JPS6420740U - - Google Patents
Info
- Publication number
- JPS6420740U JPS6420740U JP1987115961U JP11596187U JPS6420740U JP S6420740 U JPS6420740 U JP S6420740U JP 1987115961 U JP1987115961 U JP 1987115961U JP 11596187 U JP11596187 U JP 11596187U JP S6420740 U JPS6420740 U JP S6420740U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation case
- circuit board
- power semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案に係る電力半導体装置の一実施
例、また第２図は従来例を示し、夫々ａは斜視図
、ｂは断面図、ｃは上面図である。 ２……回路基板、３……半導体チツプ、４……
入出力端子、５……注型樹脂、６……放熱ケース
。
例、また第２図は従来例を示し、夫々ａは斜視図
、ｂは断面図、ｃは上面図である。 ２……回路基板、３……半導体チツプ、４……
入出力端子、５……注型樹脂、６……放熱ケース
。
Claims (1)
- 高熱伝導性の放熱ケースと、半導体チツプ及び
入出力端子を装着した回路基板とを備え、該基板
が前記放熱ケース内に挿入され注型樹脂で封止さ
れてなる電力半導体装置において、前記放熱ケー
スの内面に複数の凹凸を設けたことを特徴とする
電力半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115961U JPS6420740U (ja) | 1987-07-29 | 1987-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115961U JPS6420740U (ja) | 1987-07-29 | 1987-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420740U true JPS6420740U (ja) | 1989-02-01 |
Family
ID=31358082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987115961U Pending JPS6420740U (ja) | 1987-07-29 | 1987-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420740U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02131350U (ja) * | 1989-04-05 | 1990-10-31 |
-
1987
- 1987-07-29 JP JP1987115961U patent/JPS6420740U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02131350U (ja) * | 1989-04-05 | 1990-10-31 |