JPS6395252U - - Google Patents

Info

Publication number
JPS6395252U
JPS6395252U JP1986190764U JP19076486U JPS6395252U JP S6395252 U JPS6395252 U JP S6395252U JP 1986190764 U JP1986190764 U JP 1986190764U JP 19076486 U JP19076486 U JP 19076486U JP S6395252 U JPS6395252 U JP S6395252U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
gate array
chip
array integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986190764U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986190764U priority Critical patent/JPS6395252U/ja
Publication of JPS6395252U publication Critical patent/JPS6395252U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の１実施例であるゲートアレ
イ集積回路の平面図、第２図は従来のゲートアレ
イ集積回路の平面図である。 １……ゲートアレイチツプ、２，３，４……入
出力用ボンデイングパツド。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体基板の複数個の能動素子から成る基
    本セルを複数個配列し、集積してなるチツプに、
    必要に応じた配線パターンを施して所望の回路動
    作を実現するマスタスライス方式の半導体集積回
    路装置において、入出力用のボンデイングパツド
    を、上記チツプの端部周辺で、チツプの外周辺に
    対して平行となるように、かつ、上記基本セルを
    囲むように複数列にわたつて設け、多重配列とな
    るように配置したことを特徴とするゲートアレイ
    集積回路装置。 (2) 上記入出力用のボンデイングパツドを千鳥
    状に複数列配置したことを特徴とする実用新案登
    録請求の範囲第１項記載のゲートアレイ集積回路
    装置。
JP1986190764U 1986-12-11 1986-12-11 Pending JPS6395252U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986190764U JPS6395252U (ja) 1986-12-11 1986-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986190764U JPS6395252U (ja) 1986-12-11 1986-12-11

Publications (1)

Publication Number Publication Date
JPS6395252U true JPS6395252U (ja) 1988-06-20

Family

ID=31144288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986190764U Pending JPS6395252U (ja) 1986-12-11 1986-12-11

Country Status (1)

Country Link
JP (1) JPS6395252U (ja)

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