JPS6415949A - Semiconductor integrated circuit for audio amplification - Google Patents

Semiconductor integrated circuit for audio amplification

Info

Publication number
JPS6415949A
JPS6415949A JP62172247A JP17224787A JPS6415949A JP S6415949 A JPS6415949 A JP S6415949A JP 62172247 A JP62172247 A JP 62172247A JP 17224787 A JP17224787 A JP 17224787A JP S6415949 A JPS6415949 A JP S6415949A
Authority
JP
Japan
Prior art keywords
ground
amplifier section
circuit
section
ground wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62172247A
Other languages
Japanese (ja)
Inventor
Hitoshi Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba AVE Co Ltd
Original Assignee
Toshiba Corp
Toshiba Audio Video Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Audio Video Engineering Co Ltd filed Critical Toshiba Corp
Priority to JP62172247A priority Critical patent/JPS6415949A/en
Publication of JPS6415949A publication Critical patent/JPS6415949A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the distortion rate characteristic and oscillation stability by making the ground wirings on an IC substrate independent in the first-stage amplifier section, the output amplifier section and other circuit sections, respectively, thereby minimizing the inter-circuit effect. CONSTITUTION:The ground wirings of an IC are divided into the input circuit side including the first-stage amplifier section on the IC substrate and the output amplifier section, and the ground wirings at the input circuit side are divided into a first ground wiring 2 connected only to the first-stage amplifier section 1 and a second ground wiring 5 connected to other small signal system circuit section 3 and a subextraction circuit section 4 at the input circuit side. The first ground wiring 2 and the second ground wiring 5 are respectively connected to different ground pads 6, 7, and commonly connected to one lead frame 10 via bonding wires 8, 9. Since the ground wiring 2 connected to the first-stage amplifier section 1 and the ground wiring 5 are isolated, the ground of the first-stage amplifier section 1 does not rise because of the current of the small signal system circuit section 3 and the voltage drop related to the subextraction circuit 4.
JP62172247A 1987-07-10 1987-07-10 Semiconductor integrated circuit for audio amplification Pending JPS6415949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62172247A JPS6415949A (en) 1987-07-10 1987-07-10 Semiconductor integrated circuit for audio amplification

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62172247A JPS6415949A (en) 1987-07-10 1987-07-10 Semiconductor integrated circuit for audio amplification

Publications (1)

Publication Number Publication Date
JPS6415949A true JPS6415949A (en) 1989-01-19

Family

ID=15938348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62172247A Pending JPS6415949A (en) 1987-07-10 1987-07-10 Semiconductor integrated circuit for audio amplification

Country Status (1)

Country Link
JP (1) JPS6415949A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0905776A1 (en) * 1997-09-29 1999-03-31 STMicroelectronics SA Semiconductor device comprising two ground contact pads connected to a ground connection lead and testing procedure for the device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0905776A1 (en) * 1997-09-29 1999-03-31 STMicroelectronics SA Semiconductor device comprising two ground contact pads connected to a ground connection lead and testing procedure for the device
FR2769131A1 (en) * 1997-09-29 1999-04-02 St Microelectronics Sa SEMICONDUCTOR DEVICE HAVING TWO GROUND CONNECTION POINTS CONNECTED TO A GROUND CONNECTION LEG AND METHOD FOR TESTING SUCH A DEVICE

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