JPS6367239U - - Google Patents
Info
- Publication number
- JPS6367239U JPS6367239U JP16276486U JP16276486U JPS6367239U JP S6367239 U JPS6367239 U JP S6367239U JP 16276486 U JP16276486 U JP 16276486U JP 16276486 U JP16276486 U JP 16276486U JP S6367239 U JPS6367239 U JP S6367239U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- fluid
- bernoulli chuck
- heating device
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
Description
第１図は、本考案に係る加熱装置の一実施例を
示す縦断側面図、第２図は上記加熱装置における
ベルヌーイチヤツクの流体噴出孔の形状変更例を
示す平面図である。第３図は在来の加熱装置を示
す縦断側面図である。
Ｗ……半導体ウエーハ、１０……テーブル、２
０……ベルヌーイチヤツク、２１……凹部、２２
……噴出孔（流体噴出孔）、３０……加熱手段、
４０……流体の加熱機構。
FIG. 1 is a longitudinal sectional side view showing an embodiment of the heating device according to the present invention, and FIG. 2 is a plan view showing an example of a modified shape of the Bernoullich fluid jet hole in the heating device. FIG. 3 is a longitudinal sectional side view showing a conventional heating device. W...Semiconductor wafer, 10...Table, 2
0...Bernoullich, 21...Recess, 22
...Ejection hole (fluid ejection hole), 30...Heating means,
40...Fluid heating mechanism.
Claims (1)
用により半導体ウエーハを非接触状態で浮上保持
するベルヌーイチヤツクと、 上記ベルヌーイチヤツクに供給する流体を予め
加熱する加熱機構を具備することを特徴とする加
熱装置。[Scope of Claim for Utility Model Registration] A table with a built-in heating means; a Bernoulli chuck formed on the top surface of the table to levitate and hold a semiconductor wafer in a non-contact state by means of a fluid jet; and a supply to the Bernoulli chuck. 1. A heating device comprising a heating mechanism for preheating a fluid to be heated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16276486U JPH0341461Y2 (en) | 1986-10-22 | 1986-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16276486U JPH0341461Y2 (en) | 1986-10-22 | 1986-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367239U true JPS6367239U (en) | 1988-05-06 |
| JPH0341461Y2 JPH0341461Y2 (en) | 1991-08-30 |
Family
ID=31090339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16276486U Expired JPH0341461Y2 (en) | 1986-10-22 | 1986-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341461Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0475328A (en) * | 1990-07-18 | 1992-03-10 | Toshiba Corp | Method and apparatus for treatment of semiconductor |
| JP2003530681A (en) * | 1999-03-08 | 2003-10-14 | エイエスエム・インターナシヨナル・エヌ・ブイ | Apparatus and method for rotating a wafer |
| JP2009088222A (en) * | 2007-09-28 | 2009-04-23 | Tokyo Electron Ltd | Substrate holding apparatus, substrate holding method, semiconductor manufacturing apparatus, and storage medium |
| KR20180127390A (en) * | 2016-03-18 | 2018-11-28 | 에이씨엠 리서치 (상하이) 인코포레이티드 | Substrate heat treatment apparatus |
-
1986
- 1986-10-22 JP JP16276486U patent/JPH0341461Y2/ja not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0475328A (en) * | 1990-07-18 | 1992-03-10 | Toshiba Corp | Method and apparatus for treatment of semiconductor |
| JP2003530681A (en) * | 1999-03-08 | 2003-10-14 | エイエスエム・インターナシヨナル・エヌ・ブイ | Apparatus and method for rotating a wafer |
| JP2009088222A (en) * | 2007-09-28 | 2009-04-23 | Tokyo Electron Ltd | Substrate holding apparatus, substrate holding method, semiconductor manufacturing apparatus, and storage medium |
| KR20180127390A (en) * | 2016-03-18 | 2018-11-28 | 에이씨엠 리서치 (상하이) 인코포레이티드 | Substrate heat treatment apparatus |
| CN109075102A (en) * | 2016-03-18 | 2018-12-21 | 盛美半导体设备（上海）有限公司 | Substrate annealing device |
| JP2019510375A (en) * | 2016-03-18 | 2019-04-11 | エーシーエム リサーチ （シャンハイ） インコーポレーテッド | Substrate heat treatment equipment |
| CN109075102B (en) * | 2016-03-18 | 2022-07-12 | 盛美半导体设备(上海)股份有限公司 | Substrate heat treatment apparatus |
| US11854842B2 (en) | 2016-03-18 | 2023-12-26 | Acm Research (Shanghai), Inc. | Substrate heat treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0341461Y2 (en) | 1991-08-30 |