JPS6364034U - - Google Patents
Info
- Publication number
- JPS6364034U JPS6364034U JP1986158145U JP15814586U JPS6364034U JP S6364034 U JPS6364034 U JP S6364034U JP 1986158145 U JP1986158145 U JP 1986158145U JP 15814586 U JP15814586 U JP 15814586U JP S6364034 U JPS6364034 U JP S6364034U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- shape
- utility
- model registration
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Wire Bonding (AREA)
Description
第１図Ａ，Ｂは、本考案に係る半導体装置の一
実施例を示す平面図及び断面図、第２図Ａ，Ｂは
、第１図Ａ，Ｂに示した実施例の作用効果を説明
するための図、第３図は、本考案の他の実施例を
示す平面図、第４図は、本考案の更に他の実施例
を示す平面図、第５図は、従来の半導体装置を示
す平面図である。
図において、１は半導体チツプ、２，６，７，
９はボンデイングパツド、３はパツシベーシヨン
膜、４はボンデイングワイヤー、５，８，１０は
ワイヤー変形接合部を示す。
1A and 1B are a plan view and a sectional view showing an embodiment of a semiconductor device according to the present invention, and FIGS. 2A and 2B illustrate the effects of the embodiment shown in FIGS. 1A and 1B. FIG. 3 is a plan view showing another embodiment of the present invention, FIG. 4 is a plan view showing still another embodiment of the present invention, and FIG. 5 is a plan view showing a conventional semiconductor device. FIG. In the figure, 1 is a semiconductor chip, 2, 6, 7,
9 is a bonding pad, 3 is a passivation film, 4 is a bonding wire, and 5, 8, and 10 are wire deformation joints.
Claims (1)
ボンデイングパツドを配設し、該ボンデイングパ
ツドを除いた半導体チツプ表面上にパツシベーシ
ヨン膜を施してなる半導体装置において、前記ボ
ンデイングパツドの形状を、該パツドに接続され
るボンデイングワイヤーの変形接合部の外周形状
とほぼ相似形状に形成したことを特徴とする半導
体装置。 (2) 前記ボンデイングパツドの形状を円形とし
たことを特徴とする実用新案登録請求の範囲第(1
)項記載の半導体装置。 (3) 前記ボンデイングパツドの形状を楕円とし
たことを特徴とする実用新案登録請求の範囲第(1
)項記載の半導体装置。 (4) 前記ボンデイングパツドの形状を五角形以
上の多角形としたことを特徴とする実用新案登録
請求の範囲第(1)項記載の半導体装置。[Claims for Utility Model Registration] (1) A semiconductor device in which a plurality of bonding pads for connecting wires are arranged on a semiconductor chip, and a passivation film is applied on the surface of the semiconductor chip excluding the bonding pads. 2. A semiconductor device according to claim 1, wherein the shape of the bonding pad is substantially similar to the outer peripheral shape of a deformed joint portion of a bonding wire connected to the pad. (2) Utility model registration claim No. (1) characterized in that the shape of the bonding pad is circular.
) The semiconductor device described in item 2. (3) Utility model registration claim No. (1) characterized in that the shape of the bonding pad is an ellipse.
) The semiconductor device described in item 2. (4) The semiconductor device according to claim (1) of the utility model registration, characterized in that the shape of the bonding pad is a polygon of pentagon or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986158145U JPS6364034U (en) | 1986-10-17 | 1986-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986158145U JPS6364034U (en) | 1986-10-17 | 1986-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364034U true JPS6364034U (en) | 1988-04-27 |
Family
ID=31081359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986158145U Pending JPS6364034U (en) | 1986-10-17 | 1986-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364034U (en) |
-
1986
- 1986-10-17 JP JP1986158145U patent/JPS6364034U/ja active Pending