JPS6363410U - - Google Patents

Info

Publication number
JPS6363410U
JPS6363410U JP1986156688U JP15668886U JPS6363410U JP S6363410 U JPS6363410 U JP S6363410U JP 1986156688 U JP1986156688 U JP 1986156688U JP 15668886 U JP15668886 U JP 15668886U JP S6363410 U JPS6363410 U JP S6363410U
Authority
JP
Japan
Prior art keywords
terminal
mold
receiving surface
case
molten resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986156688U
Other languages
English (en)
Other versions
JPH0342985Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986156688U priority Critical patent/JPH0342985Y2/ja
Priority to KR2019870007674U priority patent/KR900009158Y1/ko
Publication of JPS6363410U publication Critical patent/JPS6363410U/ja
Application granted granted Critical
Publication of JPH0342985Y2 publication Critical patent/JPH0342985Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Switches (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Switch Cases, Indication, And Locking (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係る成形用金型の
型開き状態を示す断面図、第２図はその成形用金
型の型締め状態を示す要部断面図、第３図はその
成形用金型によつて成形されたスイツチケースを
示す断面図、第４図は本考案の他の実施例を示す
成形用金型の断面図、第５図ないし第８図は従来
例に係り、第５図はデイツプスイツチの断面図、
第６図および第７図は端子とケースの製造工程を
示す説明図、第８図はその製造工程で用いられる
金型装置の断面図である。 １……ケース、２……端子、２ａ……固定接点
部、６……ベース板、９……端子部、１１……キ
ヤビテイ、１２……上型、１２ｂ……傾斜面（挾
持面）、１３……下型、１３ｂ……傾斜面（挾持
面）、１５……樹脂、Ｂ……受面。

Claims (1)

    【実用新案登録請求の範囲】
  1. 所定形状にプレス抜きされた端子を挾持する上
    型と下型とを備え、これら上型と下型との間に画
    成されるキヤビテイの受面に前記端子を当接した
    状態で該キヤビテイに溶融樹脂を充填し、しかる
    後、該溶融樹脂を冷却・固化することにより合成
    樹脂製のケースと前記端子とを一体成形するスイ
    ツチケースの成形用金型において、前記上型と下
    型に、前記キヤビテイの受面を臨み且つ該受面に
    対して傾斜する挾持面を設け、これら挾持面で前
    記端子を挾持してその自由端を前記受面に圧接す
    るように構成したことを特徴とするスイツチケー
    スの成形用金型。
JP1986156688U 1986-10-15 1986-10-15 Expired JPH0342985Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986156688U JPH0342985Y2 (ja) 1986-10-15 1986-10-15
KR2019870007674U KR900009158Y1 (ko) 1986-10-15 1987-05-19 스위치 케이스의 성형용 금형

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986156688U JPH0342985Y2 (ja) 1986-10-15 1986-10-15

Publications (2)

Publication Number Publication Date
JPS6363410U true JPS6363410U (ja) 1988-04-26
JPH0342985Y2 JPH0342985Y2 (ja) 1991-09-09

Family

ID=31078541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986156688U Expired JPH0342985Y2 (ja) 1986-10-15 1986-10-15

Country Status (2)

Country Link
JP (1) JPH0342985Y2 (ja)
KR (1) KR900009158Y1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102804247B1 (ko) 2019-11-26 2025-05-07 주식회사 엘지에너지솔루션 파우치형 케이스 성형장치 및 이를 이용한 파우치형 케이스의 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51148359A (en) * 1975-06-16 1976-12-20 Hitachi Ltd Lead formation method of resin mold ic element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51148359A (en) * 1975-06-16 1976-12-20 Hitachi Ltd Lead formation method of resin mold ic element

Also Published As

Publication number Publication date
KR880007736U (ko) 1988-06-28
KR900009158Y1 (ko) 1990-10-06
JPH0342985Y2 (ja) 1991-09-09

Similar Documents

Publication Publication Date Title
JPS6363410U (ja)
JPS5842938U (ja) 樹脂封止形半導体装置のモ−ルド金型
JPS59118517U (ja) 合成樹脂からなるレンズ及びレンズフレ−ム一体成形金型
JPS62111827U (ja)
JPS6341337U (ja)
JPH02127420U (ja)
JPS6262435U (ja)
JPS612914U (ja) 射出成形金型構造
JPS62166010U (ja)
JPS6356612U (ja)
JPS6230611U (ja)
JPH0454821U (ja)
JPS6380111U (ja)
JPS6341524U (ja)
JPS6420729U (ja)
JPS60194341U (ja) 半導体装置
JPS6024519U (ja) 射出成形用金型
JPS63162529U (ja)
JPH02148739U (ja)
JPS6420318U (ja)
JPS62166637U (ja)
JPS6267719U (ja)
JPS59160217U (ja) プラスチック成形金型
JPS592527U (ja) インサ−ト成形金型
JPS63112731U (ja)