JPS6425430A - Probe device - Google Patents
Probe deviceInfo
- Publication number
- JPS6425430A JPS6425430A JP62181758A JP18175887A JPS6425430A JP S6425430 A JPS6425430 A JP S6425430A JP 62181758 A JP62181758 A JP 62181758A JP 18175887 A JP18175887 A JP 18175887A JP S6425430 A JPS6425430 A JP S6425430A
- Authority
- JP
- Japan
- Prior art keywords
- measured
- wafer
- peripheral edge
- chip
- stored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 abstract 5
- 230000002093 peripheral effect Effects 0.000 abstract 4
- 230000002950 deficient Effects 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 abstract 1
- 238000003909 pattern recognition Methods 0.000 abstract 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To automatically set a probe area by comparing normal semiconductor chip information stored in advance with a semiconductor chip formed on the peripheral edge of a semiconductor wafer, selecting the chip to be measured on the basis of the comparison result to be stored. CONSTITUTION:A normal semiconductor chip to be measured by a probe is imaged by a TC camera 11 and stored with the imaging output as a reference value. Then, a semiconductor chip formed on the peripheral edge of a wafer 1 is imaged by the camera 11, the output is compared with the reference value information by pattern recognition to judge it whether it is good or not. This comparison test is conducted for the chip at the peripheral edge of the wafer 2, a boundary between defective a product and a nondefective product is set, and the position of the chip disposed on the boundary is stored. Thus, the improper chip formed on the peripheral edge of the wafer is removed in advance from an object to be measured, and a probe area to become an object to be measured is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62181758A JPS6425430A (en) | 1987-07-21 | 1987-07-21 | Probe device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62181758A JPS6425430A (en) | 1987-07-21 | 1987-07-21 | Probe device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6425430A true JPS6425430A (en) | 1989-01-27 |
Family
ID=16106373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62181758A Pending JPS6425430A (en) | 1987-07-21 | 1987-07-21 | Probe device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6425430A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57196530A (en) * | 1981-05-28 | 1982-12-02 | Fujitsu Ltd | Inspection of pattern |
| JPS6010716A (en) * | 1983-06-30 | 1985-01-19 | Nec Home Electronics Ltd | Method for testing semiconductor wafer |
| JPS6132437A (en) * | 1984-07-24 | 1986-02-15 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
| JPS61171146A (en) * | 1985-01-25 | 1986-08-01 | Toshiba Corp | Sensor for measuring electrical characteristic |
| JPS61176130A (en) * | 1985-01-31 | 1986-08-07 | Nec Corp | Wafer prober |
-
1987
- 1987-07-21 JP JP62181758A patent/JPS6425430A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57196530A (en) * | 1981-05-28 | 1982-12-02 | Fujitsu Ltd | Inspection of pattern |
| JPS6010716A (en) * | 1983-06-30 | 1985-01-19 | Nec Home Electronics Ltd | Method for testing semiconductor wafer |
| JPS6132437A (en) * | 1984-07-24 | 1986-02-15 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
| JPS61171146A (en) * | 1985-01-25 | 1986-08-01 | Toshiba Corp | Sensor for measuring electrical characteristic |
| JPS61176130A (en) * | 1985-01-31 | 1986-08-07 | Nec Corp | Wafer prober |
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