JPS6422037U - - Google Patents
Info
- Publication number
- JPS6422037U JPS6422037U JP11744987U JP11744987U JPS6422037U JP S6422037 U JPS6422037 U JP S6422037U JP 11744987 U JP11744987 U JP 11744987U JP 11744987 U JP11744987 U JP 11744987U JP S6422037 U JPS6422037 U JP S6422037U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- marking
- resin layer
- view
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000005011 phenolic resin Substances 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、この考案の一実施例を示す半導体装
置の斜視図、第２図は、同実施例半導体装置の断
面図、第３図は、標印用フエノール樹脂層を形成
する状態を示す要部拡大斜視図、第４図は、従来
の半導体装置を示す断面図である。
１：集積回路本体、２：エポキシ樹脂モールド
、３：標印用フエノール樹脂層、４：標印部。
Fig. 1 is a perspective view of a semiconductor device showing an embodiment of this invention, Fig. 2 is a sectional view of the semiconductor device of the same embodiment, and Fig. 3 shows a state in which a phenolic resin layer for marking is formed. FIG. 4, an enlarged perspective view of a main part, is a sectional view showing a conventional semiconductor device. 1: Integrated circuit main body, 2: Epoxy resin mold, 3: Phenol resin layer for marking, 4: Marking portion.
Claims (1)
て、 前記樹脂カバーの表面に、標印用のフエノール
樹脂層を配備したことを特徴とする電子部品。[Claims for Utility Model Registration] An electronic component in which an electronic circuit portion is covered with a resin, characterized in that a phenolic resin layer for marking is provided on the surface of the resin cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11744987U JPH041736Y2 (en) | 1987-07-30 | 1987-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11744987U JPH041736Y2 (en) | 1987-07-30 | 1987-07-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6422037U true JPS6422037U (en) | 1989-02-03 |
| JPH041736Y2 JPH041736Y2 (en) | 1992-01-21 |
Family
ID=31360918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11744987U Expired JPH041736Y2 (en) | 1987-07-30 | 1987-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH041736Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05306568A (en) * | 1992-04-30 | 1993-11-19 | Tostem Sera Kk | Fit-in connecting metal siding |
-
1987
- 1987-07-30 JP JP11744987U patent/JPH041736Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05306568A (en) * | 1992-04-30 | 1993-11-19 | Tostem Sera Kk | Fit-in connecting metal siding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH041736Y2 (en) | 1992-01-21 |
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