JPS6384945U - - Google Patents

Info

Publication number
JPS6384945U
JPS6384945U JP1986180725U JP18072586U JPS6384945U JP S6384945 U JPS6384945 U JP S6384945U JP 1986180725 U JP1986180725 U JP 1986180725U JP 18072586 U JP18072586 U JP 18072586U JP S6384945 U JPS6384945 U JP S6384945U
Authority
JP
Japan
Prior art keywords
tool
tip
wire
wire bonding
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986180725U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986180725U priority Critical patent/JPS6384945U/ja
Publication of JPS6384945U publication Critical patent/JPS6384945U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａは本考案の超音波ワイヤボンデイング
装置用ツールを示す平面図、第１図ｂは同側面図
、第２図はツール先端の同断面図、第３図ａは従
来の超音波ワイヤボンデイング装置用ツールの平
面図、ｂは同側面図、第４図は第３図ｂに示すツ
ール先端の断面図、第５図は超音波ワイヤボンデ
イング装置の概略図、第６図ａは本考案の他の実
施例を示す平面図、ｂは同側面図、第７図はツー
ル先端の同断面図である。 １……ツール本体、２……ツール先端、２ａ…
…ツール先端底部、３……ツールの中心軸、４…
…ワイヤ案内孔、５……ワイヤ、６……ホーン、
７……クランパー、８……半導体素子、９……セ
ラミツクパツケージ、１０……ボンデイングリー
ド。

Claims (1)

    【実用新案登録請求の範囲】
  1. 振動子より発生する超音波振動及び荷重をワイ
    ヤに作用させて、ホーン先端部に垂架固定された
    ツールの先端底部によりワイヤボンドを行う超音
    波ワイヤボンデイング装置において、ツール本体
    の中心軸上にワイヤボンドを行うツール先端底部
    の中心を一致させたことを特徴とする超音波ワイ
    ヤボンデイング装置用ツール。
JP1986180725U 1986-11-25 1986-11-25 Pending JPS6384945U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986180725U JPS6384945U (ja) 1986-11-25 1986-11-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986180725U JPS6384945U (ja) 1986-11-25 1986-11-25

Publications (1)

Publication Number Publication Date
JPS6384945U true JPS6384945U (ja) 1988-06-03

Family

ID=31124942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986180725U Pending JPS6384945U (ja) 1986-11-25 1986-11-25

Country Status (1)

Country Link
JP (1) JPS6384945U (ja)

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