JPS641246A - Gate pattern - Google Patents

Gate pattern

Info

Publication number
JPS641246A
JPS641246A JP62157056A JP15705687A JPS641246A JP S641246 A JPS641246 A JP S641246A JP 62157056 A JP62157056 A JP 62157056A JP 15705687 A JP15705687 A JP 15705687A JP S641246 A JPS641246 A JP S641246A
Authority
JP
Japan
Prior art keywords
pattern
pad
gate pattern
pectinated
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62157056A
Other languages
English (en)
Other versions
JPH011246A (ja
Inventor
Takayuki Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62-157056A priority Critical patent/JPH011246A/ja
Priority claimed from JP62-157056A external-priority patent/JPH011246A/ja
Publication of JPS641246A publication Critical patent/JPS641246A/ja
Publication of JPH011246A publication Critical patent/JPH011246A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/942—Dispositions of bond pads relative to underlying supporting features, e.g. bond pads, RDLs or vias

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)
JP62-157056A 1987-06-23 ゲ−トパタ−ン Pending JPH011246A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62-157056A JPH011246A (ja) 1987-06-23 ゲ−トパタ−ン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62-157056A JPH011246A (ja) 1987-06-23 ゲ−トパタ−ン

Publications (2)

Publication Number Publication Date
JPS641246A true JPS641246A (en) 1989-01-05
JPH011246A JPH011246A (ja) 1989-01-05

Family

ID=

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