JPS6367281U - - Google Patents
Info
- Publication number
- JPS6367281U JPS6367281U JP16168886U JP16168886U JPS6367281U JP S6367281 U JPS6367281 U JP S6367281U JP 16168886 U JP16168886 U JP 16168886U JP 16168886 U JP16168886 U JP 16168886U JP S6367281 U JPS6367281 U JP S6367281U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- group
- connector
- component group
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案による電子部品ユニツトの一実
施例の概略縦断面図、第２図はその概略横断面図
、第３図は従来の電子部品ユニツトの一部破断面
図である。
１……複数の電子部品、１ａ……第１の部品群
、１ｂ……第２の部品群、２……基板、５ａ……
第１の被覆部分、５ｂ……第２の被覆部分、５′
ｂ……第２の被覆部分の上面、６……コネクタ、
６ａ……コネクタの接続部分、Ｈ……所定の高さ
、ｈ１……第１の被覆部分の高さ寸法、ｈ２……
第２の被覆部分の高さ寸法。
FIG. 1 is a schematic vertical sectional view of an embodiment of an electronic component unit according to the present invention, FIG. 2 is a schematic cross-sectional view thereof, and FIG. 3 is a partially cutaway sectional view of a conventional electronic component unit. DESCRIPTION OF SYMBOLS 1... Multiple electronic components, 1a... 1st component group, 1b... 2nd component group, 2... Board, 5a...
First covering part, 5b...Second covering part, 5'
b...Top surface of the second covering part, 6...Connector,
6a...connection part of connector, H...predetermined height, h1 ...height dimension of first covering part, h2 ...
Height dimension of the second covered portion.
Claims (1)
び電子部品を樹脂によりモールド被覆して成る電
子部品ユニツトにおいて、前記複数の電子部品を
所定の高さを越える第１の部品群と、該所定の高
さに満たない第２の部品群とに区分して配置する
と共に、前記第２の部品群側に、該第２の部品群
より高い位置となるようにコネクタを実装し、前
記第１および第２の部品群にそれぞれ応じた高さ
寸法で前記モールド被覆による第１および第２の
被覆部分を形成して、前記コネクタの接続部分を
前記第２の被覆部分の上面から突出させたことを
特徴とする電子部品ユニツト。 In an electronic component unit in which a plurality of electronic components are mounted on a substrate, and the substrate and the electronic components are molded and coated with resin, a first component group that exceeds a predetermined height above the plurality of electronic components; A connector is mounted on the side of the second component group so as to be at a higher position than the second component group. and forming first and second covered portions of the molded coating with height dimensions corresponding to the second group of parts, respectively, and causing the connection portion of the connector to protrude from the upper surface of the second covered portion. An electronic component unit featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16168886U JPH0611535Y2 (en) | 1986-10-21 | 1986-10-21 | Electronic component unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16168886U JPH0611535Y2 (en) | 1986-10-21 | 1986-10-21 | Electronic component unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367281U true JPS6367281U (en) | 1988-05-06 |
| JPH0611535Y2 JPH0611535Y2 (en) | 1994-03-23 |
Family
ID=31088235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16168886U Expired - Lifetime JPH0611535Y2 (en) | 1986-10-21 | 1986-10-21 | Electronic component unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611535Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015156632A (en) * | 2014-01-15 | 2015-08-27 | 株式会社日立製作所 | Communication device and production method therefor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000328956A (en) | 1999-05-20 | 2000-11-28 | Honda Motor Co Ltd | Engine generator |
-
1986
- 1986-10-21 JP JP16168886U patent/JPH0611535Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015156632A (en) * | 2014-01-15 | 2015-08-27 | 株式会社日立製作所 | Communication device and production method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0611535Y2 (en) | 1994-03-23 |