JPS636726U - - Google Patents
Info
- Publication number
- JPS636726U JPS636726U JP1986100451U JP10045186U JPS636726U JP S636726 U JPS636726 U JP S636726U JP 1986100451 U JP1986100451 U JP 1986100451U JP 10045186 U JP10045186 U JP 10045186U JP S636726 U JPS636726 U JP S636726U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- rotating body
- semiconductor manufacturing
- manufacturing apparatus
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
Description
第１図はこの考案の半導体製造装置の一実施例
の構成を示す断面図、第２図は第１図の―線
の断面図、第３図は第１図の―線の断面図、
第４図はこの考案の半導体製造装置により洗浄薬
液を噴出する状態のときの断面図、第５図は従来
の半導体製造装置の構成を示す断面図である。
１……ウエハチヤツク、２……モータ、４……
ノズル、５……ウエハ、６……係合腕、７……係
合子、８……回転ノズル、９……係合穴、１０…
…薬液噴出口、１１……回転体、１２……パイプ
軸、１４……薬液パイプ、１５……回転体取付腕
。なお、図中同一符号は同一又は相当部分を示す
。
FIG. 1 is a cross-sectional view showing the configuration of an embodiment of the semiconductor manufacturing apparatus of this invention, FIG. 2 is a cross-sectional view taken along the line --- in FIG. 1, and FIG. 3 is a cross-sectional view taken along the -- line in FIG.
FIG. 4 is a cross-sectional view of the semiconductor manufacturing apparatus of this invention in a state in which a cleaning chemical is ejected, and FIG. 5 is a cross-sectional view showing the configuration of a conventional semiconductor manufacturing apparatus. 1... Wafer chuck, 2... Motor, 4...
Nozzle, 5... Wafer, 6... Engaging arm, 7... Engaging element, 8... Rotating nozzle, 9... Engaging hole, 10...
...Medical solution spout, 11...Rotating body, 12...Pipe shaft, 14...Medical solution pipe, 15...Rotating body mounting arm. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
ヤツク上に載置されたウエハにレジストを滴下し
遠心力によりレジスト薄膜を形成する半導体製造
装置において、上記ウエハの上部にウエハチヤツ
クと同期して回転する回転体を設けると共に、こ
の回転体にウエハの外周縁部に洗浄用薬液を噴出
する噴出口を設けたことを特徴とする半導体製造
装置。 (2) 回転体は、ウエハのオリフラ部が回転体の
特定位置と一致するための位置合わせ装置を有す
るものである実用新案登録請求の範囲第１項記載
の半導体製造装置。[Scope of Claim for Utility Model Registration] (1) In a semiconductor manufacturing device that includes a rotating wafer chuck and a wafer placed on the wafer, a resist is dropped onto the wafer to form a resist thin film using centrifugal force. A semiconductor manufacturing apparatus characterized in that a rotating body that rotates in synchronization is provided, and the rotating body is provided with a spout for spouting a cleaning chemical onto the outer peripheral edge of a wafer. (2) The semiconductor manufacturing apparatus according to claim 1, wherein the rotating body has a positioning device for aligning the orientation flat portion of the wafer with a specific position of the rotating body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986100451U JPS636726U (en) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986100451U JPS636726U (en) | 1986-06-30 | 1986-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS636726U true JPS636726U (en) | 1988-01-18 |
Family
ID=30970287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986100451U Pending JPS636726U (en) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636726U (en) |
-
1986
- 1986-06-30 JP JP1986100451U patent/JPS636726U/ja active Pending