JPS6361161U - - Google Patents
Info
- Publication number
- JPS6361161U JPS6361161U JP1986155375U JP15537586U JPS6361161U JP S6361161 U JPS6361161 U JP S6361161U JP 1986155375 U JP1986155375 U JP 1986155375U JP 15537586 U JP15537586 U JP 15537586U JP S6361161 U JPS6361161 U JP S6361161U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor light
- emitting device
- lens
- light emitting
- bonding wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案半導体発光素子の第１実施例を
示す平面図、第２図はその側面図、第３図は本考
案半導体発光素子の第２実施例を示す平面図、第
４図はその側面図、第５図は本考案半導体発光素
子の第３実施例を示す平面図、第６図はその側面
図、第７図および第８図は各々従来の半導体発光
素子の構造を示す側面図である。 １……基台、２……半導体発光素子チツプ、３
……電極、４……配線部、５……レンズ、６……
接着剤、７……ボンデイングワイヤ、８……電極
。
示す平面図、第２図はその側面図、第３図は本考
案半導体発光素子の第２実施例を示す平面図、第
４図はその側面図、第５図は本考案半導体発光素
子の第３実施例を示す平面図、第６図はその側面
図、第７図および第８図は各々従来の半導体発光
素子の構造を示す側面図である。 １……基台、２……半導体発光素子チツプ、３
……電極、４……配線部、５……レンズ、６……
接着剤、７……ボンデイングワイヤ、８……電極
。
Claims (1)
- 【実用新案登録請求の範囲】 半導体発光素子チツプ上にレンズを配置してな
る半導体発光素子において、 上記半導体発光素子チツプ上面の少なくとも２
箇所と、該素子チツプを載置する基台の電極部と
を、各々ボンデイングワイヤで接続し、 かつ、これらのボンデイングワイヤの挟む空間
にレンズを挿入して、該レンズの側周を該ボンデ
イングワイヤにより挟持した状態で、該レンズを
素子チツプ上に載置固着することを特徴とする半
導体発光素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155375U JPS6361161U (ja) | 1986-10-09 | 1986-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155375U JPS6361161U (ja) | 1986-10-09 | 1986-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361161U true JPS6361161U (ja) | 1988-04-22 |
Family
ID=31076020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986155375U Pending JPS6361161U (ja) | 1986-10-09 | 1986-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361161U (ja) |
-
1986
- 1986-10-09 JP JP1986155375U patent/JPS6361161U/ja active Pending