U JP S6361146 U JPS6361146 U JP S6361146U
Authority
JP
Japan
Prior art keywords
solid
state imaging
view
transparent material
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986155508U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986155508U priority Critical patent/JPS6361146U/ja
Publication of JPS6361146U publication Critical patent/JPS6361146U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図ないし第３図は本考案の第１実施例に係
り、第１図は電子内視鏡の挿入部の先端部の断面
図、第２図は流れ止め部の周辺を示す斜視図、第
３図は電子内視鏡の全体を示す側面図、第４図及
び第５図は本考案の第２実施例に係り、第４図は
固体撮像素子の断面図、第５図は流れ止め部の周
辺を示す斜視図、第６図は第２実施例の変形例を
示す斜視図、第７図及び第８図は本考案の第３実
施例に係り、第７図は固体撮像素子の断面図、第
８図は流れ止め部の周辺を示す斜視図、第９図な
いし第１１図は本考案の第４実施例に係り、第９
図は電子内視鏡の挿入部の先端部の断面図、第１
０図は固体撮像素子の断面図、第１１図は固体撮
像素子の正面図、第１２図は本考案の第５実施例
の固体撮像素子の正面図である。 １……電子内視鏡、２……挿入部、９……先端
部、２４……固体撮像素子、２５……ベース、２
６……固体撮像チツプ、２７……配線導体、２８
……ボンデイングワイヤ、３１……透明板、３２
……樹脂、３３……流れ止め部。

Claims (1)

    【実用新案登録請求の範囲】
  1. ベース上に固体撮像チツプを固着し、この固体
    撮像チツプの撮像面を透光体で覆つた固体撮像素
    子において、前記固体撮像チツプを前記透光体及
    び樹脂にて封止すると共に、前記ベースに前記樹
    脂の流れ止め部を設けたことを特徴とする固体撮
    像素子。
JP1986155508U 1986-10-08 1986-10-08 Pending JPS6361146U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986155508U JPS6361146U (ja) 1986-10-08 1986-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986155508U JPS6361146U (ja) 1986-10-08 1986-10-08

Publications (1)

Publication Number Publication Date
JPS6361146U true JPS6361146U (ja) 1988-04-22

Family

ID=31076277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986155508U Pending JPS6361146U (ja) 1986-10-08 1986-10-08

Country Status (1)

Country Link
JP (1) JPS6361146U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364177A (ja) * 1989-08-01 1991-03-19 Olympus Optical Co Ltd 固体撮像装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364177A (ja) * 1989-08-01 1991-03-19 Olympus Optical Co Ltd 固体撮像装置

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