JPS6424838U - - Google Patents
Info
- Publication number
- JPS6424838U JPS6424838U JP1987118406U JP11840687U JPS6424838U JP S6424838 U JPS6424838 U JP S6424838U JP 1987118406 U JP1987118406 U JP 1987118406U JP 11840687 U JP11840687 U JP 11840687U JP S6424838 U JPS6424838 U JP S6424838U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lead portion
- chip
- circuit board
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Description
図面は本考案の一実施例を示し、第１図は回路
基板の平面図で一部切欠部して示し、第２図は第
１図の２―２拡大断面図、第３図は樹脂液を適下
してＩＣチツプとボンデイング用線とリード部の
外周面に被膜を形成する際の説明図であり、第４
図は従来の回路基板の中央縦断面図である。 尚、図中、基板……１、ＩＣチツプ……３、導
線……４、リード部……４ａ、ボンデイング用線
……５、被膜……６とする。
基板の平面図で一部切欠部して示し、第２図は第
１図の２―２拡大断面図、第３図は樹脂液を適下
してＩＣチツプとボンデイング用線とリード部の
外周面に被膜を形成する際の説明図であり、第４
図は従来の回路基板の中央縦断面図である。 尚、図中、基板……１、ＩＣチツプ……３、導
線……４、リード部……４ａ、ボンデイング用線
……５、被膜……６とする。
Claims (1)
- 基板上に搭載されたＩＣチツプと、基板上に配
設された導線のリード部と、該チツプとリード部
間とに渉つてループ状に接続されたボンデイング
用線との夫々の外周面に沿つて、絶縁性樹脂から
なる被膜を形成したことを特徴とする回路基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118406U JPS6424838U (ja) | 1987-07-31 | 1987-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118406U JPS6424838U (ja) | 1987-07-31 | 1987-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424838U true JPS6424838U (ja) | 1989-02-10 |
Family
ID=31362738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987118406U Pending JPS6424838U (ja) | 1987-07-31 | 1987-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424838U (ja) |
-
1987
- 1987-07-31 JP JP1987118406U patent/JPS6424838U/ja active Pending