JPS6425565A - Semiconductor device and manufacture thereof - Google Patents
Semiconductor device and manufacture thereofInfo
- Publication number
- JPS6425565A JPS6425565A JP62182516A JP18251687A JPS6425565A JP S6425565 A JPS6425565 A JP S6425565A JP 62182516 A JP62182516 A JP 62182516A JP 18251687 A JP18251687 A JP 18251687A JP S6425565 A JPS6425565 A JP S6425565A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- forming
- insulating
- mesa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
PURPOSE:To reduce the junction capacitance between a base and a collector and to make it possible to perform high speed operation, by sequentially forming a first- conductivity type first layer, a second-conductivity type second layer and a first- conductivity type third layer, selectively etching the third layer in an inverted taper shape, forming a mesa having an overhang part, forming a semi-insulating fourth layer selectively on the side surface, and forming an ohmic electrode for each layer. CONSTITUTION:On a semi-insulating InP substrate 1, an N-type InP layer 2, a P-type InGaAsP layer 3 and an N-type InP layer 4 are sequentially grown by an epitaxial method. An insulating film 10 is selectively formed by an ordinary insulating film step, a photolithography step and an etching step. With the film as a mask, the N-type InP layer 4 is etched to the intermediate part. The etching shape is made to be an inverted taper shape. An overhang part 11 is formed, and a mesa is formed. Then, a semi-insulating InP layer is formed on the side surface of the mesa by mass transport. Thereafter, Au and Zn are evaporated on the entire surface as a base electrode. The insulating film 10 is removed by a lift-off step. A base electrode 8 is formed only on the P-type InGaAsP layer 3. Thus, the interval between the N-type InP layer 4 and the base electrode 8 can be made very short.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62182516A JPS6425565A (en) | 1987-07-22 | 1987-07-22 | Semiconductor device and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62182516A JPS6425565A (en) | 1987-07-22 | 1987-07-22 | Semiconductor device and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6425565A true JPS6425565A (en) | 1989-01-27 |
Family
ID=16119665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62182516A Pending JPS6425565A (en) | 1987-07-22 | 1987-07-22 | Semiconductor device and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6425565A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0290626A (en) * | 1988-09-28 | 1990-03-30 | Nec Corp | Manufacturing method of semiconductor device |
-
1987
- 1987-07-22 JP JP62182516A patent/JPS6425565A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0290626A (en) * | 1988-09-28 | 1990-03-30 | Nec Corp | Manufacturing method of semiconductor device |
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