JPS6398653U - - Google Patents

Info

Publication number
JPS6398653U
JPS6398653U JP1986194762U JP19476286U JPS6398653U JP S6398653 U JPS6398653 U JP S6398653U JP 1986194762 U JP1986194762 U JP 1986194762U JP 19476286 U JP19476286 U JP 19476286U JP S6398653 U JPS6398653 U JP S6398653U
Authority
JP
Japan
Prior art keywords
metal substrates
insulating film
film
bent
conductive path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986194762U
Other languages
English (en)
Other versions
JPH0442938Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986194762U priority Critical patent/JPH0442938Y2/ja
Publication of JPS6398653U publication Critical patent/JPS6398653U/ja
Application granted granted Critical
Publication of JPH0442938Y2 publication Critical patent/JPH0442938Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例を示す断面図、第2図
乃至第5図は従来例の図である。 1……金属基板、2……絶縁フイルム、3……
剥離膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. 二枚の金属基板と、前記金属基板を離間して結
    合する絶縁フイルムと、前記フイルム上に設けた
    所望形状の導電路と、前記導電路上に固着される
    少なくとも発熱を有する複数の回路素子とを具備
    し、前記金属基板間の絶縁フイルムを折曲し前記
    回路素子が対向する様に配置した混成集積回路に
    おいて、前記絶縁フイルムが折り曲げされる二枚
    の金属基板の周端部に剥離膜を備えることを特徴
    とする混成集積回路。
JP1986194762U 1986-12-18 1986-12-18 Expired JPH0442938Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986194762U JPH0442938Y2 (ja) 1986-12-18 1986-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986194762U JPH0442938Y2 (ja) 1986-12-18 1986-12-18

Publications (2)

Publication Number Publication Date
JPS6398653U true JPS6398653U (ja) 1988-06-25
JPH0442938Y2 JPH0442938Y2 (ja) 1992-10-12

Family

ID=31152034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986194762U Expired JPH0442938Y2 (ja) 1986-12-18 1986-12-18

Country Status (1)

Country Link
JP (1) JPH0442938Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0420265U (ja) * 1990-06-13 1992-02-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0420265U (ja) * 1990-06-13 1992-02-20

Also Published As

Publication number Publication date
JPH0442938Y2 (ja) 1992-10-12

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