JPS62116545U - - Google Patents
Info
- Publication number
- JPS62116545U JPS62116545U JP438186U JP438186U JPS62116545U JP S62116545 U JPS62116545 U JP S62116545U JP 438186 U JP438186 U JP 438186U JP 438186 U JP438186 U JP 438186U JP S62116545 U JPS62116545 U JP S62116545U
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- insulating film
- conductive path
- metal substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
Ａ乃至第２図Ｃは本実施例の製造方法を示す断面
図、第３図は従来例を示す断面図である。 １，２……金属基板、３……絶縁フイルム、４
……導電路、５……回路素子、６……銅箔、７…
…外部リード、８……突出部。
Ａ乃至第２図Ｃは本実施例の製造方法を示す断面
図、第３図は従来例を示す断面図である。 １，２……金属基板、３……絶縁フイルム、４
……導電路、５……回路素子、６……銅箔、７…
…外部リード、８……突出部。
Claims (1)
- プレス打抜きで離間して配置した二枚の金属基
板と、該金属基板のプレス打抜面側に前記金属基
板を離間して結合する絶縁フイルムと、該フイル
ム上に設けた所望形状の導電路と、該導電路上に
固着される複数の回路素子とを具備し、両基板間
の絶縁フイルムを曲折して前記基板の反対主面を
接する様に配置することを特徴とする混成集積回
路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP438186U JPH0423321Y2 (ja) | 1986-01-16 | 1986-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP438186U JPH0423321Y2 (ja) | 1986-01-16 | 1986-01-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62116545U true JPS62116545U (ja) | 1987-07-24 |
| JPH0423321Y2 JPH0423321Y2 (ja) | 1992-05-29 |
Family
ID=30784995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP438186U Expired JPH0423321Y2 (ja) | 1986-01-16 | 1986-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423321Y2 (ja) |
-
1986
- 1986-01-16 JP JP438186U patent/JPH0423321Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423321Y2 (ja) | 1992-05-29 |