JPS6411539U - - Google Patents
Info
- Publication number
- JPS6411539U JPS6411539U JP1987103795U JP10379587U JPS6411539U JP S6411539 U JPS6411539 U JP S6411539U JP 1987103795 U JP1987103795 U JP 1987103795U JP 10379587 U JP10379587 U JP 10379587U JP S6411539 U JPS6411539 U JP S6411539U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- bump electrodes
- light transmission
- junctions
- melted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Electric Clocks (AREA)
- Wire Bonding (AREA)
Description
第１図から第４図はこの考案を電子腕時計に適
用した場合の一実施例を示し、第１図はその分解
斜視図、第２図ａ，ｂは液晶表示装置に電子部品
を取り付ける状態の分解斜視図、第３図は下側の
ガラス基板の延出部の要部拡大平面図、第４図は
ＩＣチツプを接合した状態のＡ−Ａ断面図、第５
図から第７図は光透過孔の各変形例を示す図であ
る。 ３ａ，３ｂ，２０ａ，２１ａ，２２ａ……ガラ
ス基板、３ｄ，２０，２１，２２……配線パター
ン、３ｄ１，２０ｄ，２１ｄ，２２ｃ……光透過
孔、６……半導体チツプ、６ａ……半田バンプ。
用した場合の一実施例を示し、第１図はその分解
斜視図、第２図ａ，ｂは液晶表示装置に電子部品
を取り付ける状態の分解斜視図、第３図は下側の
ガラス基板の延出部の要部拡大平面図、第４図は
ＩＣチツプを接合した状態のＡ−Ａ断面図、第５
図から第７図は光透過孔の各変形例を示す図であ
る。 ３ａ，３ｂ，２０ａ，２１ａ，２２ａ……ガラ
ス基板、３ｄ，２０，２１，２２……配線パター
ン、３ｄ１，２０ｄ，２１ｄ，２２ｃ……光透過
孔、６……半導体チツプ、６ａ……半田バンプ。
Claims (1)
- バンプ電極を有する半導体素子と、この半導体
素子のバンプ電極が光線により溶融する電極パタ
ーンの接合箇所に光透過孔が形成された透明基板
とからなる半導体素子の取付構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987103795U JPH0517884Y2 (ja) | 1987-07-08 | 1987-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987103795U JPH0517884Y2 (ja) | 1987-07-08 | 1987-07-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411539U true JPS6411539U (ja) | 1989-01-20 |
| JPH0517884Y2 JPH0517884Y2 (ja) | 1993-05-13 |
Family
ID=31334944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987103795U Expired - Lifetime JPH0517884Y2 (ja) | 1987-07-08 | 1987-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517884Y2 (ja) |
-
1987
- 1987-07-08 JP JP1987103795U patent/JPH0517884Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517884Y2 (ja) | 1993-05-13 |