JPS6417432A - Etching method for semiconductor wafer - Google Patents
Etching method for semiconductor waferInfo
- Publication number
- JPS6417432A JPS6417432A JP17369087A JP17369087A JPS6417432A JP S6417432 A JPS6417432 A JP S6417432A JP 17369087 A JP17369087 A JP 17369087A JP 17369087 A JP17369087 A JP 17369087A JP S6417432 A JPS6417432 A JP S6417432A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wax
- etched
- semiconductor wafer
- etching method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Landscapes
- Weting (AREA)
Abstract
PURPOSE:To prevent a surface of a wafer from being distorted and scarred, by protecting a rear of a surface, which is required to be etched, from an etching solution at the time of etching. CONSTITUTION:A wafer 1 is stuck on a wafer sticking plate 2 by the use of wax 3. The whole of the plate 2, on which the wafer 1 is stuck by the use of the wax 3, is dipped into an etching solution 5 in a Petri dish 4 and etched, and next the wafer 1 is peeled from the plate 2. Since a rear of the wafer 1 is covered with the wax 3 and protected so that the etching solution 5 does not invade the rear of the wafer 1, the rear is not etched and dimensional precision is not deteriorated. The surface of the wafer 1 can be hence prevented from being distorted and scarred.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17369087A JPS6417432A (en) | 1987-07-10 | 1987-07-10 | Etching method for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17369087A JPS6417432A (en) | 1987-07-10 | 1987-07-10 | Etching method for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6417432A true JPS6417432A (en) | 1989-01-20 |
Family
ID=15965302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17369087A Pending JPS6417432A (en) | 1987-07-10 | 1987-07-10 | Etching method for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6417432A (en) |
-
1987
- 1987-07-10 JP JP17369087A patent/JPS6417432A/en active Pending
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