JPH0158954U - - Google Patents

Info

Publication number
JPH0158954U
JPH0158954U JP1987154805U JP15480587U JPH0158954U JP H0158954 U JPH0158954 U JP H0158954U JP 1987154805 U JP1987154805 U JP 1987154805U JP 15480587 U JP15480587 U JP 15480587U JP H0158954 U JPH0158954 U JP H0158954U
Authority
JP
Japan
Prior art keywords
lead
chip
copper
chip holder
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987154805U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987154805U priority Critical patent/JPH0158954U/ja
Publication of JPH0158954U publication Critical patent/JPH0158954U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図は
第１図に使用したリードフレームの平面図、第３
図は従来のリードフレームの一例の平面図、第４
図は第３図のリードフレームを使用した半導体装
置のＡ―Ａ′線に対応する断面図である。 １……チツプ載置部、３……樹脂部、４……リ
ード、７ａ，７ｂ……ＣｕＯ膜、９……リード・
樹脂界面部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプの載置する銅または銅合金のチツ
    プ載置部と、先端部が該チツプ載置部の周辺に配
    置された及び前記チツプ載置部からの延長する銅
    または銅合金のリードと、前記チツプ載置部及び
    前記リードの先端部を封止する樹脂部を有する半
    導体装置において、前記樹脂部の周縁のリード・
    樹脂界面部の前記リードの表面に酸化第二銅膜を
    設けたことを特徴とする半導体装置。
JP1987154805U 1987-10-09 1987-10-09 Pending JPH0158954U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987154805U JPH0158954U (ja) 1987-10-09 1987-10-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987154805U JPH0158954U (ja) 1987-10-09 1987-10-09

Publications (1)

Publication Number Publication Date
JPH0158954U true JPH0158954U (ja) 1989-04-13

Family

ID=31431867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987154805U Pending JPH0158954U (ja) 1987-10-09 1987-10-09

Country Status (1)

Country Link
JP (1) JPH0158954U (ja)

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